公开(公告)号：US20230163097A1

公开(公告)日：2023-05-25

申请号：US17912527

申请日：2020-12-18

申请人： SHINKAWA LTD.

发明人： Hiroaki YOSHINO ,  Shinsuke TEI

IPC分类号： H01L23/00 ,  B23K20/10

CPC分类号： H01L24/78 ,  H01L24/85 ,  B23K20/10 ,  H01L2224/7855 ,  H01L2224/85181 ,  H01L2224/48465 ,  H01L24/48 ,  H01L2224/78353 ,  H01L2224/789 ,  H01L2224/85205 ,  H01L2224/85947 ,  B23K2101/40

摘要： A wire bonding device for performing a wire bonding process includes: a bonding tool for inserting a wire; an ultrasonic vibrator; a drive mechanism for moving the bonding tool; and a control part. The control part performs: a bonding step of bonding the wire to a bonding point; a tail feeding out step of feeding out a wire tail from the wire bonded to the bonding point; a tension applying step of raising the bonding tool to apply tension to the wire while the wire is clamped; a tension release step of lowering the bonding tool to release the tension applied to the wire; and after performing a series of steps including the tension applying step and the tension release step at least once, a tail cutting step of raising the bonding tool to cut the wire tail from the wire.

公开(公告)号：US20160365498A1

公开(公告)日：2016-12-15

申请号：US15247188

申请日：2016-08-25

申请人： NICHIA CORPORATION

发明人： Akinori YONEDA ,  Akiyoshi KINOUCHI ,  Hisashi KASAI ,  Yoshiyuki AIHARA ,  Hirokazu SASA ,  Shinji NAKAMURA

IPC分类号： H01L33/62 ,  H01L33/56

CPC分类号： H01L33/62 ,  H01L21/6835 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/85 ,  H01L24/96 ,  H01L33/24 ,  H01L33/38 ,  H01L33/387 ,  H01L33/40 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L2021/60 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/04105 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/2401 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/2413 ,  H01L2224/245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48101 ,  H01L2224/4813 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/821 ,  H01L2224/82106 ,  H01L2224/85947 ,  H01L2224/96 ,  H01L2924/0002 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2933/0016 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2224/82

摘要： A light emitting device includes a semiconductor chip including a p-type semiconductor layer and an n-type semiconductor layer, the semiconductor chip being adapted to emit light between the p-type semiconductor layer and the n-type semiconductor layer; a p-side pad electrode disposed on an upper surface side of the semiconductor chip and over the p-type semiconductor layer; an n-side pad electrode disposed on an upper surface side of the semiconductor chip and over the n-type semiconductor layer; a resin layer disposed to cover the upper surface of the semiconductor chip; a p-side connection electrode and an n-side connection electrode disposed at an outer surface of the resin layer and positioned on the upper surface side of the semiconductor chip; and a metal wire disposed in the resin. The metal wire is adapted to make connection at least one of between the p-side pad electrode and the p-side connection electrode, and between the n-side pad electrode and the n-side connection electrode.

公开(公告)号：US20160216728A1

公开(公告)日：2016-07-28

申请号：US14835528

申请日：2015-08-25

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Akihiko HAPPOYA ,  Yoshikazu FURUMIYA

IPC分类号： G06F1/16 ,  H05K3/40 ,  H05K3/10 ,  H05K1/02 ,  H05K1/11

CPC分类号： H01L24/85 ,  G06F1/1658 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/85947 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/1438 ,  H01L2924/1441 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10159 ,  H05K2201/10287 ,  H05K2203/025 ,  H05K2203/049 ,  H01L2224/05599

摘要： An electronic device includes an insulating layer, a first conductor portion disposed in the insulating layer, a second conductor portion disposed on a surface of the insulating layer, and a wiring member disposed within the insulating layer and electrically connecting the first conductor portion and the second conductor portion. The wiring member includes a connection portion welded to the first conductor portion and an extension portion extending from the connection portion to the second conductor portion.

