公开(公告)号：US09935028B2

公开(公告)日：2018-04-03

申请号：US14142823

申请日：2013-12-28

申请人： Global Circuit Innovations Incorporated

发明人： Erick Merle Spory

IPC分类号： H01L21/00 ,  H01L23/20 ,  H01L23/00 ,  H01L23/26 ,  H01L21/50 ,  H01L21/48 ,  H01L23/04 ,  H01L23/495 ,  H01L23/498 ,  H01L23/10

CPC分类号： H01L23/20 ,  H01L21/4803 ,  H01L21/4817 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/26 ,  H01L23/49513 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49861 ,  H01L23/564 ,  H01L24/24 ,  H01L24/25 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24175 ,  H01L2224/245 ,  H01L2224/25171 ,  H01L2224/2731 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/82102 ,  H01L2224/82103 ,  H01L2224/82214 ,  H01L2224/82815 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00015 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3656 ,  H01L2924/3861 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/00

摘要： A method for assembling a packaged integrated circuit is provided. The method includes placing a die into a cavity of a package base, securing the die to the package base with a die attach adhesive, printing a bond connection between a die pad of the die and a lead of the package base or a downbond, and sealing a package lid to the package base.

公开(公告)号：US09824948B2

公开(公告)日：2017-11-21

申请号：US14600733

申请日：2015-01-20

申请人： Global Circuit Innovations Incorporated

发明人： Erick Merle Spory

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/20 ,  H01L23/00 ,  H01L23/26 ,  H01L21/50 ,  H01L21/48 ,  H01L23/04 ,  H01L23/495 ,  H01L23/498 ,  H01L23/10

CPC分类号： H01L23/20 ,  H01L21/4803 ,  H01L21/4817 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/26 ,  H01L23/49513 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49861 ,  H01L23/564 ,  H01L24/24 ,  H01L24/25 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24175 ,  H01L2224/245 ,  H01L2224/25171 ,  H01L2224/2731 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/82102 ,  H01L2224/82103 ,  H01L2224/82214 ,  H01L2224/82815 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00015 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3656 ,  H01L2924/3861 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/00

摘要： A packaged integrated circuit is provided. The packaged integrated circuit includes a die, a package including a base, a lid, and a plurality of package leads, and die attach adhesive for securing the die to the package base. the die includes a plurality of die pads. The die is secured to the base with the die attach adhesive. After the die is secured to the base, at least one of the plurality of die pads is electrically connected to at least one of the plurality of package leads with a printed bond connection. After printing the bond connection, the lid is sealed to the base.

公开(公告)号：US5415922A

公开(公告)日：1995-05-16

申请号：US939966

申请日：1992-09-04

申请人： Kohei Tatsumi ,  Hiroyuki Kondo ,  Ryoichi Suzuki ,  Toru Bando ,  Soichi Kadoguchi

发明人： Kohei Tatsumi ,  Hiroyuki Kondo ,  Ryoichi Suzuki ,  Toru Bando ,  Soichi Kadoguchi

IPC分类号： H01L21/60 ,  H01L23/49 ,  C22C5/02 ,  D02G3/00

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01204 ,  H01L2924/14 ,  H01L2924/20753 ,  H01L2924/3861 ,  Y10T428/12431 ,  Y10T428/2929 ,  Y10T428/2931 ,  Y10T428/2933 ,  Y10T428/2975

摘要： A resin-coated, bonding fine wire for use in forming bonded electrical connections on a semiconductor device, wherein the wire is characterized as having a tensile strength exceeded when the wire is further elongated in length in a range of 0.5% to 3.5% of its original length by breaking of the wire during tension testing. It has been determined that an insulated bonding fine wire exhibiting such relatively low ductility produces a loop profile maintainable in a stable condition during a bonding operation while providing reliable bonding strength.

摘要翻译： 一种用于在半导体器件上形成接合电连接的树脂涂覆的接合细线，其中所述线的特征在于当所述线长度在其的0.5％至3.5％的范围内进一步延长时，具有超过的拉伸强度 在拉伸试验过程中断线时的原始长度。 已经确定，具有这种相对低的延展性的绝缘接合细线在粘合操作期间产生保持在稳定状态下的环形轮廓，同时提供可靠的接合强度。

公开(公告)号：US20240030190A1

公开(公告)日：2024-01-25

申请号：US18449394

申请日：2023-08-14

申请人： CHANGXIN MEMORY TECHNOLOGIES, INC.

