公开(公告)号：US20100108359A1

公开(公告)日：2010-05-06

申请号：US12607225

申请日：2009-10-28

Applicant: Rainer Dohle ,  Frank Rudolf ,  Christian Wenzel

Inventor： Rainer Dohle ,  Frank Rudolf ,  Christian Wenzel

IPC: H01B5/00 ,  H01B13/00

CPC classification number: H01L24/85 ,  B23K35/0227 ,  B23K35/286 ,  B32B15/01 ,  B32B15/018 ,  C22C27/02 ,  C22C27/04 ,  C23C14/3407 ,  C23C14/562 ,  C23C30/00 ,  H01L24/43 ,  H01L24/45 ,  H01L24/745 ,  H01L2224/435 ,  H01L2224/4381 ,  H01L2224/4382 ,  H01L2224/43826 ,  H01L2224/43827 ,  H01L2224/43831 ,  H01L2224/43848 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4557 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/456 ,  H01L2224/45624 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45681 ,  H01L2224/45684 ,  H01L2224/45686 ,  H01L2224/45687 ,  H01L2224/745 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2224/45138 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/05432 ,  H01L2924/013

Abstract: A connecting wire having an electrically conductive core—preferably provided by a wire or ribbon—with a coating provided on the surface of the core, the coating being composed of a nitrogen-containing tantalum alloy or tungsten alloy, and also optionally containing silicon as an additional alloy component. The invention further relates to a manufacturing method for such a connecting wire.

Abstract translation: 一种连接线，其具有导电芯 - 优选地由线或带提供，其具有设置在芯的表面上的涂层，该涂层由含氮钽合金或钨合金构成，并且还任选地含有硅作为 额外的合金成分。 本发明还涉及这种连接线​​的制造方法。

公开(公告)号：US06858943B1

公开(公告)日：2005-02-22

申请号：US10396879

申请日：2003-03-25

Applicant: Kenneth A. Peterson ,  Stephen E. Garrett ,  Cathleen A. Reber

Inventor： Kenneth A. Peterson ,  Stephen E. Garrett ,  Cathleen A. Reber

IPC: B81B7/00 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: B81B7/0006 ,  B82Y30/00 ,  H01L24/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05138 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/11003 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/48475 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85099 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2224/85375 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01004 ,  H01L2924/01204 ,  H01L2224/451 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/01006

Abstract: A release resistant electrical interconnection comprising a gold-based electrical conductor compression bonded directly to a highly-doped polysilicon bonding pad in a MEMS, IMEMS, or MOEMS device, without using any intermediate layers of aluminum, titanium, solder, or conductive adhesive disposed in-between the conductor and polysilicon pad. After the initial compression bond has been formed, subsequent heat treatment of the joint above 363 C creates a liquid eutectic phase at the bondline comprising gold plus approximately 3 wt % silicon, which, upon re-solidification, significantly improves the bond strength by reforming and enhancing the initial bond. This type of electrical interconnection is resistant to chemical attack from acids used for releasing MEMS elements (HF, HCL), thereby enabling the use of a “package-first, release-second” sequence for fabricating MEMS devices. Likewise, the bond strength of an Au—Ge compression bond may be increased by forming a transient liquid eutectic phase comprising Au-12 wt % Ge.

Abstract translation: 耐剥离电气互连，包括直接与MEMS，IMEMS或MOEMS器件中的高度掺杂的多晶硅焊盘压接的金基电导体，而不使用任何铝，钛，焊料或导电粘合剂的中间层 在导体和多晶硅垫之间。 在形成初始压接之后，接头在363℃以上的热处理在包含金加上约3重量％的硅的粘结线上产生液态共晶相，再次凝固时，通过重整显着地提高了粘合强度， 增强初始债券。 这种类型的电互连耐受用于释放MEMS元件（HF，HCL）的酸的化学侵蚀，从而能够使用“封装第一，释放 - 第二”序列来制造MEMS器件。 同样，通过形成包含Au-12wt％Ge的瞬态液体共晶相，可以增加Au-Ge压缩键的键合强度。

公开(公告)号：US20240339368A1

公开(公告)日：2024-10-10

申请号：US18746015

申请日：2024-06-17

Applicant: FUJIFILM Corporation

Inventor： Atsushi NAKAMURA ,  Kosuke Yamashita ,  Kazuki Tomota

IPC: H01L23/29 ,  C09J133/24 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/295 ,  C09J133/24 ,  H01L21/563 ,  H01L24/43 ,  H01L24/45 ,  H01L25/0657 ,  H01L2224/45016 ,  H01L2224/4502 ,  H01L2225/06513

Abstract: There is provided a manufacturing method for a bonded body, comprising: preparing a substrate A having a surface on which a wiring line terminal is provided; forming a polyimide-containing precursor portion on the surface of the substrate A, where the wiring line terminal is provided on the surface of the substrate A; preparing a substrate B having a surface on which a wiring line terminal is provided; and bonding the surface of the substrate A, where the polyimide-containing precursor portion is provided on the surface of the substrate A, to the surface of the substrate B, where the wiring line terminal is provided on the surface of the substrate B, wherein a difference between a cyclization rate of a polyimide in the polyimide-containing precursor portion before the bonding of the surface of the substrate A and a cyclization rate of a polyimide in a polyimide-containing portion formed at a bonded portion after the bonding of the surface of the substrate A is 5% or more.

