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公开(公告)号：US20050006734A1
公开(公告)日：2005-01-13
申请号：US10613703
申请日：2003-07-07
申请人： Fuaida Harun , Liang Koh , Lan Tan
发明人： Fuaida Harun , Liang Koh , Lan Tan
IPC分类号： H01L23/31 , H01L23/498 , H01L23/50 , H01L23/544 , H01L21/48 , H01L23/52
CPC分类号： H01L23/49838 , H01L23/3128 , H01L23/50 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/85 , H01L2224/05554 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/4917 , H01L2224/49171 , H01L2224/73265 , H01L2224/78 , H01L2224/85 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit is packaged using a package substrate that has a bottom side with a regular array of connection points and a top side with the integrated circuit on it. Vias in the package substrate provide electrical connection between the top and bottom sides. The vias have a via capture pad to which a wire may be wire bonded so that the wires from the IC to the substrate top side directly contact the vias at their capture pads without the need for traces from a top side bond pad to a via. The via capture pad is shaped to include at least one sharp edge to improve the ability of a wirebonder with pattern recognition software to locate the capture pad and place the wire.
摘要翻译： 使用封装基板封装集成电路，该封装基板的底侧具有规则的连接点阵列，顶部具有集成电路。 封装衬底中的通孔提供顶部和底部之间的电连接。 通孔具有通孔捕获垫，导线可以被引线接合到该通孔捕获垫，使得从IC到基板顶侧的导线直接接触它们的捕获垫处的通孔，而不需要从顶侧接合焊盘到通孔的迹线。 通孔捕获垫被成形为包括至少一个锋利边缘，以提高带有图案识别软件的引线键合器定位捕获垫并放置导线的能力。
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公开(公告)号：US20090051017A1
公开(公告)日：2009-02-26
申请号：US12204493
申请日：2008-09-04
申请人： Beng Tatt Wee , Fuaida Harun , Soon Hock Tong , Robert-Christian Hagen , Yang Hong Heng , Kean Cheong Lee
发明人： Beng Tatt Wee , Fuaida Harun , Soon Hock Tong , Robert-Christian Hagen , Yang Hong Heng , Kean Cheong Lee
IPC分类号： H01L23/495 , H01L21/50
CPC分类号： H01L21/565 , H01L23/49562 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one non-conductive tie bar, and a metal joint. The metal joint connects the at least one non-conductive tie bar to the heat spreader area. The semiconductor chip is provided on a die pad located on the heat spreader area. The encapsulating body covers at least part of the semiconductor chip, at least part of the at least one non-conductive tie bar and part of the lead frame.
摘要翻译： 电子部件包括引线框架，半导体芯片和封装体。 引线框架包括散热器区域，多个导电引线指，至少一个非导电连接条和金属接头。 金属接头将至少一个非导电连接杆连接到散热器区域。 半导体芯片设置在位于散热器区域上的芯片焊盘上。 封装体覆盖半导体芯片的至少一部分，至少一部分非导电连接条和引线框架的一部分。
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公开(公告)号：US07795712B2
公开(公告)日：2010-09-14
申请号：US12204493
申请日：2008-09-04
申请人： Alvin Wee Beng Tatt , Fuaida Harun , Soon Hock Tong , Robert-Christian Hagen , Yang Hong Heng , Kean Cheong Lee
发明人： Alvin Wee Beng Tatt , Fuaida Harun , Soon Hock Tong , Robert-Christian Hagen , Yang Hong Heng , Kean Cheong Lee
IPC分类号： H01L23/495 , H01L23/28
CPC分类号： H01L21/565 , H01L23/49562 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one non-conductive tie bar, and a metal joint. The metal joint connects the at least one non-conductive tie bar to the heat spreader area. The semiconductor chip is provided on a die pad located on the heat spreader area. The encapsulating body covers at least part of the semiconductor chip, at least part of the at least one non-conductive tie bar and part of the lead frame.
摘要翻译： 电子部件包括引线框架，半导体芯片和封装体。 引线框架包括散热器区域，多个导电引线指，至少一个非导电连接条和金属接头。 金属接头将至少一个非导电连接杆连接到散热器区域。 半导体芯片设置在位于散热器区域上的芯片焊盘上。 封装体覆盖半导体芯片的至少一部分，至少一部分非导电连接条和引线框架的一部分。
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公开(公告)号：US07042098B2
公开(公告)日：2006-05-09
申请号：US10613703
申请日：2003-07-07
申请人： Fuaida Harun , Liang Jen Koh , Lan Chu Tan
发明人： Fuaida Harun , Liang Jen Koh , Lan Chu Tan
CPC分类号： H01L23/49838 , H01L23/3128 , H01L23/50 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/85 , H01L2224/05554 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/4917 , H01L2224/49171 , H01L2224/73265 , H01L2224/78 , H01L2224/85 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit is packaged using a package substrate that has a bottom side with a regular array of connection points and a top side with the integrated circuit on it. Vias in the package substrate provide electrical connection between the top and bottom sides. The vias have a via capture pad to which a wire may be wire bonded so that the wires from the IC to the substrate top side directly contact the vias at their capture pads without the need for traces from a top side bond pad to a via. The via capture pad is shaped to include at least one sharp edge to improve the ability of a wirebonder with pattern recognition software to locate the capture pad and place the wire.
