公开(公告)号：US08485418B2

公开(公告)日：2013-07-16

申请号：US12942709

申请日：2010-11-09

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: B23K31/02

CPC classification number: B23K20/004 ,  B23K2101/40 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85099 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/013 ,  H01L2924/00013

Abstract: Contact structures exhibiting resilience or compliance for a variety of electronic components are formed. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a “temporary” (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing.

Abstract translation: 形成表现出各种电子部件的弹性或顺应性的接触结构。 公开了用于线杆（用作脚手架）和外套（用作脚手架上的上部结构）的各种材料。 描述了用于将接触结构安装到各种电子部件（例如，半导体晶片和管芯，半导体封装，插入件，互连衬底等）的各种技术，并且描述了各种工艺顺序。 本文所述的弹性接触结构对于进行诸如半导体管芯的电子部件的“临时”（探针）连接是理想的，用于老化和功能测试。

公开(公告)号：US08313015B2

公开(公告)日：2012-11-20

申请号：US13272664

申请日：2011-10-13

Applicant: Gary S. Gillotti ,  Stanley Szczesniak ,  Peter J. Van Emmerik

Inventor： Gary S. Gillotti ,  Stanley Szczesniak ,  Peter J. Van Emmerik

IPC: B23K1/06 ,  B23K35/00 ,  B23K37/00

CPC classification number: H01L24/85 ,  B23K20/007 ,  B23K2101/42 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.

Abstract translation: 提供引线接合机。 引线接合机包括接合工具和用于在延伸穿过接合工具的线的端部上形成自由空气球的电极，其中自由空气球形成在引线接合机的自由空气球形成区域。 引线接合机还包括用于在引线接合操作期间保持半导体器件的接合位置区域。 引线接合机还包括气体输送机构，其构造成提供覆盖气体以：（1）粘结位置区域，由此覆盖气体通过气体输送机构的至少一个孔被喷射到粘结位置区域，和（2 ）自由空气球形成区域。

公开(公告)号：US20120031877A1

公开(公告)日：2012-02-09

申请号：US13272664

申请日：2011-10-13

Applicant: Gary S. Gillotti ,  Stanley Szczesniak ,  Peter J. Van Emmerik

Inventor： Gary S. Gillotti ,  Stanley Szczesniak ,  Peter J. Van Emmerik

IPC: B23K11/00

CPC classification number: H01L24/85 ,  B23K20/007 ,  B23K2101/42 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.

Abstract translation: 提供引线接合机。 引线接合机包括接合工具和用于在延伸穿过接合工具的线的端部上形成自由空气球的电极，其中自由空气球形成在引线接合机的自由空气球形成区域。 引线接合机还包括用于在引线接合操作期间保持半导体器件的接合位置区域。 引线接合机还包括气体输送机构，其构造成提供覆盖气体以：（1）粘结位置区域，由此覆盖气体通过气体输送机构的至少一个孔被喷射到粘结位置区域，和（2 ）自由空气球形成区域。

公开(公告)号：US08076786B2

公开(公告)日：2011-12-13

申请号：US12501693

申请日：2009-07-13

Applicant: Chang Ying Hung ,  Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Jian Cheng Chen ,  Wei Chi Yih ,  Ho Ming Tong

Inventor： Chang Ying Hung ,  Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Jian Cheng Chen ,  Wei Chi Yih ,  Ho Ming Tong

IPC: H01L23/488

CPC classification number: H01L24/85 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A wire bonding structure includes a chip and a bonding wire. The chip includes a base material, at least one first metallic pad, a re-distribution layer and at least one second metallic pad. The first metallic pad is disposed on the base material. The re-distribution layer has a first end and a second end, and the first end is electrically connected to the first metallic pad. The second metallic pad is electrically connected to the second end of the re-distribution layer. The bonding wire is bonded to the second metallic pad.

