公开(公告)号：US20170125655A1

公开(公告)日：2017-05-04

申请号：US15404207

申请日：2017-01-12

Applicant: NICHIA CORPORATION

Inventor： Ryohei YAMASHITA ,  Ryoichi YOSHIMOTO

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/095 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752

Abstract: A light emitting device mount includes a positive lead terminal, and a negative lead terminal. Each of the positive and negative lead terminal includes a first main surface, a second main surface, and an end surface. The end surface is provided between the first main surface and the second main surface. The end surface includes a first recessed surface area and a second recessed surface area. The first recessed surface area is extending from a first point of the first main surface in cross section. The second recessed surface area is extending from a second point of the second main surface in cross section. The first and second recessed surface areas define a protruding portion protruding outwardly.

公开(公告)号：US20140264426A1

公开(公告)日：2014-09-18

申请号：US14211051

申请日：2014-03-14

Applicant: NICHIA CORPORATION

Inventor： Ryohei YAMASHITA ,  Ryoichi YOSHIMOTO

IPC: H01L23/495 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/095 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752

Abstract: A mount includes a terminal, and a resin portion. The terminal includes a first surface, a second surface, and an end surface having first and second recessed areas that are extend from the first and second surfaces, respectively. The resin portion is integrally formed with the terminal, and at least partially covers the end surface so that the first and second surfaces are at least partially exposed. The resin portion forms a recessed part to accommodate the light emitting device. The second recessed area includes a closest point that is positioned closest to the first surface, and an extension part that extends outward of the closest point and toward the second surface side. The extension part is formed at least on opposing end surfaces of the pair of positive and negative lead terminal. The first recessed area is arranged on the exterior side relative to the closest point.

Abstract translation: 安装件包括端子和树脂部分。 端子包括第一表面，第二表面和端面，其具有分别从第一表面和第二表面延伸的第一和第二凹陷区域。 树脂部分与端子一体地形成，并且至少部分地覆盖端面，使得第一和第二表面至少部分地露出。 树脂部分形成凹部以容纳发光器件。 第二凹陷区域包括最接近第一表面的最近点，以及从最近点向外延伸并朝向第二表面侧的延伸部分。 延伸部分至少形成在一对正和负引线端子的相对的端面上。 第一凹陷区域相对于最靠近的点布置在外侧。

公开(公告)号：US09583688B2

公开(公告)日：2017-02-28

申请号：US15015246

申请日：2016-02-04

Applicant: NICHIA CORPORATION

Inventor： Ryohei Yamashita ,  Ryoichi Yoshimoto

IPC: H01L33/62 ,  H01L33/54 ,  H01L33/48 ,  H01L23/495 ,  H01L23/00 ,  H01L33/52

CPC classification number: H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/095 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752

Abstract: A light emitting device mount includes a positive lead terminal, a negative lead terminal, and a resin portion. Each of the positive and negative lead terminal includes a first main surface, a second main surface, and an end surface. The end surface is provided between the first main surface and the second main surface. The end surface includes a first recessed surface area and a second recessed surface area. The first recessed surface area is extending from a first point of the first main surface in cross section. The second recessed surface area is extending from a second point of the second main surface in cross section. The first and second recessed surface areas define a protruding portion protruding outwardly. The resin portion is positioned at least between the end surface of the positive lead terminal and the end surface of the negative lead terminal.

Abstract translation: 发光装置支架包括正引线端子，负引线端子和树脂部分。 正极和负极引线端子中的每一个包括第一主表面，第二主表面和端表面。 端面设置在第一主表面和第二主表面之间。 端面包括第一凹陷表面区域和第二凹入表面区域。 第一凹陷表面区域从第一主表面的第一点在横截面上延伸。 第二凹入表面区域从第二主表面的第二点以横截面延伸。 第一和第二凹入表面区域限定向外突出的突出部分。 树脂部分至少位于正引线端子的端面和负引线端子的端面之间。

