公开(公告)号：US20150144682A1

公开(公告)日：2015-05-28

申请号：US14607423

申请日：2015-01-28

申请人： Orthodyne Electronics Corporation

发明人： Jonathan Michael Byars

IPC分类号： H01L23/00

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K35/00 ,  H01L21/67138 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48456 ,  H01L2224/48472 ,  H01L2224/78 ,  H01L2224/78313 ,  H01L2224/7855 ,  H01L2224/85 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  Y10S228/904 ,  H01L2924/00 ,  H01L2924/206

摘要： A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.

摘要翻译： 提供引线接合系统。 该系统包括接合头，由接合头承载的接合工具，被配置为通过接合工具接合的电线供给器和由接合头承载的线材成形工具。 线形成工具可相对于接合头和接合工具独立地移动。

公开(公告)号：US20110174865A1

公开(公告)日：2011-07-21

申请号：US13072930

申请日：2011-03-28

申请人： Michael T. Deley ,  Zhijie Wang ,  Peter M. Lister ,  Deepak Sood

发明人： Michael T. Deley ,  Zhijie Wang ,  Peter M. Lister ,  Deepak Sood

IPC分类号： B23K31/12 ,  G06K9/00

CPC分类号： B23K20/004 ,  B23K2101/40 ,  H01L23/544 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78901 ,  H01L2224/85121 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  Y10S228/904 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/05556 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

摘要翻译： 提供了一种教导用于引线键合操作的眼点的方法。 该方法包括：（1）从半导体器件的区域中选择一组形状用作眼点，以及（2）使用（a）样品半导体器件或 （b）与半导体器件相关的预定数据。 教学步骤包括相对于彼此定义每个形状的位置。

公开(公告)号：US20110121059A1

公开(公告)日：2011-05-26

申请号：US12736711

申请日：2009-04-03

申请人： Manfred Reinold ,  Immanuel Mueller

发明人： Manfred Reinold ,  Immanuel Mueller

IPC分类号： H05K3/34 ,  B23K1/06 ,  B23K35/14

CPC分类号： H01L24/85 ,  H01L24/34 ,  H01L24/37 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/1147 ,  H01L2224/37599 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/49111 ,  H01L2224/49174 ,  H01L2224/49426 ,  H01L2224/49427 ,  H01L2224/78313 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  Y10S228/904 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/37099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An electrical bond connection system between a first electrical contact surface and a second electrical contact surface having at least one first electrical conductor, which is bonded to at least one of the contact surfaces via at least one first bond connection. At least one additional second electrical conductor (9) is bonded to the first electrical conductor (8) via at least one second bond connection (10, 13), the two bond connections (10) being offset from one another. The present invention also relates to a method for manufacturing an electrical bond connection system existing between a first electrical contact surface and a second electrical contact surface.

摘要翻译： 在第一电接触表面和第二电接触表面之间的电接合连接系统，其具有至少一个第一电导体，其经由至少一个第一接合连接而接合到至少一个接触表面。 至少一个另外的第二电导体（9）经由至少一个第二接合连接（10,13）结合到第一电导体（8），两个接合连接（10）彼此偏移。 本发明还涉及一种用于制造存在于第一电接触表面和第二电接触表面之间的电接合连接系统的方法。

公开(公告)号：US07677429B2

公开(公告)日：2010-03-16

申请号：US12196696

申请日：2008-08-22

申请人： Gregory M. Chapman ,  Michael J. Bettinger ,  Jennifer A. Due

发明人： Gregory M. Chapman ,  Michael J. Bettinger ,  Jennifer A. Due

IPC分类号： B23K37/00 ,  B23K31/02

CPC分类号： H01L24/85 ,  B23K20/005 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/7825 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/78306 ,  H01L2224/78307 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  Y10S228/904 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

摘要翻译： 一种用于将导线接合到半导体器件的接合焊盘和引线框架的引线上的改进的引线接合毛细管，所述引线框架的引线键合毛细管具有工作尖端，所述工作尖端具有工作表面，所述工作尖端包括环绕引线进给孔的平坦环形部分 毛细管和从其延伸到与从工作尖端的外部尖端直径延伸的半径的交点处的凹面。

公开(公告)号：US20090309211A1

公开(公告)日：2009-12-17

申请号：US12543358

申请日：2009-08-18

申请人： Jeffrey W. Marsh ,  R. Tracy White ,  David L. Hamilton

发明人： Jeffrey W. Marsh ,  R. Tracy White ,  David L. Hamilton

IPC分类号： H01L23/488

CPC分类号： H01L24/78 ,  B23K20/004 ,  B23K2101/40 ,  H01L21/6835 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/78743 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/3011 ,  Y10S228/904 ,  Y10S269/903 ,  Y10T29/53174 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00015

摘要： A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).