摘要翻译： 电子器件包括绝缘层，设置在绝缘层中的第一导体部分，设置在绝缘层的表面上的第二导体部分和设置在绝缘层内的布线部件，并将第一导体部分和第二导体部分 导体部分。 布线构件包括焊接到第一导体部分的连接部分和从连接部分延伸到第二导体部分的延伸部分。

公开(公告)号：US20160190047A1

公开(公告)日：2016-06-30

申请号：US14902158

申请日：2014-07-02

申请人： ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG

发明人： Sean S. Cahill ,  Eric A. Sanjuan

IPC分类号： H01L23/495 ,  H01L23/498 ,  H01L23/64 ,  H01L21/48 ,  H01L23/66

CPC分类号： H01L23/49541 ,  H01L21/4821 ,  H01L21/4846 ,  H01L23/49506 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/64 ,  H01L23/645 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2224/45541 ,  H01L2224/4555 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/49052 ,  H01L2224/85444 ,  H01L2224/8592 ,  H01L2224/8593 ,  H01L2224/85931 ,  H01L2224/85935 ,  H01L2224/85939 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30111 ,  H01L2924/20654 ,  H01L2224/45099 ,  H01L2924/00

摘要： A die package having a plurality of connection pads, a die substrate supporting a plurality of connection elements, a first lead having a first metal core with a first core diameter, and a dielectric layer surrounding the first metal core, the dielectric layer having a first dielectric thickness that varies along its length and/or the dielectric layer having an outer metal layer at least partially surrounding the dielectric layer, for selectively modifying the electrical characteristics of the lead.

摘要翻译： 具有多个连接焊盘的模具封装，支撑多个连接元件的管芯基板，具有第一芯直径的第一金属芯的第一引线和围绕第一金属芯的介电层，该介电层具有第一 电介质厚度沿其长度变化和/或具有至少部分围绕电介质层的外部金属层的电介质层，用于选择性地修改引线的电特性。

公开(公告)号：US20150311173A1

公开(公告)日：2015-10-29

申请号：US14262381

申请日：2014-04-25

申请人： BURTON J. CARPENTER ,  CHU-CHUNG LEE ,  TU-ANH N. TRAN

发明人： BURTON J. CARPENTER ,  CHU-CHUNG LEE ,  TU-ANH N. TRAN

IPC分类号： H01L23/00

CPC分类号： H01L24/49 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/431 ,  H01L2224/432 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45687 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48451 ,  H01L2224/48456 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85931 ,  H01L2224/85939 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/013 ,  H01L2924/01047 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/00013 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor structure includes a bond pad and a wire bond coupled to the bond pad. The wire bond includes a bond in contact with the bond pad. The wire bond includes a coating on a surface of the wire bond, and a first exposed portion of the wire bond in a selected location. The wire bond is devoid of the coating over the selected location of the wire bond, and an area of the first exposed portion is at least one square micron.

摘要翻译： 半导体结构包括接合焊盘和耦合到接合焊盘的引线键合。 引线键合包括与接合焊盘接触的键。 引线接合包括在引线键合的表面上的涂层，以及在选定位置的引线键合的第一暴露部分。 引线接合在引线键合的选定位置上没有涂层，并且第一暴露部分的面积为至少一平方微米。

公开(公告)号：US08084847B2

公开(公告)日：2011-12-27

申请号：US12486998

申请日：2009-06-18

申请人： Lei Wang ,  Jai-sung Lee ,  Qian Wang ,  Zhenging Zhao

发明人： Lei Wang ,  Jai-sung Lee ,  Qian Wang ,  Zhenging Zhao

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/49572 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/48644 ,  H01L2224/48844 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85444 ,  H01L2224/85947 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A prefabricated lead frame to bond a chip and a substrate, and a bonding method using the prefabricated lead frame. The prefabricated lead frame includes an inner ring, an outer ring, and a plurality of wires, wherein inner ends and outer ends of the wires are respectively connected to the inner ring and the outer ring, and the prefabricated lead frame has a wire shape corresponding to a chip and a substrate to be bonded. The prefabricated lead frame may be manufactured in batch production to increase the manufacturing efficiency of semiconductor devices, and the prefabricated lead frame may be used instead of a general wire bonding process.

