公开(公告)号：US20120038059A1

公开(公告)日：2012-02-16

申请号：US12853856

申请日：2010-08-10

申请人： Lai Nguk CHIN ,  Foong Yue HO ,  Wong Kwet NAM ,  Koo Eng LUON ,  Sally FOONG ,  Kevin GUAN

发明人： Lai Nguk CHIN ,  Foong Yue HO ,  Wong Kwet NAM ,  Koo Eng LUON ,  Sally FOONG ,  Kevin GUAN

IPC分类号： H01L23/49 ,  H01L21/50

CPC分类号： H01L24/49 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48456 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48997 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/49427 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/8503 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48455 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A method for die stacking is disclosed. In one embodiment a first die is formed overlying a substrate. A first wire is bonded to the first die and to a bond finger of the substrate, wherein the first wire is bonded to the bond finger with a first bond. A first stitch bump is formed overlying the first stitch bond, wherein the first stitch bump is formed from a molten ball of conductive material. A second die is formed overlying the first die. A second wire is bonded to the second die and to the first stitch bump, wherein the second wire is bonded to the first stitch bump with a second bond.

摘要翻译： 公开了一种用于芯片堆叠的方法。 在一个实施例中，第一管芯形成在衬底上。 第一线被接合到第一管芯和衬底的接合指状物，其中第一电线用第一接合键合到接合指状物。 第一缝合凸起形成在第一线圈接合之上，其中第一线圈凸起由导电材料的熔融球形成。 第二模具形成在第一模具上方。 第二线被接合到第二模具和第一线圈凸块，其中第二线材以第二接合键合到第一线圈凸块。

公开(公告)号：US08008785B2

公开(公告)日：2011-08-30

申请号：US12793824

申请日：2010-06-04

申请人： Belgacem Haba ,  Philip Damberg ,  Philip R. Osborn

发明人： Belgacem Haba ,  Philip Damberg ,  Philip R. Osborn

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49816 ,  H01L21/50 ,  H01L23/13 ,  H01L23/49861 ,  H01L24/01 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/91 ,  H01L2224/05554 ,  H01L2224/40091 ,  H01L2224/40225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/4813 ,  H01L2224/4824 ,  H01L2224/4846 ,  H01L2224/48465 ,  H01L2224/48477 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/4942 ,  H01L2224/49427 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/85051 ,  H01L2224/85191 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/48095 ,  H01L2224/37099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive bond element can electrically connect the first chip contact with a second substrate contact. The first bond element can have a first end metallurgically joined to the first chip contact and a second end metallurgically joined to the first substrate contact. A first end of the second bond element can be metallurgically joined to the first bond element. The second bond element may or may not touch the first chip contact or the substrate contact. A third bond element can be joined to ends of first and second bond elements which are joined to substrate contacts or to chip contacts. In one embodiment, a bond element can have a looped connection, having first and second ends joined at a first contact and a middle portion joined to a second contact.

摘要翻译： 微电子组件包括半导体芯片，其具有在第一面处露出的芯片触点和与芯片的表面并置的衬底。 导电接合元件可以将第一芯片触点与衬底的第一衬底触点电连接，并且第二导电结合元件可以将第一芯片触点与第二衬底触点电连接。 第一结合元件可以具有冶金地连接到第一芯片触点的第一端和冶金地连接到第一衬底触点的第二端。 第二结合元件的第一端可以冶金地连接到第一结合元件。 第二接合元件可以或可以不接触第一芯片接触或基板接触。 第三接合元件可以连接到第一和第二接合元件的端部，所述第一和第二接合元件连接到衬底触点或芯片触点。 在一个实施例中，接合元件可以具有环形连接，其具有在第一接触处连接的第一端和第二端以及与第二接触接合的中间部。

公开(公告)号：US20110147953A1

公开(公告)日：2011-06-23

申请号：US12793824

申请日：2010-06-04

申请人： Belgacem Haba ,  Philip Damberg ,  Philip R. Osborn

发明人： Belgacem Haba ,  Philip Damberg ,  Philip R. Osborn

IPC分类号： H01L23/49

CPC分类号： H01L23/49816 ,  H01L21/50 ,  H01L23/13 ,  H01L23/49861 ,  H01L24/01 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/91 ,  H01L2224/05554 ,  H01L2224/40091 ,  H01L2224/40225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/4813 ,  H01L2224/4824 ,  H01L2224/4846 ,  H01L2224/48465 ,  H01L2224/48477 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/4942 ,  H01L2224/49427 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/85051 ,  H01L2224/85191 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/48095 ,  H01L2224/37099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive bond element can electrically connect the first chip contact with a second substrate contact. The first bond element can have a first end metallurgically joined to the first chip contact and a second end metallurgically joined to the first substrate contact. A first end of the second bond element can be metallurgically joined to the first bond element. The second bond element may or may not touch the first chip contact or the substrate contact. A third bond element can be joined to ends of first and second bond elements which are joined to substrate contacts or to chip contacts. In one embodiment, a bond element can have a looped connection, having first and second ends joined at a first contact and a middle portion joined to a second contact.

