公开(公告)号：US10431510B2

公开(公告)日：2019-10-01

申请号：US15954256

申请日：2018-04-16

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： H01L23/10 ,  H01L21/48 ,  H01L21/50

摘要： A method is provided. The method includes one or more of securing a die into a cavity of a hermetic package base, providing one or more bond connections to the die, placing a hermetic package lid on the package base, and 3D printing, by a 3D printer, hermetic lid seal material to a joint between the hermetic package base and the hermetic package lid, at a temperature at or below 100 degrees Celsius.

公开(公告)号：US10002846B2

公开(公告)日：2018-06-19

申请号：US15792414

申请日：2017-10-24

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： H01L23/00 ,  B29C64/10

CPC分类号： H01L24/80 ,  B29C64/10 ,  H01L21/4803 ,  H01L21/4817 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/20 ,  H01L23/26 ,  H01L23/49805 ,  H01L23/564 ,  H01L24/03 ,  H01L24/24 ,  H01L24/25 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24175 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25171 ,  H01L2224/2731 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/82102 ,  H01L2224/82103 ,  H01L2224/82214 ,  H01L2224/82815 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2924/00015 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3656 ,  H01L2924/3861 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/00

摘要： A method is provided. The method includes removing an extracted die including an original ball bond from a previous packaged integrated circuit, bonding the extracted die to an interposer to create a remapped extracted die, 3D printing one or more first bond connections between one or more original bond pads of the extracted die and one or more first bond pads of the interposer, securing the remapped extracted die to a package base, and 3D printing one or more second bond connections between one or more second bond pads of the interposer and one or more package leads or downbonds of the package base. The one or more first and second bond connections conform to the shapes and surfaces of the extracted die, the interposer, and the package base.

公开(公告)号：US20180047700A1

公开(公告)日：2018-02-15

申请号：US15792414

申请日：2017-10-24

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： H01L23/00 ,  B29C64/10

CPC分类号： H01L24/80 ,  B29C64/10 ,  H01L21/4803 ,  H01L21/4817 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/20 ,  H01L23/26 ,  H01L23/49861 ,  H01L23/564 ,  H01L24/03 ,  H01L24/24 ,  H01L24/25 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24175 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25171 ,  H01L2224/2731 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/82102 ,  H01L2224/82103 ,  H01L2224/82214 ,  H01L2224/82815 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2924/00015 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3656 ,  H01L2924/3861 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/00

摘要： A method is provided. The method includes removing an extracted die including an original ball bond from a previous packaged integrated circuit, bonding the extracted die to an interposer to create a remapped extracted die, 3D printing one or more first bond connections between one or more original bond pads of the extracted die and one or more first bond pads of the interposer, securing the remapped extracted die to a package base, and 3D printing one or more second bond connections between one or more second bond pads of the interposer and one or more package leads or downbonds of the package base. The one or more first and second bond connections conform to the shapes and surfaces of the extracted die, the interposer, and the package base.

公开(公告)号：US20180005910A1

公开(公告)日：2018-01-04

申请号：US15661060

申请日：2017-07-27

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： H01L23/10 ,  H01L21/66 ,  H01L23/00 ,  H01L23/26

CPC分类号： H01L23/10 ,  H01L22/14 ,  H01L23/26 ,  H01L24/03 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/98 ,  H01L2224/03424 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2224/8501 ,  H01L2224/85345 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/2075 ,  H01L2924/00 ,  H01L2224/32245

摘要： A method is provided. The method includes one or more of extracting a die from an original packaged integrated circuit, modifying the extracted die, reconditioning the modified extracted die, placing the reconditioned die into a cavity of a hermetic package base, bonding a plurality of bond wires between reconditioned die pads of the reconditioned die to leads of the hermetic package base or downbonds to create an assembled hermetic package base, and sealing a hermetic package lid to the assembled hermetic package base to create a new packaged integrated circuit. Modifying the extracted die includes removing the one or more ball bonds on the one or more die pads. Reconditioning the modified extracted die includes adding a sequence of metallic layers to bare die pads of the modified extracted die. The extracted die is a fully functional semiconductor die with one or more ball bonds on one or more die pads of the extracted die.