摘要翻译： 用于结合芯片和基板的预制引线框架和使用预制引线框架的接合方法。 预制引线框架包括内环，外环和多根电线，其中电线的内端和外端分别连接到内环和外环，并且预制引线框架具有对应的线形状 连接到芯片和待接合的基板。 预制引线框架可以批量生产以提高半导体器件的制造效率，并且可以使用预制引线框架来代替通常的引线接合工艺。

公开(公告)号：US08063318B2

公开(公告)日：2011-11-22

申请号：US12364514

申请日：2009-02-03

申请人： Susan Williams ,  Laval Chung-Long-Shan ,  Kiangkai Tankongchumruskul

发明人： Susan Williams ,  Laval Chung-Long-Shan ,  Kiangkai Tankongchumruskul

IPC分类号： H01L23/28

CPC分类号： H01L21/56 ,  H01L23/3157 ,  H01L24/48 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/78313 ,  H01L2224/83 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2224/8592 ,  H01L2224/8593 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/20753 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2924/20752 ,  H01L2924/20754 ,  H01L2224/05599

摘要： An electronic component that has a support structure with a plurality of electrical conductors, a series of wire bonds, each of the wire bonds extending from one of the electrical conductors respectively, each of the wire bonds having an end section contacting the electrical conductor and an intermediate section contiguous with the end section, a bead of dam encapsulant encapsulating the electrical conductors and the end section of each of the wire bonds, and a bead of fill encapsulant contacting the bead of dam encapsulant and encapsulating the intermediate portion of each of the wire bonds. The dam encapsulant has a higher modulus of elasticity than the fill encapsulant.

摘要翻译： 一种电子部件，其具有带有多个电导体的支撑结构，一系列引线接合，每个引线键分别从一个电导体延伸，每个引线接合具有接触电导体的端部部分和 与端部连续的中间部分，封装电导体的坝密封剂珠和每个引线接合的端部部分，以及填充密封剂珠与坝密封剂的珠接触并封装每根线的中间部分 债券。 坝密封剂具有比填充密封剂更高的弹性模量。

公开(公告)号：US07915091B2

公开(公告)日：2011-03-29

申请号：US12364515

申请日：2009-02-03

申请人： Nadine Lee-Yen Chew ,  Elmer Dimaculangan Perez ,  Kiangkai Tankongchumruskul

发明人： Nadine Lee-Yen Chew ,  Elmer Dimaculangan Perez ,  Kiangkai Tankongchumruskul

IPC分类号： H01L21/44

CPC分类号： H01L21/56 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2224/78 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2224/8592 ,  H01L2224/8593 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/20753 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/20752 ,  H01L2924/20754 ,  H01L2224/05599

摘要： A method of jetting drops of encapsulant from an encapsulant jetter, the drops including primary drops and satellite drops that are much smaller than the primary drops. The method has the steps of providing a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, jetting the drops of encapsulant from the jetter and, inducing a gas flow with a velocity sufficient to draw the satellite drops in a predetermined direction away from the series of wire bonds while having negligible effect on the primary drops.

