公开(公告)号：US09966356B2

公开(公告)日：2018-05-08

申请号：US15489958

申请日：2017-04-18

Applicant: The Goverment of the United States of America, as represented by the Secretary of the Navy

Inventor： Scott A. Mathews ,  Iyoel Beniam ,  Alberto Piqué

IPC: H01L21/44 ,  H01L23/00 ,  H01L21/48 ,  H01L21/768

CPC classification number: H01L24/48 ,  H01L21/4828 ,  H01L21/76885 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/29147 ,  H01L2224/43001 ,  H01L2224/435 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/4805 ,  H01L2224/48101 ,  H01L2224/4814 ,  H01L2224/48472 ,  H01L2224/85039 ,  H01L2224/8584 ,  H01L2224/8585 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.

公开(公告)号：US09236166B2

公开(公告)日：2016-01-12

申请号：US13811419

申请日：2011-07-18

Applicant: Eugen Milke ,  Jürgen Dick ,  Peter Prenosil ,  Frank-Werner Wulff ,  Poh Yoong Kong

Inventor： Eugen Milke ,  Jürgen Dick ,  Peter Prenosil ,  Frank-Werner Wulff

IPC: H01B5/02 ,  H01L23/00 ,  B21F45/00

CPC classification number: H01B5/02 ,  B21F45/00 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/4321 ,  H01L2224/4381 ,  H01L2224/43825 ,  H01L2224/43826 ,  H01L2224/43847 ,  H01L2224/43848 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45686 ,  H01L2224/45687 ,  H01L2224/85001 ,  H01L2224/85207 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2224/45164 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/01083 ,  H01L2924/01049

Abstract: A bonding wire is provided containing a wire core made of a first material containing a metal and a wire jacket that envelopes the wire core and is made of a second material containing a metal. The wire core and the wire jacket are made of different metals and the bonding wire has an aspect ratio of no more than 0.8. The bonding wire efficiently prevents damage to bonding surfaces during the bonding process and short-circuiting during the use of corresponding sub-assemblies.

Abstract translation: 提供了一种接合线，其包含由包含金属的第一材料制成的线芯和包围线芯的线夹套，并且由包含金属的第二材料制成。 线芯和电线护套由不同的金属制成，接合线的纵横比不大于0.8。 接合线在使用相应的子组件期间有效地防止在接合过程中的接合表面的损坏和短路。

公开(公告)号：US20150334831A1

公开(公告)日：2015-11-19

申请号：US14809570

申请日：2015-07-27

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Terrence Caskey ,  Reynaldo Co ,  Ellis Chau

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/11 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/528 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14135 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15322 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0298 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/10515 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

Abstract: A structure may include bond elements having bases joined to conductive elements at a first portion of a first surface and end surfaces remote from the substrate. A dielectric encapsulation element may overlie and extend from the first portion and fill spaces between the bond elements to separate the bond elements from one another. The encapsulation element has a third surface facing away from the first surface. Unencapsulated portions of the bond elements are defined by at least portions of the end surfaces uncovered by the encapsulation element at the third surface. The encapsulation element at least partially defines a second portion of the first surface that is other than the first portion and has an area sized to accommodate an entire area of a microelectronic element. Some conductive elements are at the second portion and configured for connection with such microelectronic element.

公开(公告)号：US20150279791A1

公开(公告)日：2015-10-01

申请号：US14618328

申请日：2015-02-10

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Keiju YAMADA

IPC: H01L23/66 ,  H01L23/64 ,  H01L23/498

CPC classification number: H01L23/645 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/206

Abstract: According to one embodiment, a semiconductor device includes a part or entirety of a switching power supply, at least one semiconductor element, and at least one line composed of a inner conductor and a soft magnetic member sheathing the inner conductor. The semiconductor device further includes, for example, a circuit substrate on which the part or entirety of the switching power supply and the semiconductor elements are mounted. The lines are mounted on the circuit substrate.

Abstract translation: 根据一个实施例，半导体器件包括开关电源的一部分或全部，至少一个半导体元件，以及由内部导体和包围内部导体的软磁性构件组成的至少一条线。 半导体器件还包括例如其上安装有开关电源和半导体元件的一部分或全部的电路基板。 线路安装在电路基板上。

公开(公告)号：US20140264783A1

公开(公告)日：2014-09-18

申请号：US13802687

申请日：2013-03-13

Applicant: Altera Corporation

Inventor： Hui Liu ,  Shi Hong ,  Yuanlin Xie ,  Xiaohong Jiang

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/45012 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/45572 ,  H01L2224/45624 ,  H01L2224/45647 ,  H01L2224/45686 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73257 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/014 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An apparatus includes a substrate that includes electronic circuitry. The apparatus further includes a first die that includes electronic circuitry, and at least one shielded interconnect. The shielded interconnect(s) couple(s) electronic circuitry in the substrate to electronic circuitry in the first die.

Abstract translation: 一种装置包括包括电子电路的基板。 该装置还包括包括电子电路的第一管芯和至少一个屏蔽互连。 衬底中的屏蔽互连（一个或多个）电子电路耦合到第一裸片中的电子电路。

公开(公告)号：US20100107717A1

公开(公告)日：2010-05-06

申请号：US12562556

申请日：2009-09-18

Applicant: Matthias Lehr ,  Frank Kuechenmeister ,  Frank Seliger

Inventor： Matthias Lehr ,  Frank Kuechenmeister ,  Frank Seliger

IPC: B21C1/00

CPC classification number: B21C3/02 ,  B21C3/04 ,  H01L24/43 ,  H01L24/45 ,  H01L24/745 ,  H01L2224/05624 ,  H01L2224/4321 ,  H01L2224/43847 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/745 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2924/00015

Abstract: Bonding wires for sophisticated bonding applications may be efficiently formed on the basis of a corresponding template device that may be formed on the basis of semiconductor material, such as silicon, in combination with associated fabrication techniques, such as lithography and etch techniques. Hence, any appropriate diameter and cross-sectional shape may be obtained with a high degree of accuracy and reliability.