摘要翻译： 使用封装基板封装集成电路，该封装基板的底侧具有规则的连接点阵列，顶部具有集成电路。 封装衬底中的通孔提供顶部和底部之间的电连接。 通孔具有通孔捕获垫，导线可以被引线接合到该通孔捕获垫，使得从IC到基板顶侧的导线直接接触它们的捕获垫处的通孔，而不需要从顶侧接合焊盘到通孔的迹线。 通孔捕获垫被成形为包括至少一个锋利边缘，以提高带有图案识别软件的引线键合器定位捕获垫并放置导线的能力。
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公开(公告)号：US07261230B2
公开(公告)日：2007-08-28
申请号：US10652434
申请日：2003-08-29
申请人： Fuaida Harun , Chiaw Mong Chan , Lan Chu Tan , Lau Teck Beng , Kong Bee Tiu , Soo San Yong
发明人： Fuaida Harun , Chiaw Mong Chan , Lan Chu Tan , Lau Teck Beng , Kong Bee Tiu , Soo San Yong
IPC分类号： B23K1/06
CPC分类号： H01L24/85 , B23K20/005 , B23K2101/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/45169 , H01L2224/45565 , H01L2224/45669 , H01L2224/4569 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/78301 , H01L2224/85181 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/01004 , H01L2924/00014 , H01L2924/00011 , H01L2924/00 , H01L2924/2075
摘要： An improved method of bonding an insulated wire (14) that has one end connected to a first bond pad (16) to a second bond pad (18) includes moving a tip of a capillary (20) holding the bond wire (14) over the surface of the second bond pad (18) such that the bond wire (14) is rubbed between the capillary tip (20) and the second bond pad (18), which tears the bond wire insulation so that at least a portion of a metal core of the wire (14) contacts the second bond pad (18). The wire (14) is then bonded to the second pad (18) using thermocompression bonding. The tip of the capillary (20) is roughened to enhance the tearing of the bond wire insulation.
摘要翻译： 将具有一端连接到第一接合焊盘（16）的绝缘电线（14）的改进方法连接到第二接合焊盘（18）包括将保持接合线（14）的毛细管（20）的尖端移动到 所述第二接合焊盘（18）的表面使得所述接合线（14）在所述毛细管尖端（20）和所述第二接合焊盘（18）之间摩擦，所述接合焊盘撕裂所述接合线绝缘体，使得至少一部分 金属丝（14）的金属芯与第二接合焊盘（18）接触。 然后使用热压接将导线（14）接合到第二焊盘（18）。 毛细管（20）的尖端被粗糙化以增强接合线绝缘层的撕裂。
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公开(公告)号：US20060231959A1
公开(公告)日：2006-10-19
申请号：US11377996
申请日：2006-03-17
申请人： Fuaida Harun , Liang Koh , Lan Tan
发明人： Fuaida Harun , Liang Koh , Lan Tan
IPC分类号： H01L23/48
CPC分类号： H01L23/49838 , H01L23/3128 , H01L23/50 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/85 , H01L2224/05554 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/4917 , H01L2224/49171 , H01L2224/73265 , H01L2224/78 , H01L2224/85 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit is packaged using a package substrate that has a bottom side with a regular array of connection points and a top side with the integrated circuit on it. Vias in the package substrate provide electrical connection between the top and bottom sides. The vias have a via capture pad to which a wire may be wire bonded so that the wires from the IC to the substrate top side directly contact the vias at their capture pads without the need for traces from a top side bond pad to a via. The via capture pad is shaped to include at least one sharp edge to improve the ability of a wirebonder with pattern recognition software to locate the capture pad and place the wire.
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公开(公告)号：US06933614B2
公开(公告)日：2005-08-23
申请号：US10662541
申请日：2003-09-15
申请人： Chu-Chung Lee , Fuaida Harun , Kevin J. Hess , Lan Chu Tan , Cheng Choi Yong
发明人： Chu-Chung Lee , Fuaida Harun , Kevin J. Hess , Lan Chu Tan , Cheng Choi Yong
IPC分类号： H01L21/60 , H01L23/485 , H01L23/48
CPC分类号： H01L24/85 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05647 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48463 , H01L2224/48647 , H01L2224/48747 , H01L2224/48847 , H01L2224/85013 , H01L2224/85207 , H01L2224/85375 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01039 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/19042 , H01L2924/30107 , H01L2224/78 , H01L2924/00
摘要： An integrated circuit die (10) has a copper contact (16, 18), which, upon exposure to the ambient air, forms a native copper oxide. An organic material is applied to the copper contact which reacts with the native copper oxide to form an organic coating (12, 14) on the copper contact in order to prevent further copper oxidation. In this manner, further processing at higher temperatures, such as those greater than 100 degrees Celsius, is not inhibited by excessive copper oxidation. For example, due to the organic coating, the high temperature of the wire bond process does not result in excessive oxidation which would prevent reliable wire bonding. Thus, the formation of the organic coating allows for a reliable and thermal resistance wire bond (32, 34). Alternatively, the organic coating can be formed over exposed copper at any time during the formation of the integrated circuit die to prevent or limit the formation of copper oxidation.