摘要翻译： 具有刚性基座（902）的引线接合器（900）具有弹性插入件（920）。 放置在基座（902）上的包装（904）包含电气装置（906）。 电气设备（906）上的接合焊盘通过使用众所周知的接合工艺通过一系列接合线（908）电连接到封装（904）上的接合焊盘。 真空源将包装（904）保持抵靠基座（902）使位于基座的刚性构件（902）中的弹性条（920）变形，并确保封装（904）的接地焊盘与导电弹性 会员（920）。 弹性构件（920）是导电的并将封装接地电连接到系统接地（922）。

公开(公告)号：US07581666B2

公开(公告)日：2009-09-01

申请号：US11905868

申请日：2007-10-05

申请人： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Chih-Nan Wei ,  Song-Fu Yang ,  Chia-Jung Tsai ,  Kao-Ming Su

发明人： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Chih-Nan Wei ,  Song-Fu Yang ,  Chia-Jung Tsai ,  Kao-Ming Su

IPC分类号： B23K31/12 ,  B23K20/00 ,  B23K31/00

CPC分类号： H01L24/93 ,  B23K20/004 ,  H01L2224/78901 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  Y10S228/904

摘要： A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.

摘要翻译： 提供了一种用于引线接合装置的引线接合方法。 引线接合装置至少包括第一引线接合器和第二引线接合器，用于分别在基板上的第一区域中的至少几个第一芯片和第二区域中的第二区域中的几个第二芯片。 引线键合方法包括以下步骤。 首先，获得第一区域和第二区域的初始位置坐标。 接下来，确定第一区域和第二区域之间的空间是否大于预定空间。 当第一区域和第二区域之间的空间大于预定空间时，第一引线接合器和第二引线接合器分别同时地接合第一芯片和第二芯片。

公开(公告)号：US20090134201A1

公开(公告)日：2009-05-28

申请号：US12226348

申请日：2007-03-10

申请人： Riki Jindo ,  Hideki Yoshino ,  Mami Kushima

发明人： Riki Jindo ,  Hideki Yoshino ,  Mami Kushima

IPC分类号： B23K31/02

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K37/0435 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/78801 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/15747 ,  Y10S228/904 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01006

摘要： A work clamp and a wire bonding apparatus that can sufficiently restrain oxidation of a bonding area even while reducing a use amount of antioxidant gas are provided. The work clamp according to the present invention includes an interior hollow portion 10 providing an atmosphere of the antioxidant gas, a lower opening portion 11a provided below the interior hollow portion, for containing the bonding area in the interior hollow portion, an upper opening portion 11 provided above the interior hollow portion, for exposing the bonding area, a cavity 13 covering the interior hollow portion and having an area larger than an opening area of the upper opening portion, gas introduction ports 14a, 14b provided at the cavity, for introducing the antioxidant gas into the cavity, and holes 21 connected to below the cavity, for blowing the antioxidant gas introduced from the gas introduction port to a portion other than the bonding area of the work.

摘要翻译： 提供即使在减少抗氧化剂气体的使用量的同时也可以充分地抑制接合区域的氧化的压线夹和引线接合装置。 根据本发明的夹紧装置包括提供抗氧化气体的气氛的内部中空部分10，设置在内部中空部分下方的用于容纳内部中空部分中的接合区域的下部开口部分11a，上部开口部分11 设置在所述内部中空部分的上方，用于暴露所述接合区域;覆盖所述内部中空部分并且具有大于所述上部开口部分的开口面积的区域的空腔13，设置在所述空腔处的气体引入口14a，14b， 抗氧化剂气体进入空腔，以及连接到空腔下方的孔21，用于将从气体引入口引入的抗氧化剂气体吹送到除了工件的接合区域之外的部分。

公开(公告)号：US20080000946A1

公开(公告)日：2008-01-03

申请号：US11479774

申请日：2006-06-29

申请人： Ka Shing Kenny Kwan ,  Chong Hao Chen ,  Gang Ou

发明人： Ka Shing Kenny Kwan ,  Chong Hao Chen ,  Gang Ou

IPC分类号： B23K37/00 ,  B23K31/00

CPC分类号： B23K20/004 ,  H01L24/78 ,  H01L2224/78 ,  H01L2224/851 ,  H01L2924/00014 ,  H01L2924/01019 ,  Y10S228/904 ,  H01L2224/48 ,  H01L2224/45099

摘要： An apparatus and method for automatically controlling a clamp gap between clamping arms of a wire clamp is provided wherein a motor generates an actuation force for moving the clamping arms relative to each other. A resilient member is positioned such that the actuation force acts upon and flexes the resilient member to an extent that is proportional to the clamp gap, and the clamp gap is controlled by adjusting the amount of actuation force according to a predetermined relationship between the actuation force and the clamp gap.

