Patent search cpc:"H01L2224/43847" Page 1

1.

发明授权
Heavy-wire bond arrangement and method for producing same 有权

公开(公告)号：US09992861B2

公开(公告)日：2018-06-05

申请号：US13878787

申请日：2011-08-07

Applicant: Andreas Middendorf

Inventor： Andreas Middendorf

IPC: H01L29/40 , H05K1/02 , H01L23/00 , H05K3/32

CPC classification number: H05K1/0271 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/43847 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48247 , H01L2224/48455 , H01L2224/48456 , H01L2224/4847 , H01L2224/48699 , H01L2224/85939 , H01L2224/85947 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/2076 , H05K3/32 , Y10T29/4913 , H01L2924/00 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20756 , H01L2924/20755 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/00015 , H01L2224/05599

Abstract: The invention relates to a heavy-wire bond arrangement, having a substrate (2), a heavy wire (1) and a high-voltage heavy-wire bond connection, in which an end bond section (4) of the heavy wire (1), which extends towards the end (7) of the heavy wire (1), is bonded to the substrate (2), such that in the area of the bond section (4) a bond contact (5) between the heavy wire (1) and the substrate (2) is formed, the heavy wire (1) having a tapering section (6) which adjoins the end of the wire (7) and in which the wire cross-section tapers towards the end of the wire (7). The application additionally relates to a method for producing a heavy-wire bond arrangement.

2.

发明申请
PROCESS FOR MANUFACTURING OF A THICK COPPER WIRE FOR BONDING APPLICATIONS 审中-公开

公开(公告)号：US20170200534A1

公开(公告)日：2017-07-13

申请号：US15325338

申请日：2015-04-28

Applicant: Heraeus Deutschland GmbH & Co. KG

Inventor： Eugen MILKE , Larbi AINOUZ , Peter PRENOSIL

IPC: H01B13/00 , B21C1/02 , C22C9/00 , C23C30/00 , H01B1/02 , C22F1/08

CPC classification number: H01B13/0006 , B21C1/02 , C22C9/00 , C22F1/008 , C22F1/08 , C23C30/005 , H01B1/026 , H01B13/0016 , H01B13/0036 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/4312 , H01L2224/4321 , H01L2224/4382 , H01L2224/43847 , H01L2224/43848 , H01L2224/45014 , H01L2224/45015 , H01L2224/45016 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45639 , H01L2224/45644 , H01L2224/45655 , H01L2224/45664 , H01L2224/45666 , H01L2224/45669 , H01L2224/45671 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/85065 , H01L2224/85075 , H01L2924/00011 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00015 , H01L2924/20759 , H01L2924/2076 , H01L2924/01201 , H01L2924/01202 , H01L2924/01203 , H01L2924/01204 , H01L2924/01001 , H01L2924/01007 , H01L2924/01046 , H01L2924/01047 , H01L2924/01005 , H01L2924/013 , H01L2924/00013 , H01L2924/00012 , H01L2924/01015 , H01L2924/01033 , H01L2924/00 , H01L2924/206

Abstract: A process for manufacturing a bonding wire containing a core having a surface. The core contains ≧98.0% copper and has a cross sectional area of 75,00 to 600,000 μm2 and an elastic limit RP0.2 (yield strength) of 40 to 95 N/mm2. The process involves (a) providing a copper core precursor; (b) drawing the precursor until a final diameter of the wire core is reached; and (c) annealing the drawn wire at a minimum annealing temperature of 650 to 1000° C. through its entire cross section for a minimum annealing time of 4 seconds to 2 hours.

3.

发明申请
QUAD FLAT NO LEAD PACKAGE AND PRODUCTION METHOD THEREOF 有权
Title translation: 四边形无铅包装及其生产方法

公开(公告)号：US20150102476A1

公开(公告)日：2015-04-16

申请号：US14367788

申请日：2012-08-31

Applicant: Wenhui Zhu , Wei Mu , Zhaoming Xu , Xiaowei Guo

Inventor： Wenhui Zhu , Wei Mu , Zhaoming Xu , Xiaowei Guo

IPC: H01L23/495 , H01L23/00

CPC classification number: H01L23/49524 , H01L21/4832 , H01L23/3107 , H01L23/3121 , H01L23/49541 , H01L23/49579 , H01L23/49582 , H01L24/03 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/0311 , H01L2224/03614 , H01L2224/0381 , H01L2224/29155 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2224/32257 , H01L2224/43847 , H01L2224/4502 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/83855 , H01L2224/85181 , H01L2224/85455 , H01L2224/85464 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/43

Abstract: The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an IC chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the IC chip; the IC chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the IC chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package. The quad flat no lead package is manufactured through the following steps of: thinning and scribing a wafer; manufacturing a lead frame; loading the chip; performing pressure welding and plastic packaging; performing post-curing; printing; electroplating; separating the leads; separating a product; and testing/braiding. According to the package, the problems of few leads, long welding wire, high welding cost and limited frequency application during single-face packaging of the existing normal quad flat no lead package are solved.