公开(公告)号：US20130213689A1

公开(公告)日：2013-08-22

申请号：US13811419

申请日：2011-07-18

Applicant: Poh Yoong Kong

Inventor： Eugen Milke ,  Jürgen Dick ,  Peter Prenosil ,  Frank-Werner Wulff

IPC: H01B5/02 ,  B21F45/00

CPC classification number: H01B5/02 ,  B21F45/00 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/4321 ,  H01L2224/4381 ,  H01L2224/43825 ,  H01L2224/43826 ,  H01L2224/43847 ,  H01L2224/43848 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45686 ,  H01L2224/45687 ,  H01L2224/85001 ,  H01L2224/85207 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2224/45164 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/01083 ,  H01L2924/01049

Abstract: A bonding wire is provided containing a wire core made of a first material containing a metal and a wire jacket that envelopes the wire core and is made of a second material containing a metal. The wire core and the wire jacket are made of different metals and the bonding wire has an aspect ratio of no more than 0.8. The bonding wire efficiently prevents damage to bonding surfaces during the bonding process and short-circuiting during the use of corresponding sub-assemblies.

Abstract translation: 提供了一种接合线，其包含由包含金属的第一材料制成的线芯和包围线芯的线夹套，并且由包含金属的第二材料制成。 线芯和电线护套由不同的金属制成，接合线的纵横比不大于0.8。 接合线在使用相应的子组件期间有效地防止在接合过程中的接合表面的损坏和短路。

公开(公告)号：US08450611B2

公开(公告)日：2013-05-28

申请号：US12607225

申请日：2009-10-28

Applicant: Rainer Dohle ,  Frank Rudolf ,  Christian Wenzel

Inventor： Rainer Dohle ,  Frank Rudolf ,  Christian Wenzel

IPC: H01R4/62

CPC classification number: H01L24/85 ,  B23K35/0227 ,  B23K35/286 ,  B32B15/01 ,  B32B15/018 ,  C22C27/02 ,  C22C27/04 ,  C23C14/3407 ,  C23C14/562 ,  C23C30/00 ,  H01L24/43 ,  H01L24/45 ,  H01L24/745 ,  H01L2224/435 ,  H01L2224/4381 ,  H01L2224/4382 ,  H01L2224/43826 ,  H01L2224/43827 ,  H01L2224/43831 ,  H01L2224/43848 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4557 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/456 ,  H01L2224/45624 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45681 ,  H01L2224/45684 ,  H01L2224/45686 ,  H01L2224/45687 ,  H01L2224/745 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2224/45138 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/05432 ,  H01L2924/013

Abstract: A connecting wire having an electrically conductive core, preferably provided by a wire or ribbon, with a coating provided on the surface of the core. The coating is composed of a nitrogen-containing tantalum alloy or tungsten alloy, and also optionally contains silicon as an additional alloy component. A manufacturing method for producing such a connecting wire involves passing a wire or ribbon core past a coating source to apply the coating.

Abstract translation: 一种连接线，其具有导电芯，优选地由线或带提供，其具有设置在芯的表面上的涂层。 该涂层由含氮钽合金或钨合金组成，并且还任选地含有作为附加合金成分的硅。 用于制造这种连接线​​的制造方法包括使线或带芯通过涂覆源以施加涂层。

公开(公告)号：US20080061450A1

公开(公告)日：2008-03-13

申请号：US11810276

申请日：2007-06-04

Applicant: Manfred Reinold ,  Thomas Kaden ,  Immanuel Mueller

Inventor： Manfred Reinold ,  Thomas Kaden ,  Immanuel Mueller

IPC: H01L23/49 ,  H01B5/00

CPC classification number: H01R4/023 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/2076 ,  H01R43/02 ,  H01L2924/01004 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00015 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2924/206 ,  H01L2224/43848

Abstract: A bonding wire and a bond using such a bonding wire. The contour of the cross-sectional area of the bonding wire has a shape deviating from a circle shape and from a rectangle shape having two sides of different length.