摘要翻译： 集成电路管芯（10）具有铜接触（16,18），其在暴露于环境空气时形成天然铜氧化物。 将有机材料施加到与天然氧化铜反应的铜接触处，以在铜接触上形成有机涂层（12,14），以防止进一步的铜氧化。 以这种方式，在较高温度（例如大于100摄氏度的温度）下的进一步处理不会被过度的铜氧化所阻碍。 例如，由于有机涂层，引线键合过程的高温不会导致过度的氧化，这将阻止可靠的引线接合。 因此，有机涂层的形成允许可靠和耐热的引线键合（32,34）。 或者，可以在形成集成电路管芯期间的任何时间在暴露的铜上形成有机涂层，以防止或限制铜氧化的形成。
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公开(公告)号：US20050045692A1
公开(公告)日：2005-03-03
申请号：US10652434
申请日：2003-08-29
申请人： Fuaida Harun , Chiaw Chan , Lan Tan , Lau Beng , Kong Tiu , Soo Yong
发明人： Fuaida Harun , Chiaw Chan , Lan Tan , Lau Beng , Kong Tiu , Soo Yong
CPC分类号： H01L24/85 , B23K20/005 , B23K2101/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/45169 , H01L2224/45565 , H01L2224/45669 , H01L2224/4569 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/78301 , H01L2224/85181 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/01004 , H01L2924/00014 , H01L2924/00011 , H01L2924/00 , H01L2924/2075
摘要： An improved method of bonding an insulated wire (14) that has one end connected to a first bond pad (16) to a second bond pad (18) includes moving a tip of a capillary (20) holding the bond wire (14) over the surface of the second bond pad (18) such that the bond wire (14) is rubbed between the capillary tip (20) and the second bond pad (18), which tears the bond wire insulation so that at least a portion of a metal core of the wire (14) contacts the second bond pad (18). The wire (14) is then bonded to the second pad (18) using thermocompression bonding. The tip of the capillary (20) is roughened to enhance the tearing of the bond wire insulation.
摘要翻译： 将具有一端连接到第一接合焊盘（16）的绝缘电线（14）的改进方法连接到第二接合焊盘（18）包括将保持接合线（14）的毛细管（20）的尖端移动到 所述第二接合焊盘（18）的表面使得所述接合线（14）在所述毛细管尖端（20）和所述第二接合焊盘（18）之间摩擦，所述接合焊盘撕裂所述接合线绝缘体，使得至少一部分 金属丝（14）的金属芯与第二接合焊盘（18）接触。 然后使用热压接将导线（14）接合到第二焊盘（18）。 毛细管（20）的尖端被粗糙化以增强接合线绝缘层的撕裂。
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公开(公告)号：US06854637B2
公开(公告)日：2005-02-15
申请号：US10372061
申请日：2003-02-20
申请人： Fuaida Harun , Kong Bee Tiu
发明人： Fuaida Harun , Kong Bee Tiu
CPC分类号： H01L24/48 , B23K20/004 , B23K2101/38 , H01L24/45 , H01L24/85 , H01L2224/45015 , H01L2224/45016 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/45169 , H01L2224/4556 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48599 , H01L2224/48699 , H01L2224/78301 , H01L2224/85043 , H01L2224/85205 , H01L2224/85951 , H01L2224/85986 , H01L2924/00011 , H01L2924/00014 , H01L2924/00015 , H01L2924/01005 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20752 , H01L2924/20754 , H01L2224/85181 , H01L2924/01004 , H01L2224/78 , H01L2224/48227 , H01L2924/00 , H01L2924/20755 , H01L2924/20756 , H01L2924/2075 , H01L2924/01049 , H01L2924/01006 , H01L2224/85399 , H01L2224/05599
摘要： An electrical connection for connecting a bond pad of a first device and a bond pad of a second device with an insulated or coated wire. The electrical connection includes a first wirebond securing a first portion of the insulated bond wire to the first device bond pad. A second wirebond secures a second portion of the insulated bond wire to the second device bond pad. A bump is formed over the second wirebond, and the bump is offset from the second wirebond. The offset bump enhances the second bond, providing it with increased wire peel strength.
摘要翻译： 一种用于连接第一装置的接合焊盘和第二装置的焊盘与绝缘或涂覆电线的电连接。 电连接包括将绝缘接合线的第一部分固定到第一器件接合焊盘的第一引线键。 第二引线键将绝缘接合线的第二部分固定到第二器件接合焊盘。 凸起形成在第二引线键上，并且凸块与第二引线键偏移。 偏移凸块增强了第二粘结，提供了增加的线剥离强度。
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