公开(公告)号：US20240258212A1

公开(公告)日：2024-08-01

申请号：US18161451

申请日：2023-01-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rajen MURUGAN ,  Yiqi TANG ,  Sylvester ANKAMAH-KUSI

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49562 ,  H01L21/565 ,  H01L23/3114 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16265 ,  H01L2224/48175 ,  H01L2224/48265 ,  H01L2224/49107 ,  H01L2224/49421 ,  H01L2224/49427 ,  H01L2924/1205 ,  H01L2924/1206

Abstract: A packaged semiconductor device includes a lead frame and a semiconductor die. The semiconductor die has first and second opposing sides, and the first side of the die is mounted to the lead frame. A first set of bond wires and/or bump bonds are configured to electrically couple the die to the lead frame. A passive circuit element is on a substrate, and the substrate is mounted to the second side of the die. A second set of bond wires and/or bump bonds are configured to electrically couple the passive circuit element to the die. A molding material is configured to encapsulate the passive circuit element, the die, and at least a portion of the lead frame.

公开(公告)号：US20240429216A1

公开(公告)日：2024-12-26

申请号：US18650795

申请日：2024-04-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jie CHEN ,  Rajen MURUGAN ,  Sylvester ANKAMAH-KUSI ,  Harshpreet Singh Phull BAKSHI ,  Jonathan NOQUIL

IPC: H01L25/16 ,  H01L21/48 ,  H01L23/00 ,  H01L23/13 ,  H01L23/498

Abstract: An example method includes forming a cavity in a multi-layer substrate of a leadframe. The cavity extends from a first substrate surface of the leadframe into the multi-layer substrate to define a cavity floor spaced from the first substrate surface by a cavity sidewall, and at least one conductive terminal is on the cavity floor. The method also includes placing an inductor module in the cavity, in which the inductor module includes a conductor embedded within a dielectric substrate between spaced apart first and second inductor terminals of the inductor module. The method also includes coupling at least one of the first and second inductor terminals to the at least one conductive terminal on the cavity floor. The method also includes encapsulating the inductor module and at least a portion of the leadframe with a mold compound.

公开(公告)号：US20240006742A1

公开(公告)日：2024-01-04

申请号：US17854197

申请日：2022-06-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yiqi TANG ,  Rajen MURUGAN

IPC: H01Q1/22 ,  H01Q1/42 ,  H01Q9/04

CPC classification number: H01Q1/2283 ,  H01Q1/422 ,  H01Q9/0407

Abstract: One example includes an antenna-on-package system that includes a multi-layer antenna structure. The antenna structure includes a first conductive layer having a patch antenna and a transmission line. The transmission line extends from a feed-side edge of the patch antenna to terminate in a launch structure. The antenna structure also includes a second conductive layer having a ground reflector spaced apart from the first conductive layer by a layer of dielectric material. An integrated circuit (IC) die has a signal terminal on surface of the IC die, and a conductive signal interconnect extends through the layer of dielectric material and is coupled between the signal terminal and the launch structure.