Abstract translation: 使用这种接合线的接合线和接合。 接合线的横截面积的轮廓具有偏离圆形的形状和具有不同长度的两侧的矩形。

公开(公告)号：US09761537B2

公开(公告)日：2017-09-12

申请号：US14869952

申请日：2015-09-29

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Howard E. Chen ,  Matthew Sean Read

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2223/6655 ,  H01L2224/04042 ,  H01L2224/05013 ,  H01L2224/06181 ,  H01L2224/45016 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: Shielded radio-frequency (RF) module having reduced area. In some embodiments, an RF module can include a packaging substrate configured to receive a plurality of components, and a plurality of shielding wirebonds implemented on the packaging substrate and configured to provide RF shielding functionality for one or more regions on the packaging substrate. The packaging substrate can include a first area associated with implementation of each shielding wirebond. The RF module can further include one or more devices mounted on the packaging substrate. The packaging substrate can further include a second area associated with mounting of each of the one or more devices. Each device can be mounted with respect to a corresponding shielding wirebond such that the second area associated with the device overlaps at least partially with the first area associated with the corresponding shielding wirebond.

公开(公告)号：US20150162281A1

公开(公告)日：2015-06-11

申请号：US14300368

申请日：2014-06-10

Applicant: Kabushiki Kaisha Toshiba

Inventor： Yoshiko Kato ,  Hiromitsu Mashita

IPC: H01L23/528 ,  H01L29/417 ,  H01L27/115 ,  H01L21/311 ,  H01L21/768 ,  H01L23/522

CPC classification number: H01L29/4175 ,  H01L21/31111 ,  H01L21/31144 ,  H01L21/76802 ,  H01L21/76816 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L27/11519 ,  H01L27/11524 ,  H01L2224/45016 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48237 ,  H01L2224/48247

Abstract: In general, according to one embodiment, an integrated circuit device includes a first conductive member extending in a first direction, a second conductive member extending in the first direction, a first contact having a lower end connected to the first conductive member, and a second contact having a lower end connected to the second conductive member. A position of the first contact in the first direction is different from a position of the second contact in the first direction. Cross sections of the first contact and the second contact have longitudinal directions in a second direction as viewed from above. The second direction is from the first contact toward the second contact.

Abstract translation: 通常，根据一个实施例，集成电路器件包括沿第一方向延伸的第一导电构件，沿第一方向延伸的第二导电构件，具有连接到第一导电构件的下端的第一触点， 接触件具有连接到第二导电构件的下端。 在第一方向上的第一接触的位置不同于第一接触在第一方向上的位置。 第一触点和第二触点的横截面从上方观察到沿第二方向的纵向方向。 第二方向是从第一接触到第二接触。

公开(公告)号：US20140239359A1

公开(公告)日：2014-08-28

申请号：US14348061

申请日：2012-09-25

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Tsuyoshi Seto

IPC: H01L29/41 ,  H01L29/417 ,  H01L29/423 ,  H01L29/78

CPC classification number: H01L29/41 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/84 ,  H01L24/85 ,  H01L29/41725 ,  H01L29/4232 ,  H01L29/78 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40101 ,  H01L2224/40137 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48101 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A gate electrode (4) and a source electrode (5) of a semiconductor chip (3) are connected to a gate terminal (7) and a source terminal (9), respectively, via electric conductors (11a and 11b). A portion of the gate terminal (7) which portion is joined to the electric conductor (11a) is close to the gate electrode (4), and a portion of the source terminal (9) which portion is joined to the electric conductor (11b) is close to the source electrode (5).

Abstract translation: 半导体芯片（3）的栅电极（4）和源电极（5）分别经由电导体（11a和11b）连接到栅极端子（7）和源极端子（9）。 所述栅极端子（7）的与所述导电体（11a）接合的部分靠近所述栅电极（4），所述源极端子（9）的与所述导电体（11b）接合的部分 ）靠近源电极（5）。

公开(公告)号：US20090079042A1

公开(公告)日：2009-03-26

申请号：US11858911

申请日：2007-09-21

Applicant: Jim Clatterbaugh ,  Hassan Tanbakuchi ,  Matthew R. Richter ,  Michael B. Whitener

Inventor： Jim Clatterbaugh ,  Hassan Tanbakuchi ,  Matthew R. Richter ,  Michael B. Whitener

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L24/85 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/05553 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/48137 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48499 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49426 ,  H01L2224/83099 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/0103 ,  H01L2924/01004 ,  H01L2924/012 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2224/45099 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2924/206

Abstract: A microcircuit has a node thereon. A center conductor is electrically connected to the node and the center conductor has a length to minimum radius ratio of at least 50. A method of for providing electrical interconnections in a microcircuit, comprises the steps of depositing conductive bumps on the microcircuit; and aligning and bonding a center conductor to the conductive bumps, the center conductor having a first end and a second end, and the center conductor having a length to minimum radius ratio of at least 50.

Abstract translation: 微电路上有一个节点。 中心导体电连接到节点，中心导体的长度与最小半径比至少为50.一种用于在微电路中提供电互连的方法包括以下步骤：在微电路上沉积导电凸块; 以及将中心导体对准和结合到所述导电凸块，所述中心导体具有第一端和第二端，所述中心导体的长度与最小半径比至少为50。