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公开(公告)号:US09685349B2
公开(公告)日:2017-06-20
申请号:US15178930
申请日:2016-06-10
发明人: Scott A. Mathews , Iyoel Beniam , Alberto Piqué
IPC分类号: H01L21/44 , H01L21/48 , H01L21/768 , H01L23/00
CPC分类号: H01L24/48 , H01L21/4828 , H01L21/76885 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/85 , H01L2224/04042 , H01L2224/29147 , H01L2224/43001 , H01L2224/435 , H01L2224/45012 , H01L2224/45014 , H01L2224/45147 , H01L2224/4805 , H01L2224/48101 , H01L2224/4814 , H01L2224/48472 , H01L2224/85039 , H01L2224/8584 , H01L2224/8585 , H01L2924/00014 , H01L2224/05599 , H01L2224/85399
摘要: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.
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公开(公告)号:US20170221851A1
公开(公告)日:2017-08-03
申请号:US15489958
申请日:2017-04-18
发明人: Scott A. Mathews , Iyoel Beniam , Alberto Piqué
IPC分类号: H01L23/00 , H01L21/768 , H01L21/48
CPC分类号: H01L24/48 , H01L21/4828 , H01L21/76885 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/85 , H01L2224/04042 , H01L2224/29147 , H01L2224/43001 , H01L2224/435 , H01L2224/45012 , H01L2224/45014 , H01L2224/45147 , H01L2224/4805 , H01L2224/48101 , H01L2224/4814 , H01L2224/48472 , H01L2224/85039 , H01L2224/8584 , H01L2224/8585 , H01L2924/00014 , H01L2224/05599 , H01L2224/85399
摘要: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.
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公开(公告)号:US09966356B2
公开(公告)日:2018-05-08
申请号:US15489958
申请日:2017-04-18
发明人: Scott A. Mathews , Iyoel Beniam , Alberto Piqué
IPC分类号: H01L21/44 , H01L23/00 , H01L21/48 , H01L21/768
CPC分类号: H01L24/48 , H01L21/4828 , H01L21/76885 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/85 , H01L2224/04042 , H01L2224/29147 , H01L2224/43001 , H01L2224/435 , H01L2224/45012 , H01L2224/45014 , H01L2224/45147 , H01L2224/4805 , H01L2224/48101 , H01L2224/4814 , H01L2224/48472 , H01L2224/85039 , H01L2224/8584 , H01L2224/8585 , H01L2924/00014 , H01L2224/05599 , H01L2224/85399
摘要: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.
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公开(公告)号:US20180240772A1
公开(公告)日:2018-08-23
申请号:US15962736
申请日:2018-04-25
发明人: Scott A. Mathews , Iyoel Beniam , Alberto Piqué
IPC分类号: H01L23/00 , H01L21/768 , H01L21/48
CPC分类号: H01L24/48 , H01L21/4828 , H01L21/76885 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/85 , H01L2224/04042 , H01L2224/29147 , H01L2224/43001 , H01L2224/435 , H01L2224/45012 , H01L2224/45014 , H01L2224/45147 , H01L2224/4805 , H01L2224/48101 , H01L2224/4814 , H01L2224/48472 , H01L2224/85039 , H01L2224/8584 , H01L2224/8585 , H01L2924/00014 , H01L2224/05599 , H01L2224/85399
摘要: An electronic device made from the method of providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, laser bending the shaped metallic interconnects; and transferring the shaped metallic interconnects onto a receiving substrate or device.
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公开(公告)号:US20180098437A1
公开(公告)日:2018-04-05
申请号:US15592694
申请日:2017-05-11
发明人: Caprice Gray Haley , Amy DuweI , Anthony Kopa , Seth Davis , Andrew P. Magyar , Brian Smith , Mitchell W. Meinhold , Sara Barron , Gregory Romano , Richard Morrison , Hongmei Zhang
CPC分类号: H05K3/34 , G06F17/5077 , H01B13/016 , H01L23/50 , H01L23/552 , H01L23/66 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/745 , H01L25/0655 , H01L2223/6611 , H01L2224/2919 , H01L2224/43001 , H01L2224/4312 , H01L2224/43125 , H01L2224/43831 , H01L2224/45015 , H01L2224/45111 , H01L2224/45124 , H01L2224/45138 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45472 , H01L2224/45572 , H01L2224/45611 , H01L2224/45639 , H01L2224/45644 , H01L2224/45647 , H01L2224/45655 , H01L2224/45666 , H01L2224/45669 , H01L2224/4569 , H01L2224/4579 , H01L2224/45811 , H01L2224/45839 , H01L2224/45844 , H01L2224/45847 , H01L2224/45855 , H01L2224/48091 , H01L2224/48111 , H01L2224/48137 , H01L2224/48253 , H01L2224/4911 , H01L2224/49113 , H01L2224/85205 , H01L2224/85207 , H01L2224/85214 , H01L2224/85237 , H01L2224/85238 , H01L2224/85801 , H01L2224/8582 , H01L2224/8584 , H01L2224/8585 , H01L2224/8592 , H01L2924/00014 , H01L2924/0781 , H01L2924/14 , H01L2924/15311 , H01L2924/19107 , H01L2924/3025 , H01P11/005 , H01R9/0512 , H01R9/0515 , H01R12/53 , H01R24/50 , H01R43/02 , H01R43/0256 , H02G1/1265 , H02G1/1297 , H05K1/115 , H05K3/222 , H05K3/328 , H05K2201/10287 , H01L2924/07025 , H01L2924/20751 , H01L2924/2076 , H01L2924/069 , H01L2924/0675 , H01L2924/01004 , H01L2224/43848
摘要: A method for attaching a prefabricated miniature coaxial wire to a first electrical connection point, the prefabricated miniature coaxial wire having an electrically conductive core disposed within an electrical insulation layer disposed within an electrically conductive shield layer, includes attaching an exposed portion of the electrically conductive core at a distal end of the prefabricated miniature coaxial wire to the first electrical connection point, thereby establishing electrical conductivity between the electrically conductive core and the first electrical connection point, depositing a layer of electrically insulating material onto the exposed portion of the electrically conductive core such that the exposed portion of the electrically conductive core and the first electrical connection point is encased in the layer of electrically insulating material, and connecting the electrically conductive shield layer to a second electrical connection point using a connector formed from an electrically conductive material.
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公开(公告)号:US20170103902A1
公开(公告)日:2017-04-13
申请号:US15178930
申请日:2016-06-10
发明人: Scott A. Mathews , Iyoel Beniam , Alberto Piqué
IPC分类号: H01L21/48 , H01L23/00 , H01L21/768
CPC分类号: H01L24/48 , H01L21/4828 , H01L21/76885 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/85 , H01L2224/04042 , H01L2224/29147 , H01L2224/43001 , H01L2224/435 , H01L2224/45012 , H01L2224/45014 , H01L2224/45147 , H01L2224/4805 , H01L2224/48101 , H01L2224/4814 , H01L2224/48472 , H01L2224/85039 , H01L2224/8584 , H01L2224/8585 , H01L2924/00014 , H01L2224/05599 , H01L2224/85399
摘要: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.
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