公开(公告)号：US20220328450A1

公开(公告)日：2022-10-13

申请号：US17435696

申请日：2020-07-15

Applicant: SHINKAWA LTD.

Inventor： Hiroaki YOSHINO ,  Shinsuke TEI

IPC: H01L23/00

Abstract: Provided is a method for manufacturing a semiconductor device which connects a first bond point and a second bond point by a wire. The method includes: a ball bonding step in which a crimping ball and a ball neck are formed at the first bond point by ball bonding; a thin-walled portion forming step in which a thin-walled portion having a reduced cross-sectional area is formed between the ball neck and the crimping ball; a wire tail separating step in which after a capillary is raised to unroll a wire tail, the capillary is moved in a direction to the second bond point, and the wire tail and the crimping ball are separated in the thin-walled portion; and a wire tail joining step in which the capillary is lowered and a side surface of the separated wire tail is joined onto the crimping ball.

公开(公告)号：US20230163097A1

公开(公告)日：2023-05-25

申请号：US17912527

申请日：2020-12-18

Applicant: SHINKAWA LTD.

Inventor： Hiroaki YOSHINO ,  Shinsuke TEI

IPC: H01L23/00 ,  B23K20/10

CPC classification number: H01L24/78 ,  H01L24/85 ,  B23K20/10 ,  H01L2224/7855 ,  H01L2224/85181 ,  H01L2224/48465 ,  H01L24/48 ,  H01L2224/78353 ,  H01L2224/789 ,  H01L2224/85205 ,  H01L2224/85947 ,  B23K2101/40

Abstract: A wire bonding device for performing a wire bonding process includes: a bonding tool for inserting a wire; an ultrasonic vibrator; a drive mechanism for moving the bonding tool; and a control part. The control part performs: a bonding step of bonding the wire to a bonding point; a tail feeding out step of feeding out a wire tail from the wire bonded to the bonding point; a tension applying step of raising the bonding tool to apply tension to the wire while the wire is clamped; a tension release step of lowering the bonding tool to release the tension applied to the wire; and after performing a series of steps including the tension applying step and the tension release step at least once, a tail cutting step of raising the bonding tool to cut the wire tail from the wire.

公开(公告)号：US20220208721A1

公开(公告)日：2022-06-30

申请号：US17610445

申请日：2019-05-27

Applicant: SHINKAWA LTD.

Inventor： Hiroaki YOSHINO ,  Shinsuke TEI

IPC: H01L23/00

Abstract: This wire bonding apparatus has a capillary, a movement mechanism moving the capillary, and a control unit controlling driving of the movement mechanism. The control unit at least causes execution of: a first process (trajectory a) of lowering the capillary, after a FAB is formed, to pressure bonding height at a first bonding point to form a pressure bonded ball and a column part at the first bonding point; a second process (trajectory b) of moving the capillary horizontally at the pressure bonding height after execution of the first process to scarp off the column part by the capillary; and a third process (trajectory c-k) of repeating a pressing operation at least once after execution of the second process, the pressing operation involving moving the capillary forward and lowering the capillary temporarily during movement so that the capillary presses down on a wire portion positioned over the pressure bonded ball.