发明人： Honglong SHI

IPC分类号： H01L25/065 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L24/48 ,  H01L24/49 ,  H01L24/32 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/49105 ,  H01L2224/32225 ,  H01L2224/32145 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2224/49174 ,  H01L2924/3861

摘要： A semiconductor stack structure at least includes: a substrate; connection pads located on a surface of the substrate; and a plurality of semiconductor dies located on the surface of the substrate and stacked in sequence in a first direction, the first direction being a thickness direction of the substrate. Each two adjacent semiconductor dies located in a same signal channel are connected to a same connection pad, and two semiconductor dies connected to a same connection pad are respectively located in a first channel region and a second channel region of a signal channel.

公开(公告)号：US20180053702A1

公开(公告)日：2018-02-22

申请号：US15792225

申请日：2017-10-24

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： H01L23/20 ,  H01L23/00 ,  H01L21/48 ,  H01L23/04 ,  H01L23/495 ,  H01L23/498 ,  H01L21/50 ,  H01L23/26

CPC分类号： H01L23/20 ,  H01L21/4803 ,  H01L21/4817 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/26 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49861 ,  H01L23/564 ,  H01L24/24 ,  H01L24/25 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24175 ,  H01L2224/245 ,  H01L2224/25171 ,  H01L2224/2731 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48 ,  H01L2224/73267 ,  H01L2224/82102 ,  H01L2224/82103 ,  H01L2224/82214 ,  H01L2224/82815 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3656 ,  H01L2924/3861

摘要： A method is provided. The method includes one or more of removing existing ball bonds from an extracted die, placing the extracted die into a recess of a hermetic substrate, the extracted die having a centered orientation in the recess, and applying a side fill compound into the recess between the extracted die and the hermetic substrate. The method also includes 3D printing, by a 3D printer, a plurality of bond connections between die pads of the extracted die and first bond pads of the hermetic substrate in order to create a 3D printed die substrate, and 3D printing a hermetic encapsulation over the die, the side fill compound, and the 3D printed bond connections in order to create a hermetic assembly. The extracted die includes a fully functional semiconductor die removed from a previous package. The hermetic substrate includes the first bond pads coupled to second bond pads.

公开(公告)号：US20180040529A1

公开(公告)日：2018-02-08

申请号：US15792381

申请日：2017-10-24

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： H01L23/20 ,  H01L21/48 ,  H01L23/04 ,  H01L23/498 ,  H01L21/50 ,  H01L23/26 ,  H01L23/00 ,  H01L23/495

CPC分类号： H01L23/20 ,  H01L21/4803 ,  H01L21/4817 ,  H01L21/4867 ,  H01L21/50 ,  H01L23/04 ,  H01L23/057 ,  H01L23/10 ,  H01L23/26 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/564 ,  H01L24/24 ,  H01L24/25 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24175 ,  H01L2224/245 ,  H01L2224/25171 ,  H01L2224/2731 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48 ,  H01L2224/82102 ,  H01L2224/82103 ,  H01L2224/82214 ,  H01L2224/82815 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3656 ,  H01L2924/3861

摘要： An integrated circuit is provided. The integrated circuit includes a package base including package leads, an extracted die removed from a previous packaged integrated circuit, and an an interposer bonded to the extracted die and the package base. The extracted die includes original bond pads and one or more original ball bonds on the original bond pads. The interposer includes first bond pads electrically connected to the original bond pads with 3D printed first bond connections conforming to the shapes and surfaces of the extracted die and the interposer and second bond pads electrically connected to the package leads with 3D printed second bond connections conforming to shapes and surfaces of the interposer and package base.

公开(公告)号：US08299356B2

公开(公告)日：2012-10-30

申请号：US12669662

申请日：2008-12-02

申请人： Tomohiro Uno ,  Keiichi Kimura ,  Takashi Yamada

发明人： Tomohiro Uno ,  Keiichi Kimura ,  Takashi Yamada

IPC分类号： H01B7/00

CPC分类号： C22C5/04 ,  B23K35/0222 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  C22C5/02 ,  C22C5/06 ,  C22C9/00 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45673 ,  H01L2224/45676 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4851 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3861 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01083 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/20652 ,  H01L2924/20656 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/00014 ,  H01L2924/01202 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/45671 ,  H01L2224/45666 ,  H01L2924/0104 ,  H01L2924/01007 ,  H01L2924/01018 ,  H01L2924/01001 ,  H01L2924/20658 ,  H01L2924/20654 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/2075 ,  H01L2924/01049 ,  H01L2924/01006

摘要： A semiconductor-device bonding wire includes a core member formed of an electrically-conductive metal, and a skin layer mainly composed of a face-centered cubic metal different from the core member and formed thereon. An orientation ratio of orientations in crystalline orientations in a wire lengthwise direction at a crystal face of a surface of the skin layer is greater than or equal to 50%, and the orientations have an angular difference relative to the wire lengthwise direction, the angular difference being within 15 degrees.