Abstract translation: 可以基于可以基于诸如硅的半导体材料形成的相应的模板装置，结合相关的制造技术，例如光刻和蚀刻技术，有效地形成用于复杂粘合应用的粘合线。 因此，可以以高精度和可靠性获得任何适当的直径和横截面形状。

公开(公告)号：US20080197461A1

公开(公告)日：2008-08-21

申请号：US11706193

申请日：2007-02-15

Applicant: Chen-Hua Yu ,  Hui-Lin Chang ,  Yung-Cheng Lu ,  Mirng-Ji Lii ,  Yung-Ching Chen

Inventor： Chen-Hua Yu ,  Hui-Lin Chang ,  Yung-Cheng Lu ,  Mirng-Ji Lii ,  Yung-Ching Chen

IPC: H01L21/60 ,  B23K37/00 ,  H01L23/495

CPC classification number: H01L23/4952 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/45012 ,  H01L2224/45013 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4516 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49175 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/20751 ,  H01L2924/00 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An apparatus for wire bonding and a capillary tool thereof are provided. An exemplary embodiment of a capillary tool capable of a wire bonding comprises a body having a first internal channel of a first diameter for accommodating a flow of a conductive wire. A compressible head is connected to the body, having a second internal channel of a second diameter for accommodating the flow of the conductive wire, wherein the first diameter is fixed and the second diameter is variable, the second diameter is not more than the first diameter and a diameter the conductive wire flowed through the compressible head is adjustable. An integrated circuit (IC) package is also provided.

Abstract translation: 提供一种用于引线接合的装置及其毛细管工具。 能够引线接合的毛细管工具的示例性实施例包括具有用于容纳导线流动的第一直径的第一内部通道的主体。 可压缩头连接到主体，具有用于容纳导线流动的第二直径的第二内部通道，其中第一直径是固定的，第二直径是可变的，第二直径不大于第一直径 并且流过可压缩头的导线的直径是可调节的。 还提供集成电路（IC）封装。

公开(公告)号：US5045410A

公开(公告)日：1991-09-03

申请号：US375968

申请日：1989-07-03

Applicant: Heinz G. Hiesbock ,  Karl Bartl

Inventor： Heinz G. Hiesbock ,  Karl Bartl

IPC: B23K35/02 ,  B23K35/14 ,  B32B15/01

CPC classification number: H01L24/45 ,  B23K35/0222 ,  B32B15/01 ,  H01L2224/45012 ,  H01L2224/45111 ,  H01L2224/45147 ,  H01L2224/45163 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45611 ,  H01L2224/45616 ,  H01L2224/45655 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  Y10S428/929 ,  Y10T428/12694 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/1291

Abstract: A band-shaped and/or filamentary material, having a phosphorus containing metal and/or metal alloy inner layer such as phosphor bronze, deoxidized copper or other similar phosphorus containing material, and a lead alloy outer layer, particularly a lead-tin alloy, wherein the phosphorus content of the inner layer is between 0.03 and 0.13 weight percent. In the preferred embodiment, the amount of phosphorus in the inner layer is between 0.05 and 0.06 weight percent. Electrical conductors and electronic components of this band-shaped and/or filamentary material are also disclosed.

Abstract translation: 具有含磷金属和/或金属合金内层如磷青铜，脱氧铜或其它类似含磷材料的带状和/或丝状材料，以及铅合金外层，特别是铅锡合金， 其中内层的磷含量在0.03至0.13重量％之间。 在优选实施方案中，内层中的磷的量为0.05至0.06重量％。 还公开了该带状和/或丝状材料的电导体和电子部件。

公开(公告)号：US20170221851A1

公开(公告)日：2017-08-03

申请号：US15489958

申请日：2017-04-18

Applicant: The Government of the United States of America, as represented by the Secretary of the Navy

Inventor： Scott A. Mathews ,  Iyoel Beniam ,  Alberto Piqué

IPC: H01L23/00 ,  H01L21/768 ,  H01L21/48

CPC classification number: H01L24/48 ,  H01L21/4828 ,  H01L21/76885 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/29147 ,  H01L2224/43001 ,  H01L2224/435 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/4805 ,  H01L2224/48101 ,  H01L2224/4814 ,  H01L2224/48472 ,  H01L2224/85039 ,  H01L2224/8584 ,  H01L2224/8585 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.

公开(公告)号：US09615456B2

公开(公告)日：2017-04-04

申请号：US14809570

申请日：2015-07-27

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Terrence Caskey ,  Reynaldo Co ,  Ellis Chau

IPC: H05K1/09 ,  H05K1/11 ,  H01L23/528 ,  H05K1/02 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H05K1/18 ,  H01L25/03 ,  H01L21/56 ,  H01L23/00

CPC classification number: H05K1/11 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/528 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14135 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15322 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0298 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/10515 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

Abstract: A structure may include bond elements having bases joined to conductive elements at a first portion of a first surface and end surfaces remote from the substrate. A dielectric encapsulation element may overlie and extend from the first portion and fill spaces between the bond elements to separate the bond elements from one another. The encapsulation element has a third surface facing away from the first surface. Unencapsulated portions of the bond elements are defined by at least portions of the end surfaces uncovered by the encapsulation element at the third surface. The encapsulation element at least partially defines a second portion of the first surface that is other than the first portion and has an area sized to accommodate an entire area of a microelectronic element. Some conductive elements are at the second portion and configured for connection with such microelectronic element.