Abstract translation: 本发明公开了一种四边形无铅封装及其制造方法。四边形无铅封装包括由载体凹坑和布置在载体凹坑周围的三个引线组成的引线框载体，其中三个引线圈分别由相互断开的多个引线组成; IC芯片粘附在载体坑中; 并在所有的引线上镀上一个内引铅化学镍和斑铜矿镀层; 内部引线化学镍和长磷石镀层沿与IC芯片相同的方向排列; IC芯片通过接合线与内引线化学镍和卟啉镀层连接; 和IC芯片，镀有内引线化学镀镍和钯金属层的所有引线的端部和接合线全部封装在塑料封装中。通过以下步骤制造四边形扁平无铅封装：薄片化和刻划晶片; 制造引线框架; 加载芯片; 执行压焊和塑料包装; 执行后固化; 打印; 电镀; 分离引线; 分离产品; 和测试/编织。根据封装，解决了现有普通四边形无铅封装单面封装时引线少，焊丝长，焊接成本高，应用频率有限的问题。

4.

发明授权
Method and device for fabricating bonding wires on the basis of microelectronic manufacturing techniques 有权
Title translation: 在微电子制造技术的基础上制造接合线的方法和装置

公开(公告)号：US08561446B2

公开(公告)日：2013-10-22

申请号：US12562556

申请日：2009-09-18

Applicant: Matthias Lehr , Frank Kuechenmeister , Frank Seliger

Inventor： Matthias Lehr , Frank Kuechenmeister , Frank Seliger

IPC: B21C3/02 , B21C1/00

CPC classification number: B21C3/02 , B21C3/04 , H01L24/43 , H01L24/45 , H01L24/745 , H01L2224/05624 , H01L2224/4321 , H01L2224/43847 , H01L2224/45012 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48624 , H01L2224/48724 , H01L2224/745 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01057 , H01L2924/01068 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/1306 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00 , H01L2224/48824 , H01L2924/00015

Abstract: Bonding wires for sophisticated bonding applications may be efficiently formed on the basis of a corresponding template device that may be formed on the basis of semiconductor material, such as silicon, in combination with associated fabrication techniques, such as lithography and etch techniques. Hence, any appropriate diameter and cross-sectional shape may be obtained with a high degree of accuracy and reliability.

Abstract translation: 可以基于可以基于诸如硅的半导体材料形成的相应的模板装置，结合相关的制造技术，例如光刻和蚀刻技术，有效地形成用于复杂粘合应用的粘合线。因此，可以以高精度和可靠性获得任何适当的直径和横截面形状。

5.

发明申请
CORE-JACKET BONDING WIRE 有权

公开(公告)号：US20130213689A1

公开(公告)日：2013-08-22

申请号：US13811419

申请日：2011-07-18

Applicant: Poh Yoong Kong

Inventor： Eugen Milke , Jürgen Dick , Peter Prenosil , Frank-Werner Wulff

IPC: H01B5/02 , B21F45/00

CPC classification number: H01B5/02 , B21F45/00 , H01L24/43 , H01L24/45 , H01L2224/4321 , H01L2224/4381 , H01L2224/43825 , H01L2224/43826 , H01L2224/43847 , H01L2224/43848 , H01L2224/45012 , H01L2224/45014 , H01L2224/45015 , H01L2224/45016 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45624 , H01L2224/45644 , H01L2224/45664 , H01L2224/45686 , H01L2224/45687 , H01L2224/85001 , H01L2224/85207 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/01061 , H01L2924/01068 , H01L2924/01074 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00015 , H01L2224/45164 , H01L2924/00012 , H01L2924/00 , H01L2224/48 , H01L2924/01083 , H01L2924/01049

Abstract: A bonding wire is provided containing a wire core made of a first material containing a metal and a wire jacket that envelopes the wire core and is made of a second material containing a metal. The wire core and the wire jacket are made of different metals and the bonding wire has an aspect ratio of no more than 0.8. The bonding wire efficiently prevents damage to bonding surfaces during the bonding process and short-circuiting during the use of corresponding sub-assemblies.