公开(公告)号：US10115645B1

公开(公告)日：2018-10-30

申请号：US15865328

申请日：2018-01-09

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： H01L21/48 ,  H01L21/02 ,  H01L23/26 ,  H01L23/10 ,  H01L23/20 ,  H01L23/495 ,  H01L23/00 ,  H01L23/498

摘要： A method is provided. The method includes one or more of removing one or more existing ball bonds from an extracted die, reconditioning die pads of the extracted die to create a reconditioned die, securing the reconditioned die within a cavity of a new package base, providing a plurality of bond connections interconnecting the reconditioned die pads and package leads or downbonds of the new package base, applying an encapsulating compound over the reconditioned die and the plurality of bond connections to create an assembled package base, and securing a lid to the new package base. Reconditioning includes applying a plurality of metallic layers to the die pads of the extracted die, the extracted die including a fully functional semiconductor die removed from a previous package. The encapsulating compound is configured to exhibit low thermal expansion.

公开(公告)号：US10109606B2

公开(公告)日：2018-10-23

申请号：US15792312

申请日：2017-10-24

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： H01L23/00 ,  H01L23/26 ,  H01L23/498 ,  H01L23/057 ,  H01L23/10

摘要： A remapped extracted die is provided. The remapped extracted die includes an extracted die removed from a previous integrated circuit package. The extracted die includes a plurality of original bond pads having locations that do not correspond to desired pin assignments of a new package base and an interposer, bonded to the extracted die. The interposer includes first bond pads configured to receive new bond wires from the plurality of original bond pads, and second bond pads corresponding to desired pin assignments of the new package base, each individually electrically coupled to one of the first bond pads and configured to receive new bond wires from package leads or downbonds of the new package base.

公开(公告)号：US20180061724A1

公开(公告)日：2018-03-01

申请号：US15792351

申请日：2017-10-24

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC分类号： H01L23/00 ,  H01L23/10 ,  H01L23/26 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/85 ,  H01L24/92 ,  H01L24/98 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0381 ,  H01L2224/0384 ,  H01L2224/04042 ,  H01L2224/05026 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05562 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48482 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/92 ,  H01L2224/98 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/85

摘要： A method for remapping an extracted die is provided. The method includes one or more of removing an extracted die from a previous integrated circuit package, the extracted die including a plurality of original bond pads having locations that do not correspond to desired pin assignments of a new package base and bonding an interposer to the extracted die. The interposer includes first bond pads configured to receive new bond wires from the plurality of original bond pads and second bond pads corresponding to desired pin assignments of the new package base, each individually electrically coupled to one of the first bond pads and configured to receive new bond wires from package leads or downbonds of the new package base.

公开(公告)号：US20190122227A1

公开(公告)日：2019-04-25

申请号：US15792448

申请日：2017-10-24

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： G06Q30/00

摘要： A method is provided. The method includes connecting an integrated circuit to a curve tracer, displaying a device signature corresponding to the integrated circuit on a screen of the curve tracer, and comparing the device signature to a reference signature to determine if the integrated circuit is counterfeit.

公开(公告)号：US20190118346A1

公开(公告)日：2019-04-25

申请号：US15792275

申请日：2017-10-24

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： B24D18/00 ,  H01B1/04 ,  H01B5/14 ,  H01B13/00 ,  B33Y10/00 ,  B33Y30/00 ,  B29C64/106 ,  B29C64/141 ,  B29C64/20

摘要： A method is provided. The method includes preparing a surface to receive a 3D printed layer, 3D printing a conductive layer comprising a plurality of overlaid layers of conductive material to the surface, and 3D printing conductive diamonds to the conductive layer. Preparing the surface includes one or more of texturing the surface and chemically treating the surface. The texturing is performed in order to not adversely impact regularity of the surface and limit variations in the height from the surface of conductive diamonds. Chemically treating the surface reduces films or coatings that may impact adhesion between the surface and the conductive layer, without degrading the conductive layer.

公开(公告)号：US10128161B2

公开(公告)日：2018-11-13

申请号：US15792225

申请日：2017-10-24

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： H01L21/00 ,  H01L23/20 ,  H01L23/00 ,  H01L21/48 ,  H01L23/04 ,  H01L23/495 ,  H01L23/498 ,  H01L21/50 ,  H01L23/26 ,  H01L23/10

摘要： A method is provided. The method includes one or more of removing existing ball bonds from an extracted die, placing the extracted die into a recess of a hermetic substrate, the extracted die having a centered orientation in the recess, and applying a side fill compound into the recess between the extracted die and the hermetic substrate. The method also includes 3D printing, by a 3D printer, a plurality of bond connections between die pads of the extracted die and first bond pads of the hermetic substrate in order to create a 3D printed die substrate, and 3D printing a hermetic encapsulation over the die, the side fill compound, and the 3D printed bond connections in order to create a hermetic assembly. The extracted die includes a fully functional semiconductor die removed from a previous package. The hermetic substrate includes the first bond pads coupled to second bond pads.