Abstract translation: 引线键合结构包括芯片和接合线。 芯片包括基材，至少一个第一金属垫，再分布层和至少一个第二金属垫。 第一金属垫设置在基材上。 再分布层具有第一端和第二端，并且第一端电连接到第一金属垫。 第二金属垫电连接到再分配层的第二端。 接合线接合到第二金属垫。

公开(公告)号：US08066170B2

公开(公告)日：2011-11-29

申请号：US12739100

申请日：2009-06-08

Applicant: Gary S. Gillotti ,  Stanley Szczesniak ,  Peter J. Van Emmerik

Inventor： Gary S. Gillotti ,  Stanley Szczesniak ,  Peter J. Van Emmerik

IPC: B23K1/06

CPC classification number: H01L24/85 ,  B23K20/007 ,  B23K2101/42 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.

Abstract translation: 提供引线接合机。 引线接合机包括接合工具和用于在延伸穿过接合工具的线的端部上形成自由空气球的电极，其中自由空气球形成在引线接合机的自由空气球形成区域。 引线接合机还包括用于在引线接合操作期间保持半导体器件的接合位置区域。 引线接合机还包括气体输送机构，其构造成提供覆盖气体以：（1）粘结位置区域，由此覆盖气体通过气体输送机构的至少一个孔被喷射到粘结位置区域，和（2 ）自由空气球形成区域。

公开(公告)号：US20100065963A1

公开(公告)日：2010-03-18

申请号：US12500495

申请日：2009-07-09

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H01L23/48

CPC classification number: B23K20/004 ,  B23K2101/40 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85099 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/013 ,  H01L2924/00013

Abstract: Contact structures for a variety of electronic components can be formed to have primarily elastic properties. The contact structures can be free standing, and can be coupled to a variety of different electronic components such as a probe card assembly, a semiconductor wafer or dies, an interposer, or the like. Tips of the contact structures can have a topology that facilities contact with another electronic component.

Abstract translation: 可以形成各种电子部件的接触结构以具有主要的弹性特性。 接触结构可以是独立的，并且可以耦合到各种不同的电子部件，例如探针卡组件，半导体晶片或管芯，插入件等。 接触结构的提示可以具有设备与另一电子部件接触的拓扑。

公开(公告)号：US20080197461A1

公开(公告)日：2008-08-21

申请号：US11706193

申请日：2007-02-15

Applicant: Chen-Hua Yu ,  Hui-Lin Chang ,  Yung-Cheng Lu ,  Mirng-Ji Lii ,  Yung-Ching Chen

Inventor： Chen-Hua Yu ,  Hui-Lin Chang ,  Yung-Cheng Lu ,  Mirng-Ji Lii ,  Yung-Ching Chen

IPC: H01L21/60 ,  B23K37/00 ,  H01L23/495

CPC classification number: H01L23/4952 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/45012 ,  H01L2224/45013 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4516 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49175 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/20751 ,  H01L2924/00 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An apparatus for wire bonding and a capillary tool thereof are provided. An exemplary embodiment of a capillary tool capable of a wire bonding comprises a body having a first internal channel of a first diameter for accommodating a flow of a conductive wire. A compressible head is connected to the body, having a second internal channel of a second diameter for accommodating the flow of the conductive wire, wherein the first diameter is fixed and the second diameter is variable, the second diameter is not more than the first diameter and a diameter the conductive wire flowed through the compressible head is adjustable. An integrated circuit (IC) package is also provided.

Abstract translation: 提供一种用于引线接合的装置及其毛细管工具。 能够引线接合的毛细管工具的示例性实施例包括具有用于容纳导线流动的第一直径的第一内部通道的主体。 可压缩头连接到主体，具有用于容纳导线流动的第二直径的第二内部通道，其中第一直径是固定的，第二直径是可变的，第二直径不大于第一直径 并且流过可压缩头的导线的直径是可调节的。 还提供集成电路（IC）封装。

公开(公告)号：US20060228825A1

公开(公告)日：2006-10-12

申请号：US11102408

申请日：2005-04-08

Applicant: David Hembree

Inventor： David Hembree

IPC: H01L21/00

CPC classification number: H01L25/0657 ,  B23K20/004 ,  B23K20/005 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48455 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48992 ,  H01L2224/78301 ,  H01L2224/8121 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2224/9202 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/4046 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/53213 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/2075 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back side, and a through via. The method also includes the steps of: threading a wire through the via, forming a contact on the wire on the back side, forming a bonded contact on the wire on the circuit side, and then severing the wire from the bonded contact. The through wire interconnect includes the wire in the via, the contact on the back side and the bonded contact on the circuit side. The contact on the back side, and the bonded contact on the circuit side, permit multiple components to be stacked with electrical connections between adjacent components. A system for performing the method includes the substrate with the via, and a wire bonder having a bonding capillary configured to thread the wire through the via, and form the contact and the bonded contact. The semiconductor component can be used to form chip scale components, wafer scale components, stacked components, or interconnect components for electrically engaging or testing other semiconductor components.