公开(公告)号：US06178623B2

公开(公告)日：2001-01-30

申请号：US09164490

申请日：1998-10-01

Applicant: hiroshi Kitazawa ,  tatsuo Yamaguchi ,  etsuro Tsukada

Inventor： hiroshi Kitazawa ,  tatsuo Yamaguchi ,  etsuro Tsukada

IPC: H01R4300

CPC classification number: H01L24/45 ,  C25D5/10 ,  C25D5/44 ,  C25D5/50 ,  H01L24/43 ,  H01L2224/43 ,  H01L2224/431 ,  H01L2224/45015 ,  H01L2224/45118 ,  H01L2224/45124 ,  H01L2224/45573 ,  H01L2224/45574 ,  H01L2224/45601 ,  H01L2224/45618 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/4566 ,  H01L2224/45664 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  Y10T29/49117 ,  H01L2924/0132 ,  H01L2924/01201 ,  H01L2924/01026 ,  H01L2924/01025 ,  H01L2924/01024 ,  H01L2924/01022 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/0002

Abstract: A copper plated aluminum wire with improvement in adhesive properties is fabricated by a method which includes a displacement step of forming a thin layer of a metal by displacement on a surface of an aluminum or aluminum alloy conductor, an electroplating step of coating a surface of the thin layer continuously with copper layers by electroplating to have a copper coated aluminum conductor, and a thermal diffusion step of heat treating the copper coated aluminum conductor at a temperature of 120° C. to 600° C. under an inert gas atmosphere for thermal diffusion. A plated aluminum wire is provided having an anchor metal layer formed by displacement plating, a low thermally conductive metal layer formed by electroplating, and a high electrically conductive metal layer formed by electroplating in which all of the layers are sequentially deposited on an outer surface of an aluminum or aluminum alloy conductor. A plated aluminum wire is provided having an anchor metal layer formed by displacement plating and a high electrically conductive metal layer formed by electroplating in which both of the layers are sequentially deposited on an outer surface of an aluminum or aluminum alloy conductor. A composite lightweight copper plated wire is provided having an electrically conductive metal layer that is deposited by electroplating on an outer surface of an anchor metal layer provided on an aluminum conductor.

Abstract translation: 通过包括在铝或铝合金导体的表面上通过位移形成金属薄层的置换步骤的方法制造具有改善粘合性能的镀铜铝线，电镀步骤， 通过电镀连续地具有铜层的薄层以具有铜涂覆的铝导体，以及在惰性气体气氛下在120℃至600℃的温度下热处理铜涂覆的铝导体的热扩散步骤用于热扩散 。 提供一种电镀铝线，其具有通过移位电镀形成的锚金属层，通过电镀形成的低导热金属层，以及通过电镀形成的高导电金属层，其中所有层顺序地沉积在 铝或铝合金导体。 提供一种电镀铝线，其具有通过位移镀覆形成的锚金属层和通过电镀形成的高导电金属层，其中两层依次沉积在铝或铝合金导体的外表面上。 提供了一种复合轻质镀铜线，其具有通过电镀沉积在设置在铝导体上的锚金属层的外表面上的导电金属层。

公开(公告)号：US20240105668A1

公开(公告)日：2024-03-28

申请号：US18275584

申请日：2022-01-31

Applicant: NIPPON MICROMETAL CORPORATION ,  NIPPON STEEL Chemical & Material Co., Ltd.

Inventor： Yuto KURIHARA ,  Daizo ODA ,  Motoki ETO ,  Ryo OISHI ,  Tetsuya OYAMADA ,  Tomohiro UNO

IPC: H01L23/00

CPC classification number: H01L24/45 ,  H01L2224/45005 ,  H01L2224/45124 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45565 ,  H01L2224/45618 ,  H01L2224/45623 ,  H01L2224/45624 ,  H01L2224/45638 ,  H01L2224/45639 ,  H01L2224/45647 ,  H01L2224/45649 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45663 ,  H01L2224/45666 ,  H01L2224/4567 ,  H01L2224/45671 ,  H01L2224/45672 ,  H01L2224/45679 ,  H01L2224/4568 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01039 ,  H01L2924/01072 ,  H01L2924/0132 ,  H01L2924/2076

Abstract: There is provided a novel Al wiring material that achieves both of a suppression of chip damage and a thermal shock resistance. In aspect 1, the Al wiring material includes an Al core material and an Al coating layer formed on a surface of the Al core material, and satisfies 1.2≤H1h/H1s where H1h is a Vickers hardness of the Al core material (Hv) and H1s is a Vickers hardness of the Al coating layer (Hv). In aspect 2, the Al wiring material includes an Al core material and an Al coating layer formed on a surface of the Al core material, and satisfies 1.2≤H2h/H2s where H2s is a Vickers hardness of the Al core material (Hv) and H2h is a Vickers hardness of the Al coating layer (Hv).

