公开(公告)号：US07581667B2

公开(公告)日：2009-09-01

申请号：US10682057

申请日：2003-10-09

申请人： Manfred Reinold ,  Thomas Kaden ,  Dirk Brinkmann

发明人： Manfred Reinold ,  Thomas Kaden ,  Dirk Brinkmann

IPC分类号： B23K1/06

CPC分类号： H01L24/78 ,  H01L2224/78302 ,  H01L2224/78822 ,  H01L2224/85205 ,  H01L2224/85206 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01R43/0207 ,  H05K3/328 ,  H01L2224/48 ,  H01L2224/45099

摘要： A tool head for attaching an electrical conductor on the contact surface of a substrate, comprising a vibration exciter for generating linear ultrasonic vibrations; a bonding tool that is able to contact the contact surface and/or the conductor, a contact pressure being able to be applied to the conductor in the direction of the contact point via the bonding tool, and the conductor is able to be welded onto the contact point with the aid of the ultrasonic vibrations able to be transmitted to the contact point and/or the conductor in this manner; and a vibration conductor absorbing the linear ultrasonic vibrations of the vibration exciter; a converter being provided between the vibration conductor and the bonding tool to convert the linear vibrations into radial vibrations in such a way that the bonding tool is able to be incited to rotary vibrations.

摘要翻译： 一种用于将电导体附接在基板的接触表面上的工具头，包括用于产生线性超声波振动的振动激励器; 能够接触接触表面和/或导体的接合工具，能够经由接合工具沿接触点的方向施加到导体的接触压力，并且导体能够被焊接到 借助于能够以这种方式传递到接触点和/或导体的超声波振动的接触点; 以及吸收振动激励器的线性超声波振动的振动导体; 转换器设置在振动导体和接合工具之间，以将线性振动转换成径向振动，使得接合工具能够被煽动旋转振动。

公开(公告)号：US20110121059A1

公开(公告)日：2011-05-26

申请号：US12736711

申请日：2009-04-03

申请人： Manfred Reinold ,  Immanuel Mueller

发明人： Manfred Reinold ,  Immanuel Mueller

IPC分类号： H05K3/34 ,  B23K1/06 ,  B23K35/14

CPC分类号： H01L24/85 ,  H01L24/34 ,  H01L24/37 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/1147 ,  H01L2224/37599 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/49111 ,  H01L2224/49174 ,  H01L2224/49426 ,  H01L2224/49427 ,  H01L2224/78313 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  Y10S228/904 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/37099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An electrical bond connection system between a first electrical contact surface and a second electrical contact surface having at least one first electrical conductor, which is bonded to at least one of the contact surfaces via at least one first bond connection. At least one additional second electrical conductor (9) is bonded to the first electrical conductor (8) via at least one second bond connection (10, 13), the two bond connections (10) being offset from one another. The present invention also relates to a method for manufacturing an electrical bond connection system existing between a first electrical contact surface and a second electrical contact surface.

摘要翻译： 在第一电接触表面和第二电接触表面之间的电接合连接系统，其具有至少一个第一电导体，其经由至少一个第一接合连接而接合到至少一个接触表面。 至少一个另外的第二电导体（9）经由至少一个第二接合连接（10,13）结合到第一电导体（8），两个接合连接（10）彼此偏移。 本发明还涉及一种用于制造存在于第一电接触表面和第二电接触表面之间的电接合连接系统的方法。

公开(公告)号：US20080006437A1

公开(公告)日：2008-01-10

申请号：US11810266

申请日：2007-06-04

申请人： Manfred Reinold ,  Thomas Kaden ,  Immanuel Mueller

发明人： Manfred Reinold ,  Thomas Kaden ,  Immanuel Mueller

IPC分类号： H01B5/08 ,  H01R43/00

CPC分类号： H01R43/0207 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40091 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49174 ,  H01L2224/49426 ,  H01L2224/49427 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/2076 ,  H01R4/02 ,  Y10T29/49201 ,  H01L2924/20752 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A bond between two contact surfaces using at least two bonding wires, as well as a method for producing such a bond. The bonding wires are positioned one above the other and are conductively interconnected.

