发明申请
- 专利标题： Work Clamp and Wire Bonding Apparatus
- 专利标题（中）： 工作夹紧和接线装置
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申请号： US12226348申请日： 2007-03-10
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公开(公告)号： US20090134201A1公开(公告)日： 2009-05-28
- 发明人: Riki Jindo , Hideki Yoshino , Mami Kushima
- 申请人： Riki Jindo , Hideki Yoshino , Mami Kushima
- 优先权： JP2006-116549 20060420
- 国际申请： PCT/JP2007/057901 WO 20070310
- 主分类号： B23K31/02
- IPC分类号： B23K31/02
摘要：
A work clamp and a wire bonding apparatus that can sufficiently restrain oxidation of a bonding area even while reducing a use amount of antioxidant gas are provided. The work clamp according to the present invention includes an interior hollow portion 10 providing an atmosphere of the antioxidant gas, a lower opening portion 11a provided below the interior hollow portion, for containing the bonding area in the interior hollow portion, an upper opening portion 11 provided above the interior hollow portion, for exposing the bonding area, a cavity 13 covering the interior hollow portion and having an area larger than an opening area of the upper opening portion, gas introduction ports 14a, 14b provided at the cavity, for introducing the antioxidant gas into the cavity, and holes 21 connected to below the cavity, for blowing the antioxidant gas introduced from the gas introduction port to a portion other than the bonding area of the work.
公开/授权文献
- US07975899B2 Work clamp and wire bonding apparatus 公开/授权日：2011-07-12
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