公开(公告)号：US20230148306A1

公开(公告)日：2023-05-11

申请号：US17913365

申请日：2021-03-18

Applicant: NIPPON MICROMETAL CORPORATION ,  NIPPON STEEL Chemical & Material Co., Ltd.

Inventor： Motoki ETO ,  Daizo ODA ,  Tomohiro UNO ,  Tetsuya OYAMADA

IPC: H01L23/00

CPC classification number: H01L24/45 ,  H01L24/85 ,  H01L24/48 ,  H01L2224/4516 ,  H01L2224/4566 ,  H01L2224/45109 ,  H01L2224/45118 ,  H01L2224/45123 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45166 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45178 ,  H01L2224/45565 ,  H01L2224/45609 ,  H01L2224/45618 ,  H01L2224/45623 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2224/45673 ,  H01L2224/45678 ,  H01L2224/48472 ,  H01L2224/85099 ,  H01L2924/365 ,  H01L2924/3512

Abstract: There is provided a bonding wire for semiconductor devices that exhibits a favorable bondability even when being applied to wedge bonding at the room temperature, and also achieves an excellent bond reliability. The bonding wire includes a core material of Cu or Cu alloy (hereinafter referred to as a “Cu core material”), and a coating containing a noble metal formed on a surface of the Cu core material. A concentration of Cu at a surface of the wire is 30 to 80 at%.

公开(公告)号：US20010026016A1

公开(公告)日：2001-10-04

申请号：US09826436

申请日：2001-04-04

Inventor： Shigeyoshi Yoshida ,  Hiroshi Ono ,  Koji Kamei

IPC: H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC classification number: H05K1/0233 ,  H01L23/4952 ,  H01L23/66 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/745 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/432 ,  H01L2224/43826 ,  H01L2224/43827 ,  H01L2224/451 ,  H01L2224/45117 ,  H01L2224/45118 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45163 ,  H01L2224/45166 ,  H01L2224/45179 ,  H01L2224/45181 ,  H01L2224/45188 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/45617 ,  H01L2224/45618 ,  H01L2224/45623 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45663 ,  H01L2224/45666 ,  H01L2224/45679 ,  H01L2224/45681 ,  H01L2224/45686 ,  H01L2224/45693 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/745 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H03H2001/0092 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/01008 ,  H01L2924/01009 ,  H01L2924/049 ,  H01L2924/053 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (nullm) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23). When the top end is connected with the conductive pattern (25) by means of a solder (27) in mounting the printed wiring circuit board (23) of IC (17), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.

Abstract translation: 为了提供高频电流抑制型的电子部件，能够完全抑制高频电流，即使在高频时使用也能够发生电磁干扰，也可以使用该接合线等。 集成电路器件（IC）17在高频使用时高速工作，并且预定数量的端子（19）设置有高频电流抑制器（21），用于衰减通过的高频电流 终端本身。 该高频电流抑制器（21）是厚度为0.3〜20（μm）范围的薄膜磁性物质，并且设置在各端子（19）的整个表面上，覆盖安装部 用于安装IC（17）的印刷布线电路板（23）和包括设置在印刷布线电路板（23）上的导电图案的连接部分的边缘。 当在安装IC（17）的印刷布线电路板（23）时顶端通过焊料（27）与导电图案（25）连接时，安装部分的附近具有使用频带的导电性 ，小于几十MHz。

公开(公告)号：US20190027667A1

公开(公告)日：2019-01-24

申请号：US16143383

申请日：2018-09-26

Applicant: NICHIA CORPORATION

Inventor： Ryohei YAMASHITA ,  Ryoichi YOSHIMOTO

IPC: H01L33/62 ,  H01L23/495 ,  H01L23/00 ,  H01L33/48 ,  H01L33/52 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/095 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/20752 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A light emitting apparatus includes a positive lead terminal and a negative lead terminal, each of which includes a first main surface, a second main surface, and an end surface including a first recessed surface area extending from a first point of the first main surface in cross section, and a second recessed surface area extending from a second point of the second main surface in cross section. A distance between a first part of the end surface of the positive lead terminal and a second part of the end surface of the negative lead terminal than a first distance between the first points of the positive lead terminal and the negative lead terminal and a second distance between the second points of the positive lead terminal and the negative lead terminal. The first part and the second part are separated from the first point and the second point.