摘要翻译： 使用至少两个接合线的两个接触表面之间的接合以及用于制造这种接合的方法。 接合线一个位于另一个上并且导电互连。

公开(公告)号：US20070290373A1

公开(公告)日：2007-12-20

申请号：US11810330

申请日：2007-06-04

申请人： Manfred Reinold ,  Thomas Kaden ,  Immanuel Mueller

发明人： Manfred Reinold ,  Thomas Kaden ,  Immanuel Mueller

IPC分类号： H01L23/52

CPC分类号： H01R4/023 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/43825 ,  H01L2224/43826 ,  H01L2224/43847 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45033 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/2076 ,  H01R13/03 ,  H01R43/02 ,  H01L2924/00014 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/01006 ,  H01L2924/206

摘要： A bonding wire takes the form of a ribbon, and a bond includes such a bonding wire. The bonding wire includes at least two layers having different current carrying capacity.

摘要翻译： 接合线呈带状，接合线包括这种接合线。 接合线包括具有不同载流能力的至少两层。

公开(公告)号：US08181845B2

公开(公告)日：2012-05-22

申请号：US12736711

申请日：2009-04-03

申请人： Manfred Reinold ,  Immanuel Mueller

发明人： Manfred Reinold ,  Immanuel Mueller

IPC分类号： B23K31/02

CPC分类号： H01L24/85 ,  H01L24/34 ,  H01L24/37 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/1147 ,  H01L2224/37599 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/49111 ,  H01L2224/49174 ,  H01L2224/49426 ,  H01L2224/49427 ,  H01L2224/78313 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  Y10S228/904 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/37099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An electrical bond connection system between a first electrical contact surface and a second electrical contact surface having at least one first electrical conductor, which is bonded to at least one of the contact surfaces via at least one first bond connection. At least one additional second electrical conductor (9) is bonded to the first electrical conductor (8) via at least one second bond connection (10, 13), the two bond connections (10) being offset from one another. The present invention also relates to a method for manufacturing an electrical bond connection system existing between a first electrical contact surface and a second electrical contact surface.

摘要翻译： 在第一电接触表面和第二电接触表面之间的电接合连接系统，其具有至少一个第一电导体，其经由至少一个第一接合连接而接合到至少一个接触表面。 至少一个另外的第二电导体（9）经由至少一个第二接合连接（10,13）结合到第一电导体（8），两个接合连接（10）彼此偏移。 本发明还涉及一种用于制造存在于第一电接触表面和第二电接触表面之间的电接合连接系统的方法。

公开(公告)号：US20080061450A1

公开(公告)日：2008-03-13

申请号：US11810276

申请日：2007-06-04

申请人： Manfred Reinold ,  Thomas Kaden ,  Immanuel Mueller

发明人： Manfred Reinold ,  Thomas Kaden ,  Immanuel Mueller

IPC分类号： H01L23/49 ,  H01B5/00

CPC分类号： H01R4/023 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/2076 ,  H01R43/02 ,  H01L2924/01004 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00015 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2924/206 ,  H01L2224/43848

摘要： A bonding wire and a bond using such a bonding wire. The contour of the cross-sectional area of the bonding wire has a shape deviating from a circle shape and from a rectangle shape having two sides of different length.

摘要翻译： 使用这种接合线的接合线和接合。 接合线的横截面积的轮廓具有偏离圆形的形状和具有不同长度的两侧的矩形。

公开(公告)号：US07582832B2

公开(公告)日：2009-09-01

申请号：US11810266

申请日：2007-06-04

申请人： Manfred Reinold ,  Thomas Kaden ,  Immanuel Mueller

发明人： Manfred Reinold ,  Thomas Kaden ,  Immanuel Mueller

IPC分类号： H01R4/18

CPC分类号： H01R43/0207 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40091 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49174 ,  H01L2224/49426 ,  H01L2224/49427 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/2076 ,  H01R4/02 ,  Y10T29/49201 ,  H01L2924/20752 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A bond between two contact surfaces using at least two bonding wires, as well as a method for producing such a bond. The bonding wires are positioned one above the other and are conductively interconnected.

摘要翻译： 使用至少两个接合线的两个接触表面之间的接合以及用于制造这种接合的方法。 接合线一个位于另一个上并且导电互连。