公开(公告)号：US20240429216A1

公开(公告)日：2024-12-26

申请号：US18650795

申请日：2024-04-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jie CHEN ,  Rajen MURUGAN ,  Sylvester ANKAMAH-KUSI ,  Harshpreet Singh Phull BAKSHI ,  Jonathan NOQUIL

IPC: H01L25/16 ,  H01L21/48 ,  H01L23/00 ,  H01L23/13 ,  H01L23/498

Abstract: An example method includes forming a cavity in a multi-layer substrate of a leadframe. The cavity extends from a first substrate surface of the leadframe into the multi-layer substrate to define a cavity floor spaced from the first substrate surface by a cavity sidewall, and at least one conductive terminal is on the cavity floor. The method also includes placing an inductor module in the cavity, in which the inductor module includes a conductor embedded within a dielectric substrate between spaced apart first and second inductor terminals of the inductor module. The method also includes coupling at least one of the first and second inductor terminals to the at least one conductive terminal on the cavity floor. The method also includes encapsulating the inductor module and at least a portion of the leadframe with a mold compound.