公开(公告)号：US09275941B2

公开(公告)日：2016-03-01

申请号：US14367788

申请日：2012-08-31

申请人： Wenhui Zhu ,  Wei Mu ,  Zhaoming Xu ,  Xiaowei Guo

发明人： Wenhui Zhu ,  Wei Mu ,  Zhaoming Xu ,  Xiaowei Guo

IPC分类号： H01L21/00 ,  H01L23/495 ,  H01L21/48 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49524 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/49541 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/03 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/0311 ,  H01L2224/03614 ,  H01L2224/0381 ,  H01L2224/29155 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/43847 ,  H01L2224/4502 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85181 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/43

摘要： The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an IC chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the IC chip; the IC chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the IC chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package. The quad flat no lead package is manufactured through the following steps of: thinning and scribing a wafer; manufacturing a lead frame; loading the chip; performing pressure welding and plastic packaging; performing post-curing; printing; electroplating; separating the leads; separating a product; and testing/braiding. According to the package, the problems of few leads, long welding wire, high welding cost and limited frequency application during single-face packaging of the existing normal quad flat no lead package are solved.

摘要翻译： 本发明公开了一种四边形无铅封装及其制造方法。 四边形无铅封装包括由载体凹坑和布置在载体凹坑周围的三个引线组成的引线框载体，其中三个引线圈分别由相互断开的多个引线组成; IC芯片粘附在载体坑中; 并在所有的引线上镀上一个内引铅化学镍和斑铜矿镀层; 内部引线化学镍和长磷石镀层沿与IC芯片相同的方向排列; IC芯片通过接合线与内引线化学镍和卟啉镀层连接; 和IC芯片，镀有内引线化学镀镍和钯金属层的所有引线的端部和接合线全部封装在塑料封装中。 通过以下步骤制造四边形扁平无铅封装：薄片化和刻划晶片; 制造引线框架; 加载芯片; 执行压焊和塑料包装; 执行后固化; 打印; 电镀; 分离引线; 分离产品; 和测试/编织。 根据封装，解决了现有普通四边形无铅封装单面封装时引线少，焊丝长，焊接成本高，应用频率有限的问题。

公开(公告)号：US20150102476A1

公开(公告)日：2015-04-16

申请号：US14367788

申请日：2012-08-31

申请人： Wenhui Zhu ,  Wei Mu ,  Zhaoming Xu ,  Xiaowei Guo

发明人： Wenhui Zhu ,  Wei Mu ,  Zhaoming Xu ,  Xiaowei Guo

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49524 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/49541 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/03 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/0311 ,  H01L2224/03614 ,  H01L2224/0381 ,  H01L2224/29155 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/43847 ,  H01L2224/4502 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85181 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/43

摘要： The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an IC chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the IC chip; the IC chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the IC chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package. The quad flat no lead package is manufactured through the following steps of: thinning and scribing a wafer; manufacturing a lead frame; loading the chip; performing pressure welding and plastic packaging; performing post-curing; printing; electroplating; separating the leads; separating a product; and testing/braiding. According to the package, the problems of few leads, long welding wire, high welding cost and limited frequency application during single-face packaging of the existing normal quad flat no lead package are solved.

摘要翻译： 本发明公开了一种四边形无铅封装及其制造方法。 四边形无铅封装包括由载体凹坑和布置在载体凹坑周围的三个引线组成的引线框载体，其中三个引线圈分别由相互断开的多个引线组成; IC芯片粘附在载体坑中; 并在所有的引线上镀上一个内引铅化学镍和斑铜矿镀层; 内部引线化学镍和长磷石镀层沿与IC芯片相同的方向排列; IC芯片通过接合线与内引线化学镍和卟啉镀层连接; 和IC芯片，镀有内引线化学镀镍和钯金属层的所有引线的端部和接合线全部封装在塑料封装中。 通过以下步骤制造四边形扁平无铅封装：薄片化和刻划晶片; 制造引线框架; 加载芯片; 执行压焊和塑料包装; 执行后固化; 打印; 电镀; 分离引线; 分离产品; 和测试/编织。 根据封装，解决了现有普通四边形无铅封装单面封装时引线少，焊丝长，焊接成本高，应用频率有限的问题。