摘要翻译： 半导体器件接合线包括由导电金属形成的芯部件和主要由与芯部件不同的面心立方金属形成的表皮层。 在表层的表面的晶面处的线长度方向上的结晶取向<111k方向的取向比大于或等于50％，并且<111>取向具有相对的角度差 在线长度方向上，角度差在15度以内。

公开(公告)号：US10002846B2

公开(公告)日：2018-06-19

申请号：US15792414

申请日：2017-10-24

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： H01L23/00 ,  B29C64/10

CPC分类号： H01L24/80 ,  B29C64/10 ,  H01L21/4803 ,  H01L21/4817 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/20 ,  H01L23/26 ,  H01L23/49805 ,  H01L23/564 ,  H01L24/03 ,  H01L24/24 ,  H01L24/25 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24175 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25171 ,  H01L2224/2731 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/82102 ,  H01L2224/82103 ,  H01L2224/82214 ,  H01L2224/82815 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2924/00015 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3656 ,  H01L2924/3861 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/00

摘要： A method is provided. The method includes removing an extracted die including an original ball bond from a previous packaged integrated circuit, bonding the extracted die to an interposer to create a remapped extracted die, 3D printing one or more first bond connections between one or more original bond pads of the extracted die and one or more first bond pads of the interposer, securing the remapped extracted die to a package base, and 3D printing one or more second bond connections between one or more second bond pads of the interposer and one or more package leads or downbonds of the package base. The one or more first and second bond connections conform to the shapes and surfaces of the extracted die, the interposer, and the package base.

公开(公告)号：US20180047700A1

公开(公告)日：2018-02-15

申请号：US15792414

申请日：2017-10-24

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： H01L23/00 ,  B29C64/10

CPC分类号： H01L24/80 ,  B29C64/10 ,  H01L21/4803 ,  H01L21/4817 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/20 ,  H01L23/26 ,  H01L23/49861 ,  H01L23/564 ,  H01L24/03 ,  H01L24/24 ,  H01L24/25 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24175 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25171 ,  H01L2224/2731 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/82102 ,  H01L2224/82103 ,  H01L2224/82214 ,  H01L2224/82815 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2924/00015 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3656 ,  H01L2924/3861 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/00

摘要： A method is provided. The method includes removing an extracted die including an original ball bond from a previous packaged integrated circuit, bonding the extracted die to an interposer to create a remapped extracted die, 3D printing one or more first bond connections between one or more original bond pads of the extracted die and one or more first bond pads of the interposer, securing the remapped extracted die to a package base, and 3D printing one or more second bond connections between one or more second bond pads of the interposer and one or more package leads or downbonds of the package base. The one or more first and second bond connections conform to the shapes and surfaces of the extracted die, the interposer, and the package base.

公开(公告)号：US20160181171A1

公开(公告)日：2016-06-23

申请号：US14600733

申请日：2015-01-20

申请人： Global Circuit Innovations Incorporated

发明人： Erick Merle Spory

IPC分类号： H01L23/20 ,  H01L21/48 ,  H01L23/498 ,  H01L23/495 ,  H01L23/04 ,  H01L23/00 ,  H01L23/26

CPC分类号： H01L23/20 ,  H01L21/4803 ,  H01L21/4817 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/26 ,  H01L23/49513 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49861 ,  H01L23/564 ,  H01L24/24 ,  H01L24/25 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24175 ,  H01L2224/245 ,  H01L2224/25171 ,  H01L2224/2731 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/82102 ,  H01L2224/82103 ,  H01L2224/82214 ,  H01L2224/82815 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00015 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3656 ,  H01L2924/3861 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/00

摘要： A packaged integrated circuit is provided. The packaged integrated circuit includes a die, a package including a base, a lid, and a plurality of package leads, and die attach adhesive for securing the die to the package base. the die includes a plurality of die pads. The die is secured to the base with the die attach adhesive. After the die is secured to the base, at least one of the plurality of die pads is electrically connected to at least one of the plurality of package leads with a printed bond connection. After printing the bond connection, the lid is sealed to the base.

摘要翻译： 提供封装的集成电路。 封装的集成电路包括管芯，包括基座，盖子和多个封装引线的封装以及用于将管芯固定到封装基座的管芯附着粘合剂。 管芯包括多个管芯焊盘。 模具用芯片附着粘合剂固定到基座上。 在芯片被固定到基座之后，多个裸片焊盘中的至少一个通过印刷的键合电连接到多个封装引线中的至少一个。 在打印粘合连接之后，将盖子密封到基座上。