公开(公告)号：US06239376B1

公开(公告)日：2001-05-29

申请号：US09173742

申请日：1998-10-16

申请人： Naoto Kimura ,  Takahiro Ito

发明人： Naoto Kimura ,  Takahiro Ito

IPC分类号： H01B700

CPC分类号： H01L24/48 ,  H01B7/38 ,  H01L24/45 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/4579 ,  H01L2224/4586 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/00011 ,  H01L2224/45138 ,  H01L2924/00012 ,  H01L2224/78 ,  H01L2924/00

摘要： A coated fine metallic wire intended for use as a bonding wire in a semiconductor device, includes a fine metallic wire and an insulative layer which contains a pigment or dye which causes the insulative layer to absorb laser light at a high efficiency. The insulative layer is readily removable with a laser light, with no carbonized matter remaining on the fine wire and without damaging the fine wire.

摘要翻译： 旨在用作半导体装置中的接合线的涂覆金属细线包括细金属丝和含有颜料或染料的绝缘层，其使绝缘层以高效率吸收激光。 绝缘层可以用激光容易地去除，没有碳化物质残留在细线上并且不损坏细线。

公开(公告)号：US20180098437A1

公开(公告)日：2018-04-05

申请号：US15592694

申请日：2017-05-11

申请人： The Charles Stark Draper Laboratory, Inc.

发明人： Caprice Gray Haley ,  Amy DuweI ,  Anthony Kopa ,  Seth Davis ,  Andrew P. Magyar ,  Brian Smith ,  Mitchell W. Meinhold ,  Sara Barron ,  Gregory Romano ,  Richard Morrison ,  Hongmei Zhang

IPC分类号： H05K3/34 ,  H01B13/016 ,  H05K1/11 ,  H05K3/32 ,  H01R43/02 ,  H01R9/05

CPC分类号： H05K3/34 ,  G06F17/5077 ,  H01B13/016 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/745 ,  H01L25/0655 ,  H01L2223/6611 ,  H01L2224/2919 ,  H01L2224/43001 ,  H01L2224/4312 ,  H01L2224/43125 ,  H01L2224/43831 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45472 ,  H01L2224/45572 ,  H01L2224/45611 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2224/4569 ,  H01L2224/4579 ,  H01L2224/45811 ,  H01L2224/45839 ,  H01L2224/45844 ,  H01L2224/45847 ,  H01L2224/45855 ,  H01L2224/48091 ,  H01L2224/48111 ,  H01L2224/48137 ,  H01L2224/48253 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85214 ,  H01L2224/85237 ,  H01L2224/85238 ,  H01L2224/85801 ,  H01L2224/8582 ,  H01L2224/8584 ,  H01L2224/8585 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01P11/005 ,  H01R9/0512 ,  H01R9/0515 ,  H01R12/53 ,  H01R24/50 ,  H01R43/02 ,  H01R43/0256 ,  H02G1/1265 ,  H02G1/1297 ,  H05K1/115 ,  H05K3/222 ,  H05K3/328 ,  H05K2201/10287 ,  H01L2924/07025 ,  H01L2924/20751 ,  H01L2924/2076 ,  H01L2924/069 ,  H01L2924/0675 ,  H01L2924/01004 ,  H01L2224/43848

摘要： A method for attaching a prefabricated miniature coaxial wire to a first electrical connection point, the prefabricated miniature coaxial wire having an electrically conductive core disposed within an electrical insulation layer disposed within an electrically conductive shield layer, includes attaching an exposed portion of the electrically conductive core at a distal end of the prefabricated miniature coaxial wire to the first electrical connection point, thereby establishing electrical conductivity between the electrically conductive core and the first electrical connection point, depositing a layer of electrically insulating material onto the exposed portion of the electrically conductive core such that the exposed portion of the electrically conductive core and the first electrical connection point is encased in the layer of electrically insulating material, and connecting the electrically conductive shield layer to a second electrical connection point using a connector formed from an electrically conductive material.

公开(公告)号：US20050093112A1

公开(公告)日：2005-05-05

申请号：US10980216

申请日：2004-11-03

申请人： Sun-Ki Kim

发明人： Sun-Ki Kim

IPC分类号： H01L23/495 ,  H01L23/552

CPC分类号： H01L24/45 ,  H01L23/4952 ,  H01L23/49586 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/4579 ,  H01L2224/45886 ,  H01L2224/45893 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15173 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/01025 ,  H01L2224/45099 ,  H01L2224/43 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2224/43848

摘要： A semiconductor package has a semiconductor chip electrically connected to a conductive lead of a lead frame through a bonding wire and it is encapsulated by an insulating molding body. In such a semiconductor package, an electromagnetic wave absorbing film is formed by coating an electromagnetic wave absorbent on predetermined portions or either of the bonding wire and the conductive lead to a predetermined constant thickness, and the electromagnetic wave absorbing film forms a closed loop. In this manner, the electromagnetic interference between the conductive lead and the bonding wire can be surely attenuated. The lead frame and the conductive lead can be shield from the electromagnetic wave applied from the outside of the semiconductor package. In addition, the spurious signal flowing through the conductive lead and the bonding wire can also be reduced.

摘要翻译： 半导体封装具有通过接合线与引线框架的导电引线电连接的半导体芯片，并且由绝缘成型体封装。 在这种半导体封装中，电磁波吸收膜是通过在预定部分或接合线和导电引线之一上涂覆电磁波吸收剂而形成预定的恒定厚度而形成的，并且电磁波吸收膜形成闭环。 以这种方式，可以可靠地衰减导电引线和接合线之间的电磁干扰。 引线框架和导电引线可以屏蔽从半导体封装的外部施加的电磁波。 此外，还可以减少流过导电引线和接合线的杂散信号。

公开(公告)号：US06640436B1

公开(公告)日：2003-11-04

申请号：US09664717

申请日：2000-09-19

申请人： Naoto Kimura ,  Takahiro Ito

发明人： Naoto Kimura ,  Takahiro Ito

IPC分类号： H01R4304

CPC分类号： H01L24/48 ,  H01B7/38 ,  H01L24/45 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/4579 ,  H01L2224/4586 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/00011 ,  H01L2224/45138 ,  H01L2924/00012 ,  H01L2224/78 ,  H01L2924/00

摘要： A method for fabricating a semiconductor device includes removing a predetermined part of an insulative layer of a coated fine metallic wire by irradiating the predetermined part with a laser light and connecting the predetermined part of the fine metallic wire to one of the semiconductor device and a package of the semiconductor device. The insulative layer contains a substance that absorbs the laser light at a predetermined lasing wavelength.

摘要翻译： 一种半导体器件的制造方法，其特征在于，通过用激光照射所述预定部分，并且将所述金属细线的预定部分连接到所述半导体器件和所述半导体器件中的一个上而去除所述涂覆金属细线的绝缘层的预定部分 的半导体器件。 绝缘层包含以预定的激光波长吸收激光的物质。