发明申请
- 专利标题： Integrated circuit with printed bond connections
- 专利标题（中）： 集成电路，具有印刷键合连接
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申请号： US14600733申请日： 2015-01-20
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公开(公告)号： US20160181171A1公开(公告)日： 2016-06-23
- 发明人: Erick Merle Spory
- 申请人： Global Circuit Innovations Incorporated
- 申请人地址： US CO Colorado Springs
- 专利权人： GLOBAL CIRCUIT INNOVATIONS INCORPORATED
- 当前专利权人： GLOBAL CIRCUIT INNOVATIONS INCORPORATED
- 当前专利权人地址： US CO Colorado Springs
- 主分类号： H01L23/20
- IPC分类号： H01L23/20 ; H01L21/48 ; H01L23/498 ; H01L23/495 ; H01L23/04 ; H01L23/00 ; H01L23/26
摘要：
A packaged integrated circuit is provided. The packaged integrated circuit includes a die, a package including a base, a lid, and a plurality of package leads, and die attach adhesive for securing the die to the package base. the die includes a plurality of die pads. The die is secured to the base with the die attach adhesive. After the die is secured to the base, at least one of the plurality of die pads is electrically connected to at least one of the plurality of package leads with a printed bond connection. After printing the bond connection, the lid is sealed to the base.
公开/授权文献
- US09824948B2 Integrated circuit with printed bond connections 公开/授权日：2017-11-21
信息查询
IPC分类:
