发明申请
- 专利标题： WIRE LOOP FORMING SYSTEMS AND METHODS OF USING THE SAME
- 专利标题（中）： 线环形成系统及其使用方法
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申请号： US14607423申请日： 2015-01-28
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公开(公告)号： US20150144682A1公开(公告)日： 2015-05-28
- 发明人: Jonathan Michael Byars
- 申请人： Orthodyne Electronics Corporation
- 申请人地址： US DE Wilmington
- 专利权人： Orthodyne Electronics Corporation
- 当前专利权人： Orthodyne Electronics Corporation
- 当前专利权人地址： US DE Wilmington
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.
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