公开(公告)号：US20160155917A1

公开(公告)日：2016-06-02

申请号：US15015246

申请日：2016-02-04

Applicant: NICHIA CORPORATION

Inventor： Ryohei YAMASHITA ,  Ryoichi YOSHIMOTO

IPC: H01L33/62 ,  H01L23/495 ,  H01L33/52

CPC classification number: H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/095 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752

Abstract: A light emitting device mount includes a positive lead terminal, a negative lead terminal, and a resin portion. Each of the positive and negative lead terminal includes a first main surface, a second main surface, and an end surface. The end surface is provided between the first main surface and the second main surface. The end surface includes a first recessed surface area and a second recessed surface area. The first recessed surface area is extending from a first point of the first main surface in cross section. The second recessed surface area is extending from a second point of the second main surface in cross section. The first and second recessed surface areas define a protruding portion protruding outwardly. The resin portion is positioned at least between the end surface of the positive lead terminal and the end surface of the negative lead terminal.

Abstract translation: 发光装置支架包括正引线端子，负引线端子和树脂部分。 正极和负极引线端子中的每一个包括第一主表面，第二主表面和端表面。 端面设置在第一主表面和第二主表面之间。 端面包括第一凹陷表面区域和第二凹入表面区域。 第一凹陷表面区域从第一主表面的第一点在横截面上延伸。 第二凹入表面区域从第二主表面的第二点以横截面延伸。 第一和第二凹入表面区域限定向外突出的突出部分。 树脂部分至少位于正引线端子的端面和负引线端子的端面之间。

公开(公告)号：US20070235887A1

公开(公告)日：2007-10-11

申请号：US10550548

申请日：2004-10-13

Applicant: Shingo Kaimori ,  Tsuyoshi Nonaka ,  Masanori Ioka

Inventor： Shingo Kaimori ,  Tsuyoshi Nonaka ,  Masanori Ioka

IPC: H01L23/52 ,  H01B5/00

CPC classification number: H01L24/85 ,  B23K20/007 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45611 ,  H01L2224/45618 ,  H01L2224/45623 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45649 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45663 ,  H01L2224/45664 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2224/4567 ,  H01L2224/45671 ,  H01L2224/45673 ,  H01L2224/45676 ,  H01L2224/45678 ,  H01L2224/45683 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48639 ,  H01L2224/48839 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2924/00011 ,  H01L2924/01204 ,  H01L2924/01206 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/0105 ,  H01L2924/0103 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01024 ,  H01L2924/01026 ,  H01L2924/01008 ,  H01L2924/01016 ,  H01L2924/01001 ,  H01L2924/01029 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/00015 ,  H01L2924/01076 ,  H01L2924/01006

Abstract: A bonding wire comprising a core and a coating layer formed on the core, wherein the coating layer is formed from a metal having a higher melting point than the core, and further has at least one of the following characteristics; 1. the wet contact angle with the coating layer when the core is melted is not smaller than 20 degrees; 2. when the bonding wire is hung down with its end touching a horizontal surface, and is cut at a point 15 cm above the end and thus let drop onto the horizontal surface, the curvature radius of the formed arc is 35 mm or larger; 3. the 0.2% yield strength is not smaller than 0.115 mN/μm2 but not greater than 0.165 mN/μm2; or 4. the Vickers hardness of the coating layer is 300 or lower.

Abstract translation: 一种接合线，其包括芯和形成在所述芯上的涂层，其中所述涂层由具有比所述芯更高的熔点的金属形成，并且还具有以下特征中的至少一个; 当芯熔化时与涂层的湿接触角不小于20度; 2.当接合线悬挂时，其端部接触水平表面，并在端部上方15厘米处切割，因此落在水平面上，所形成的弧的曲率半径为35毫米或更大; 0.2％的屈服强度不小于0.115mN / m 2，但不大于0.165mN / m 2。 或4.涂层的维氏硬度为300以下。