公开(公告)号：US07582832B2

公开(公告)日：2009-09-01

申请号：US11810266

申请日：2007-06-04

申请人： Manfred Reinold ,  Thomas Kaden ,  Immanuel Mueller

发明人： Manfred Reinold ,  Thomas Kaden ,  Immanuel Mueller

IPC分类号： H01R4/18

CPC分类号： H01R43/0207 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40091 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49174 ,  H01L2224/49426 ,  H01L2224/49427 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/2076 ,  H01R4/02 ,  Y10T29/49201 ,  H01L2924/20752 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A bond between two contact surfaces using at least two bonding wires, as well as a method for producing such a bond. The bonding wires are positioned one above the other and are conductively interconnected.

摘要翻译： 使用至少两个接合线的两个接触表面之间的接合以及用于制造这种接合的方法。 接合线一个位于另一个上并且导电互连。

公开(公告)号：US20240258212A1

公开(公告)日：2024-08-01

申请号：US18161451

申请日：2023-01-30

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Rajen MURUGAN ,  Yiqi TANG ,  Sylvester ANKAMAH-KUSI

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/49562 ,  H01L21/565 ,  H01L23/3114 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16265 ,  H01L2224/48175 ,  H01L2224/48265 ,  H01L2224/49107 ,  H01L2224/49421 ,  H01L2224/49427 ,  H01L2924/1205 ,  H01L2924/1206

摘要： A packaged semiconductor device includes a lead frame and a semiconductor die. The semiconductor die has first and second opposing sides, and the first side of the die is mounted to the lead frame. A first set of bond wires and/or bump bonds are configured to electrically couple the die to the lead frame. A passive circuit element is on a substrate, and the substrate is mounted to the second side of the die. A second set of bond wires and/or bump bonds are configured to electrically couple the passive circuit element to the die. A molding material is configured to encapsulate the passive circuit element, the die, and at least a portion of the lead frame.

公开(公告)号：US08410618B2

公开(公告)日：2013-04-02

申请号：US13196192

申请日：2011-08-02

申请人： Belgacem Haba ,  Philip Damberg ,  Philip R. Osborn

发明人： Belgacem Haba ,  Philip Damberg ,  Philip R. Osborn

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49816 ,  H01L21/50 ,  H01L23/13 ,  H01L23/49861 ,  H01L24/01 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/91 ,  H01L2224/05554 ,  H01L2224/40091 ,  H01L2224/40225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/4813 ,  H01L2224/4824 ,  H01L2224/4846 ,  H01L2224/48465 ,  H01L2224/48477 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/4942 ,  H01L2224/49427 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/85051 ,  H01L2224/85191 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/48095 ,  H01L2224/37099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive bond element can electrically connect the first chip contact with a second substrate contact. The first bond element can have a first end metallurgically joined to the first chip contact and a second end metallurgically joined to the first substrate contact. A first end of the second bond element can be metallurgically joined to the first bond element. The second bond element may or may not touch the first chip contact or the substrate contact. A third bond element can be joined to ends of first and second bond elements which are joined to substrate contacts or to chip contacts. In one embodiment, a bond element can have a looped connection, having first and second ends joined at a first contact and a middle portion joined to a second contact.

摘要翻译： 微电子组件包括半导体芯片，其具有在第一面处露出的芯片触点和与芯片的表面并置的衬底。 导电接合元件可以将第一芯片触点与衬底的第一衬底接触电连接，并且第二导电结合元件可以将第一芯片触点与第二衬底触点电连接。 第一结合元件可以具有冶金地连接到第一芯片触点的第一端和冶金地连接到第一衬底触点的第二端。 第二结合元件的第一端可以冶金地连接到第一结合元件。 第二结合元件可以或可以不接触第一芯片触点或基板触点。 第三接合元件可以连接到第一和第二接合元件的端部，所述第一和第二接合元件连接到衬底触点或芯片触点。 在一个实施例中，接合元件可以具有环形连接，其具有在第一接触处连接的第一端和第二端以及与第二接触接合的中间部。