摘要翻译： 一种从密封剂喷射器喷射密封剂液滴的方法，包括初级滴液和卫星滴液，其比初级液滴小得多。 该方法具有以下步骤：提供将微电子装置电连接到一系列导体的一系列引线键合，从喷射器喷射密封剂液滴并且引导具有足以将卫星墨滴吸入的速度的气流 预定方向远离一系列引线键，同时对初级液滴具有可忽略的影响。

公开(公告)号：US20100244282A1

公开(公告)日：2010-09-30

申请号：US12813472

申请日：2010-06-10

申请人： Kia Silverbrook ,  Laval Chung-Long-Shan ,  Kiangkai Tankongchumruskul

发明人： Kia Silverbrook ,  Laval Chung-Long-Shan ,  Kiangkai Tankongchumruskul

IPC分类号： H01L23/49 ,  H01L23/498

CPC分类号： H01L24/85 ,  H01L21/56 ,  H01L23/3157 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/4899 ,  H01L2224/78313 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2224/8592 ,  H01L2224/8593 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An electronic component assembly that has a supporting structure, an integrated circuit die with a plurality of contacts pads, a printed circuit board with a plurality of conductors, the integrated circuit die and the PCB being mounted to the supporting structure by a die attach film such that they are adjacent and spaced from each other and, wire bonds electrically connecting the contact pads to the conductors. An intermediate portion of each of the wire bonds is adhered to the die attach film to lower the profile of the wire bond arcs.

摘要翻译： 具有支撑结构的电子部件组件，具有多个接触焊盘的集成电路芯片，具有多个导体的印刷电路板，所述集成电路管芯和所述PCB通过管芯附着膜安装到所述支撑结构， 它们彼此相邻并且彼此分开，并且引线将电接触焊盘电连接到导体。 每个线接合的中间部分粘附到管芯附着膜上以降低引线接合弧的轮廓。

公开(公告)号：US07803659B2

公开(公告)日：2010-09-28

申请号：US12611922

申请日：2009-11-03

申请人： Laval Chung-Long-Shan ,  Kiangkai Tankongchumruskul ,  Kia Silverbrook

发明人： Laval Chung-Long-Shan ,  Kiangkai Tankongchumruskul ,  Kia Silverbrook

IPC分类号： H01L21/00

CPC分类号： H01L21/67126 ,  H01L21/56 ,  H01L23/13 ,  H01L24/00 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/78 ,  H01L2224/8592 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/20753 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/20754 ,  H01L2224/05599

摘要： A method encapsulating wire bonds that extend between a die and conductors on a supporting substrate, by contacting an edge of a profiling blade with the encapsulant material to form a bead of the encapsulant on the edge, positioning the edge such that the bead contacts the die and, moving the profiling blade relative to the die to cover the wire bonds with the encapsulant. Wiping the encapsulant over the wire bonds with a profiling blade provides control of the encapsulant front as well as the height of the encapsulant relative to the die. The movement of the profiling surface relative to the die can closely controlled to shape the encapsulant to a desired form. Using the example of a printhead die, the encapsulant can be shaped to present an inclined face rising from the nozzle surface to a high point over the wire bonds. This can be used by the printhead maintenance facilities to maintain contact pressure on the wiping mechanism. However, it will be appreciated that the encapsulant can be shaped to have ridges, gutters, grooves and so on by using a particular shape of profiling blade edge and relative movement with the die.

摘要翻译： 一种封装线接合的方法，其通过使成型叶片的边缘与密封剂材料接触而在模具和导体之间延伸在支撑衬底上，以在边缘上形成密封剂的珠粒，定位边缘使得胎圈与模具接触 并且使成型刀片相对于管芯移动以覆盖与密封剂的引线接合。 通过线材与成型刀片擦拭密封剂提供密封剂前端以及密封剂相对于管芯的高度的控制。 轮廓表面相对于模具的移动可以被紧密地控制，以将密封剂成形为期望的形式。 使用打印头芯片的示例，密封剂可以被成形为呈现从喷嘴表面升高到线接合处的高点的倾斜面。 这可以被打印头维护设施用来保持擦拭机构的接触压力。 然而，应当理解，通过使用特定形状的成型叶片边缘和与模具的相对运动，密封剂可以成形为具有脊，沟槽，凹槽等。