Abstract translation: 提供了一种接合线，其包含由包含金属的第一材料制成的线芯和包围线芯的线夹套，并且由包含金属的第二材料制成。线芯和电线护套由不同的金属制成，接合线的纵横比不大于0.8。接合线在使用相应的子组件期间有效地防止在接合过程中的接合表面的损坏和短路。

6.

发明申请
ALUMINUM RIBBON FOR ULTRASONIC BONDING 审中-公开
Title translation: 用于超声波接合的铝合金

公开(公告)号：US20130164559A1

公开(公告)日：2013-06-27

申请号：US13392754

申请日：2010-09-09

Applicant: Michitaka Mikami , Teruo Kikuchi , Shinichiro Nakashima , Yuichi Hirata , Masaharu Nakamura , Keisuke Kimura

Inventor： Michitaka Mikami , Teruo Kikuchi , Shinichiro Nakashima , Yuichi Hirata , Masaharu Nakamura , Keisuke Kimura

IPC: C22C21/00

CPC classification number: H01L24/45 , H01L24/43 , H01L2224/43847 , H01L2224/43848 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01049 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01079 , H01L2924/01082 , Y10T428/12993 , H01L2924/01202 , H01L2924/01028 , H01L2924/01014 , H01L2924/01003 , H01L2924/01004 , H01L2924/01039 , H01L2924/01083 , H01L2924/013 , H01L2924/00 , H01L2224/48 , H01L2924/12 , H01L2924/14 , H01L2924/00013 , H01L2924/206

Abstract: [Problem to be Solved]The invention providesa bonding ribbon which can guarantee a uniform fusing over the entire joint area throughout hundreds of thousands of continuous ultrasonic bonding cycles and which can realize an improved bonding strength and which also can avoid being broken while it is looped.[Solution]The aluminum ribbon for ultrasonic bonding is formed of an aluminum alloy with aluminum content of 99 mass % or higher, and this ribbon is characterized in that it is in a shape of an extremely thin tape which is obtained by rolling a wire taken from a multi-stage wire drawing, that an average grain size within the cross section of this ribbon is 5-200 micrometers (μm), that the surface(s) of this extremely thin tape is mirror-finished to an extent that the surface roughness Rz is 2 micrometers (μm) or smaller, and that the ribbon has been subjected to an immersion treatment or a gas-exposure treatment wherein the liquid or gas comprises a substance having a vapor pressure higher than water such as a water-soluble hydrocarbons solvent, an alcoholic solvent, a ketone solvent, or an ether type solvent.

Abstract translation: [待解决的问题]本发明提供了一种粘结带，其能够在数十万次连续超声波接合循环中保证在整个接合区域上的均匀熔合，并且可以实现改进的接合强度，并且还可以避免在环路时破坏。 [解决方案]超声波接合用铝带由铝含量为99质量％以上的铝合金形成，该带的特征在于，其是通过卷绕所获得的线而获得的极薄的带状从多级拉丝中，该带的横截面内的平均晶粒尺寸为5-200微米（mum），这种非常薄的带的表面被镜面加工到表面粗糙度Rz为2微米（小时）以下，并且已对带进行了浸渍处理或气体暴露处理，其中液体或气体包括蒸汽压高于水的物质，例如水溶性烃溶剂，醇溶剂，酮溶剂或醚类溶剂。

7.

发明授权
Semiconductor device and method of manufacturing the same 有权

公开(公告)号：US11901337B2

公开(公告)日：2024-02-13

申请号：US17465511

申请日：2021-09-02

Applicant: Kioxia Corporation

Inventor： Yasuo Otsuka

IPC: H01L25/065 , H01L25/00 , H01L23/00 , H01L21/48 , H01L21/56 , H01L23/498 , H01L25/10

CPC classification number: H01L25/0657 , H01L21/4853 , H01L21/56 , H01L23/49811 , H01L23/49838 , H01L24/43 , H01L25/105 , H01L25/50 , H01L24/45 , H01L2224/4321 , H01L2224/43847 , H01L2224/45144 , H01L2225/0651 , H01L2225/06548 , H01L2225/06562 , H01L2225/06586 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/14511

Abstract: A semiconductor device includes a first wiring substrate having a first surface and a second surface opposite to the first surface, and including a plurality of first electrode pads on the first surface, and a second wiring substrate having a third surface facing the first surface and a fourth surface opposite to the third surface, and including a plurality of second electrode pads on the third surface. A plurality of first semiconductor chips are stacked between the first surface and the third surface. A first columnar electrode extends in an oblique direction with respect to a first direction substantially perpendicular to the first surface and the third surface, and connects between the plurality of first electrode pads and the plurality of second electrode pads. A first resin layer covers the plurality of first semiconductor chips and the first columnar electrode between the first surface and the third surface.