公开(公告)号：US20070057350A1

公开(公告)日：2007-03-15

申请号：US11224301

申请日：2005-09-13

申请人： Ralf Otremba

发明人： Ralf Otremba

IPC分类号： H01L23/495

CPC分类号： H01L23/49562 ,  H01L23/49524 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/37124 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49427 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/20753 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2924/2076

摘要： A semiconductor component includes at least one semiconductor power switch, wherein a gate electrode and at least two source regions are disposed on the upper side of the semiconductor power switch. The component further includes a leadframe including a die pad and a number of leads disposed on one side of the die pad. A number of connectors extends between the source regions and the source leads such that each source lead is electrically connected to each source region.

公开(公告)号：US20060186554A1

公开(公告)日：2006-08-24

申请号：US11351988

申请日：2006-02-10

申请人： Ralf Otremba

发明人： Ralf Otremba

IPC分类号： H01L23/52

CPC分类号： H01L24/48 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49844 ,  H01L24/45 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/49174 ,  H01L2224/49426 ,  H01L2224/49427 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device (7) has a number of bonding leads (1, 2, 3) with more than one individual bonding lead (1) being arranged on an individual contact area (4) of a semiconductor chip (5) or a wiring component (6) of the semiconductor device (7). The bonding leads (1, 2 and 3) of a stack (8) form ohmic transitions (12, 13) in their boundary layers. For this purpose, the stacked contact elements (9, 10) have different materials with a different material composition.

摘要翻译： 半导体器件（7）具有多个接合引线（1,2,3），多个单独的接合引线（1）布置在半导体芯片（5）的单个接触区域（4）上或布线部件 （6）。 堆叠（8）的接合引线（1,2和3）在它们的边界层中形成欧姆跃迁（12,13）。 为此，堆叠的接触元件（9,10）具有不同的材料，具有不同的材料组成。

公开(公告)号：US20180005979A1

公开(公告)日：2018-01-04

申请号：US15199548

申请日：2016-06-30

申请人： Simon Savard

发明人： Simon Savard

IPC分类号： H01L23/00 ,  B23K20/10

CPC分类号： H01L24/85 ,  H01L21/48 ,  H01L21/50 ,  H01L23/48 ,  H01L24/09 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2223/6611 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/78601 ,  H01L2224/78611 ,  H01L2224/78621 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2224/05599

摘要： A wedge bonding method for simultaneously connecting two wires to a first component and then to a second component includes a) feeding the two wires side by side through a guide channel located at a lower end of a bonding wedge tool, b) positioning the bonding wedge tool over the first component and performing a first bond connection thereon, c) positioning the bonding wedge tool over the second component and performing a second bond connection thereon; and d) breaking tails of the two wires near the second bond connection.

公开(公告)号：US20140124565A1

公开(公告)日：2014-05-08

申请号：US14154300

申请日：2014-01-14

申请人： Tessera, Inc.

发明人： Belgacem Haba ,  Philip Damberg ,  Philip R. Osborn

IPC分类号： H01L23/00

CPC分类号： H01L23/49816 ,  H01L21/50 ,  H01L23/13 ,  H01L23/49861 ,  H01L24/01 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/91 ,  H01L2224/05554 ,  H01L2224/40091 ,  H01L2224/40225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/4813 ,  H01L2224/4824 ,  H01L2224/4846 ,  H01L2224/48465 ,  H01L2224/48477 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/4942 ,  H01L2224/49427 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/85051 ,  H01L2224/85191 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/48095 ,  H01L2224/37099 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2924/206

摘要： First and second bond elements, e.g., wire bonds, electrically connect a chip contact with one or more substrate contacts of a substrate, and can be arranged so that the second bond element is joined to the first bond element at each end and so that the second bond element does not touch the chip contact or one or more substrate contacts. A third bond element can be joined to ends of the first and second bond elements. In one embodiment, a bond element can have a looped connection, having first and second ends joined at a first contact and a middle portion joined to a second contact.

摘要翻译： 第一和第二接合元件，例如引线键合，将芯片接触件与衬底的一个或多个衬底触点电连接，并且可以被布置成使得第二接合元件在每个端部与第一接合元件接合， 第二接合元件不接触芯片接触或一个或多个衬底触点。 第三接合元件可以连接到第一和第二接合元件的端部。 在一个实施例中，接合元件可以具有环形连接，其具有在第一接触处连接的第一端和第二端以及与第二接触连接的中间部。