摘要翻译： 提供了一种用于自动控制线夹的夹紧臂之间的夹紧间隙的装置和方法，其中马达产生用于相对于彼此移动夹持臂的致动力。 弹性构件被定位成使得致动力作用在弹性构件上并使弹性构件弯曲到与夹具间隙成比例的程度，并且通过根据致动力之间的预定关系调节致动力的量来控制夹紧间隙 和夹紧间隙。

公开(公告)号：US20070205252A1

公开(公告)日：2007-09-06

申请号：US11714560

申请日：2007-03-06

申请人： Kohei Seyama

发明人： Kohei Seyama

IPC分类号： A47J36/02

CPC分类号： H01L24/85 ,  B23K20/005 ,  B23K2101/42 ,  H01L24/78 ,  H01L24/80 ,  H01L2224/75355 ,  H01L2224/78301 ,  H01L2224/7835 ,  H01L2224/78801 ,  H01L2224/78823 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  Y10S228/904 ,  H01L2224/48 ,  H01L2224/45099

摘要： A horn-holder pivot type bonding apparatus including a horn holder for holding an ultrasonic horn, and a motor for driving the horn holder to pivot, with an imaginary pivot point of the horn holder being positionally fixed on a bonding surface. The motor is provided substantially in the center of the upper portion of the horn holder. The horn holder is formed with circular arc sections in the forward and rearward portions with respect to the imaginary pivot point; and a bonding head has, at portions corresponding to the circular arc sections of the horn holder, forward and rearward cams so that the cams are pivotable by supporting shafts. The forward and rearward cams have circular arc sections that contact the circular arc sections of the horn holder, the circular arc shape of the circular arc sections of the forward and rearward cams being centered on the supporting shafts.

摘要翻译： 一种喇叭座枢轴式接合装置，包括用于保持超声波喇叭的喇叭支架和用于驱动喇叭支架枢转的电动机，喇叭支架的假想枢转点位于固定在接合面上。 电动机基本上设置在喇叭座的上部的中心。 喇叭座在相对于虚拟枢转点的前后部分中形成有圆弧部分; 并且接合头在对应于喇叭支架的圆弧部分的部分处具有前凸轮和后凸轮，使得凸轮能够通过支撑轴枢转。 前后凸轮具有与喇叭支架的圆弧部接触的圆弧部，前后凸轮的圆弧部的圆弧形状以支撑轴为中心。

公开(公告)号：US07138328B2

公开(公告)日：2006-11-21

申请号：US10847775

申请日：2004-05-18

申请人： Susan H. Downey ,  Peter R. Harper

发明人： Susan H. Downey ,  Peter R. Harper

IPC分类号： H01L21/44 ,  H01L29/40 ,  B23K31/00

CPC分类号： H01L24/85 ,  H01L23/3128 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/745 ,  H01L2224/05554 ,  H01L2224/43827 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45686 ,  H01L2224/45693 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/4911 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/745 ,  H01L2224/7865 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10S228/904 ,  H01L2924/00014 ,  H01L2924/05042 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2924/05442 ,  H01L2924/05341 ,  H01L2924/0532 ,  H01L2924/0535 ,  H01L2924/0543 ,  H01L2924/0536 ,  H01L2924/05342 ,  H01L2924/04642 ,  H01L2924/059 ,  H01L2924/00012 ,  H01L2924/01004 ,  H01L2924/00011 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/45688 ,  H01L2924/0534 ,  H01L2924/053

摘要： A packaged IC including insulated wire for electrically connecting conductive structures of the packaged IC. In some embodiments, the packaged IC includes an IC die attached to a package substrate, where bond pads of the IC die are electrically connected to bond fingers of the substrate with insulated wire. The insulated wire has a conductive core and an insulator coating. In some examples, the insulator coating includes an inorganic covalently-bonded substance that is not an oxide of the electrically conductive core such as, e.g., silicon nitride or silicon oxide. In one example, the insulator coating is applied to a conductive core by a chemical vapor deposition (CVD) process such as a plasma enhanced chemical vapor deposition (PECVD).

摘要翻译： 一种封装IC，包括用于电连接封装IC的导电结构的绝缘线。 在一些实施例中，封装的IC包括附接到封装衬底的IC管芯，其中IC管芯的焊盘与绝缘电线与衬底的指状物电连接。 绝缘电线具有导电芯和绝缘体涂层。 在一些实例中，绝缘体涂层包括不是导电芯的氧化物的无机共价键合物质，例如氮化硅或氧化硅。 在一个示例中，通过化学气相沉积（CVD）工艺（诸如等离子体增强化学气相沉积（PECVD））将绝缘体涂层施加到导电芯。