Abstract translation: 用于通过导线互连制造半导体部件的方法包括提供具有电路侧，背面和通孔的基板的步骤。 该方法还包括以下步骤：将导线穿过通孔，在背面的导线上形成接触，在电路侧的导线上形成接合接触，然后将线从接合接触件断开。 通线互连包括通孔中的导线，背侧的触点和电路侧的接合触点。 背面的触点和电路侧的接合触点允许多个部件与相邻部件之间的电连接层叠。 用于执行该方法的系统包括具有通孔的基板和具有接合毛细管的引线接合器，所述接合毛细管被配置为使线穿过通孔，并形成接触和接合接触。 半导体部件可用于形成用于电接合或测试其它半导体部件的芯片级部件，晶片级部件，堆叠部件或互连部件。

公开(公告)号：US06854637B2

公开(公告)日：2005-02-15

申请号：US10372061

申请日：2003-02-20

Applicant: Fuaida Harun ,  Kong Bee Tiu

Inventor： Fuaida Harun ,  Kong Bee Tiu

IPC: B23K20/00 ,  B23K31/00 ,  B23K31/02

CPC classification number: H01L24/48 ,  B23K20/004 ,  B23K2101/38 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20754 ,  H01L2224/85181 ,  H01L2924/01004 ,  H01L2224/78 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/2075 ,  H01L2924/01049 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An electrical connection for connecting a bond pad of a first device and a bond pad of a second device with an insulated or coated wire. The electrical connection includes a first wirebond securing a first portion of the insulated bond wire to the first device bond pad. A second wirebond secures a second portion of the insulated bond wire to the second device bond pad. A bump is formed over the second wirebond, and the bump is offset from the second wirebond. The offset bump enhances the second bond, providing it with increased wire peel strength.

Abstract translation: 一种用于连接第一装置的接合焊盘和第二装置的焊盘与绝缘或涂覆电线的电连接。 电连接包括将绝缘接合线的第一部分固定到第一器件接合焊盘的第一引线键。 第二引线键将绝缘接合线的第二部分固定到第二器件接合焊盘。 凸起形成在第二引线键上，并且凸块与第二引线键偏移。 偏移凸块增强了第二粘结，提供了增加的线剥离强度。

公开(公告)号：US20040164126A1

公开(公告)日：2004-08-26

申请号：US10372061

申请日：2003-02-20

Inventor： Fuaida Harun ,  Kong Bee Tiu

IPC: B23K031/02

CPC classification number: H01L24/48 ,  B23K20/004 ,  B23K2101/38 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20754 ,  H01L2224/85181 ,  H01L2924/01004 ,  H01L2224/78 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/2075 ,  H01L2924/01049 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An electrical connection for connecting a bond pad of a first device and a bond pad of a second device with an insulated or coated wire. The electrical connection includes a first wirebond securing a first portion of the insulated bond wire to the first device bond pad. A second wirebond secures a second portion of the insulated bond wire to the second device bond pad. A bump is formed over the second wirebond, and the bump is offset from the second wirebond. The offset bump enhances the second bond, providing it with increased wire peel strength.

Abstract translation: 一种用于连接第一装置的接合焊盘和第二装置的焊盘与绝缘或涂覆电线的电连接。 电连接包括将绝缘接合线的第一部分固定到第一器件接合焊盘的第一引线键。 第二引线键将绝缘接合线的第二部分固定到第二器件接合焊盘。 凸起形成在第二引线键上，并且凸块与第二引线键偏移。 偏移凸块增强了第二粘结，提供了增加的线剥离强度。