Invention Application
- Patent Title: RIBBON BONDING IN AN ELECTRONIC PACKAGE
- Patent Title (中): RIBBON在电子包中绑定
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Application No.: US13750741Application Date: 2013-01-25
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Publication No.: US20130134577A1Publication Date: 2013-05-30
- Inventor: Christoph B. Luechinger
- Applicant: Christoph B. Luechinger
- Main IPC: H01L23/498
- IPC: H01L23/498
Abstract:
A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.
Public/Granted literature
- US08685791B2 Ribbon bonding in an electronic package Public/Granted day:2014-04-01
Information query
IPC分类:
