专利检索 cpc:"H01L2224/45678" 第 1 页

1.

发明申请
BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE 有权
标题翻译：多层铜焊接线的结合结构

公开(公告)号：US20130180757A1

公开(公告)日：2013-07-18

申请号：US13877224

申请日：2011-09-29

申请人： Tomohiro Uno , Takashi Yamada , Atsuo Ikeda

发明人： Tomohiro Uno , Takashi Yamada , Atsuo Ikeda

IPC分类号： H01B1/02

CPC分类号： H01B1/026 , B23K20/007 , H01L23/48 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L24/85 , H01L25/0657 , H01L2224/05624 , H01L2224/32145 , H01L2224/43 , H01L2224/43848 , H01L2224/45015 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48465 , H01L2224/4851 , H01L2224/48511 , H01L2224/48599 , H01L2224/48799 , H01L2224/48824 , H01L2224/73265 , H01L2224/76268 , H01L2224/781 , H01L2224/78268 , H01L2224/85045 , H01L2224/85203 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85464 , H01L2225/0651 , H01L2225/06565 , H01L2924/00011 , H01L2924/00015 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/12041 , H01L2924/3025 , Y02P70/605 , H01L2224/45678 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2224/45144 , H01L2924/20752 , H01L2924/01204 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/01083 , H01L2924/013 , H01L2924/00013

摘要： A bonding structure of a ball-bonded portion is obtained by bonding a ball portion formed on a front end of a multilayer copper bonding wire. The multilayer copper bonding wire includes a core member that is mainly composed of copper, and an outer layer that is formed on the core member and is mainly composed of at least one noble metal selected from a group of Pd, Au, Ag and Pt. Further, a first concentrated portion of such noble metal(s) is formed in a ball-root region located at a boundary with the copper bonding wire in a surface region of the ball-bonded portion.

摘要翻译： 通过将形成在多层铜接合线的前端上的球部接合而获得球接部分的接合结构。多层铜键合线包括主要由铜构成的芯构件和形成在芯构件上的外层，主要由选自Pd，Au，Ag和Pt中的至少一种贵金属构成。此外，在与球形接合部的表面区域中的铜接合线的边界处的球根区域中形成有这种贵金属的第一集中部分。

2.

发明申请
Bonding Wire and Integrated Circuit Device Using the Same 审中-公开
标题翻译：接合线和使用其的集成电路器件

公开(公告)号：US20070235887A1

公开(公告)日：2007-10-11

申请号：US10550548

申请日：2004-10-13

申请人： Shingo Kaimori , Tsuyoshi Nonaka , Masanori Ioka

发明人： Shingo Kaimori , Tsuyoshi Nonaka , Masanori Ioka

IPC分类号： H01L23/52 , H01B5/00

CPC分类号： H01L24/85 , B23K20/007 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/4312 , H01L2224/4321 , H01L2224/43825 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/456 , H01L2224/45611 , H01L2224/45618 , H01L2224/45623 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/45647 , H01L2224/45649 , H01L2224/45655 , H01L2224/45657 , H01L2224/4566 , H01L2224/45663 , H01L2224/45664 , H01L2224/45666 , H01L2224/45669 , H01L2224/4567 , H01L2224/45671 , H01L2224/45673 , H01L2224/45676 , H01L2224/45678 , H01L2224/45683 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/48639 , H01L2224/48839 , H01L2224/78301 , H01L2224/85205 , H01L2224/85439 , H01L2924/00011 , H01L2924/01204 , H01L2924/01206 , H01L2924/14 , H01L2924/15747 , H01L2924/20752 , H01L2924/00014 , H01L2924/01004 , H01L2924/0105 , H01L2924/0103 , H01L2924/0104 , H01L2924/01047 , H01L2924/01024 , H01L2924/01026 , H01L2924/01008 , H01L2924/01016 , H01L2924/01001 , H01L2924/01029 , H01L2924/00 , H01L2924/013 , H01L2924/20751 , H01L2924/20753 , H01L2924/20754 , H01L2924/00015 , H01L2924/01076 , H01L2924/01006

摘要： A bonding wire comprising a core and a coating layer formed on the core, wherein the coating layer is formed from a metal having a higher melting point than the core, and further has at least one of the following characteristics; 1. the wet contact angle with the coating layer when the core is melted is not smaller than 20 degrees; 2. when the bonding wire is hung down with its end touching a horizontal surface, and is cut at a point 15 cm above the end and thus let drop onto the horizontal surface, the curvature radius of the formed arc is 35 mm or larger; 3. the 0.2% yield strength is not smaller than 0.115 mN/μm2 but not greater than 0.165 mN/μm2; or 4. the Vickers hardness of the coating layer is 300 or lower.

摘要翻译： 一种接合线，其包括芯和形成在所述芯上的涂层，其中所述涂层由具有比所述芯更高的熔点的金属形成，并且还具有以下特征中的至少一个; 当芯熔化时与涂层的湿接触角不小于20度; 2.当接合线悬挂时，其端部接触水平表面，并在端部上方15厘米处切割，因此落在水平面上，所形成的弧的曲率半径为35毫米或更大; 0.2％的屈服强度不小于0.115mN / m 2，但不大于0.165mN / m 2。或4.涂层的维氏硬度为300以下。

3.

发明授权
Stack package and methods of manufacturing the same 有权

公开(公告)号：US11929262B2

公开(公告)日：2024-03-12

申请号：US18132650

申请日：2023-04-10

申请人： Samsung Electronics Co., Ltd.

发明人： Jae-in Won , Jong-kak Jang , Dong-woo Kang , Do-yeon Kim

IPC分类号： H01L21/56 , H01L23/00 , H01L23/498 , H01L25/00 , H01L25/065 , H01L25/10

CPC分类号： H01L21/563 , H01L21/565 , H01L23/49816 , H01L24/45 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L23/49811 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/92 , H01L25/0655 , H01L2224/131 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45664 , H01L2224/45666 , H01L2224/45669 , H01L2224/45671 , H01L2224/45678 , H01L2224/4568 , H01L2224/45684 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/92125 , H01L2225/06517 , H01L2225/0652 , H01L2225/1023 , H01L2225/1058 , H01L2924/1432 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/1438 , H01L2924/15311 , H01L2924/15321 , H01L2924/1533 , H01L2224/131 , H01L2924/014 , H01L2924/00014 , H01L2224/48091 , H01L2924/00014 , H01L2224/73204 , H01L2224/16225 , H01L2224/32225 , H01L2924/00 , H01L2224/45144 , H01L2924/01004 , H01L2224/45144 , H01L2924/01046 , H01L2224/45144 , H01L2924/01022 , H01L2224/45144 , H01L2924/01077 , H01L2224/45144 , H01L2924/01074 , H01L2224/45144 , H01L2924/01078 , H01L2224/45144 , H01L2924/01039 , H01L2224/45144 , H01L2924/01058 , H01L2224/45144 , H01L2924/0102 , H01L2224/45144 , H01L2924/01057 , H01L2224/45144 , H01L2924/01024 , H01L2224/45144 , H01L2924/01025 , H01L2224/45144 , H01L2924/01027 , H01L2224/45139 , H01L2924/01004 , H01L2224/45139 , H01L2924/01046 , H01L2224/45139 , H01L2924/01022 , H01L2224/45139 , H01L2924/01077 , H01L2224/45139 , H01L2924/01074 , H01L2224/45139 , H01L2924/01078 , H01L2224/45139 , H01L2924/01039 , H01L2224/45139 , H01L2924/01058 , H01L2224/45139 , H01L2924/0102 , H01L2224/45139 , H01L2924/01057 , H01L2224/45139 , H01L2924/01024 , H01L2224/45139 , H01L2924/01025 , H01L2224/45139 , H01L2924/01027 , H01L2224/45147 , H01L2924/01004 , H01L2224/45147 , H01L2924/01046 , H01L2224/45147 , H01L2924/01022 , H01L2224/45147 , H01L2924/01077 , H01L2224/45147 , H01L2924/01074 , H01L2224/45147 , H01L2924/01078 , H01L2224/45147 , H01L2924/01039 , H01L2224/45147 , H01L2924/01058 , H01L2224/45147 , H01L2924/0102 , H01L2224/45147 , H01L2924/01057 , H01L2224/45147 , H01L2924/01024 , H01L2224/45147 , H01L2924/01025 , H01L2224/45147 , H01L2924/01027

摘要： A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.

4.

发明申请
BONDING WIRE AND PROCESS FOR MANUFACTURING A BONDING WIRE 审中-公开
标题翻译：用于制造粘接线的连接线和工艺

公开(公告)号：US20150322586A1

公开(公告)日：2015-11-12

申请号：US14360644

申请日：2012-11-20

申请人： MICROBONDS INC.

发明人： Robert LYN , John I. PERSIC

IPC分类号： C25D7/06 , C25D3/50 , C25D3/54 , C23C14/34 , C23C18/31 , B32B15/01 , C23C4/08 , C23C18/16 , H01B5/02 , H01B1/02 , B32B1/00 , C25D3/48 , C23C4/12

CPC分类号： C25D7/0607 , B23K35/0272 , B23K35/3006 , B32B1/00 , B32B15/01 , B32B15/018 , C23C4/08 , C23C4/12 , C23C14/34 , C23C18/1633 , C23C18/31 , C25D3/48 , C25D3/50 , C25D3/54 , H01B1/02 , H01B1/026 , H01B5/02 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/05624 , H01L2224/43 , H01L2224/43848 , H01L2224/45015 , H01L2224/45138 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/45676 , H01L2224/45678 , H01L2224/48463 , H01L2224/48599 , H01L2224/48624 , H01L2224/48799 , H01L2224/48824 , H01L2224/85045 , H01L2924/00011 , H01L2924/00015 , H01L2924/01047 , H01L2924/3025 , Y10T428/12479 , Y10T428/12875 , Y10T428/12882 , Y10T428/12889 , Y10T428/12896 , H01L2924/01206 , H01L2924/00014 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/01049 , H01L2924/01006

摘要： A bonding wire comprises a core wire generally made of silver or a silver alloy, and the coating material is selected from one or more of: gold, palladium, platinum, rhodium. Alternatively, the core wire is generally made of copper or a copper alloy, and the coating material is selected from one or more of: palladium, platinum, rhodium, iridium, ruthenium. For both core wires, the coating material can be selected from a group of materials with the following characteristics: (1) the materials' melting temperature is higher than the melting temperature of the core wire material, respectively; (2) the materials' molten surface tension is higher than that of the core wire material, respectively; (3) the materials show a high resistance to oxide formation between the melting temperature of the core wire material and the melting temperature of the respective material itself; and (4) the coating material has the additional characteristic that the material's melting temperature is lower than the boiling temperature of the core wire material.

摘要翻译： 接合线包括通常由银或银合金制成的芯线，并且涂层材料选自金，钯，铂，铑中的一种或多种。或者，芯线通常由铜或铜合金制成，并且涂层材料选自钯，铂，铑，铱，钌中的一种或多种。对于两根芯线，涂层材料可以选自具有以下特征的一组材料：（1）材料的熔融温度分别高于芯线材料的熔化温度; （2）材料的熔融表面张力分别高于芯线材料的表面张力; （3）材料表现出对芯线材料的熔融温度与各自材料本身的熔融温度之间的氧化物形成的高抗性; （4）涂料具有材料的熔融温度低于芯线材料的沸点温度的附加特性。

5.

发明申请
BONDING WIRE FOR SEMICONDUCTOR DEVICE 审中-公开

公开(公告)号：US20170117244A1

公开(公告)日：2017-04-27

申请号：US15107423

申请日：2015-09-18

申请人： NIPPON MICROMETAL CORPORATION , NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.

发明人： Takashi YAMADA , Daizo ODA , Teruo HAIBARA , Tomohiro UNO

IPC分类号： H01L23/00

CPC分类号： H01L24/45 , H01L2224/05624 , H01L2224/45015 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45609 , H01L2224/45618 , H01L2224/45644 , H01L2224/45647 , H01L2224/45655 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/45678 , H01L2224/48011 , H01L2224/48247 , H01L2224/48507 , H01L2224/85065 , H01L2224/85075 , H01L2224/85439 , H01L2924/10253 , H01L2924/1576 , H01L2924/20752 , H01L2924/013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01007 , H01L2924/01001 , H01L2924/01028 , H01L2924/00013 , H01L2924/20656 , H01L2924/01046 , H01L2924/01078 , H01L2924/01005 , H01L2924/01012 , H01L2924/01015 , H01L2924/0102 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01034 , H01L2924/01045 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01057 , H01L2924/01077 , H01L2924/01083 , H01L2924/01202 , H01L2924/01203 , H01L2924/01204

摘要： A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof, and the boding wire contains one or more elements of As, Te, Sn, Sb, Bi and Se in a total amount of 0.1 to 100 ppm by mass. The bonding longevity of a ball bonded part can increase in a high-temperature and high-humidity environment, improving the bonding reliability. When the Cu alloy core material further contains one or more of Ni, Zn, Rh, In, Ir, Pt, Ga and Ge in an amount, for each, of 0.011 to 1.2% by mass, it is able to increase the reliability of a ball bonded part in a high-temperature environment of 170° C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.

6.

发明授权
Lead member with multiple conductive layers and specific grain size 失效
标题翻译：导电元件具有多个导电层和特定的晶粒尺寸

公开(公告)号：US6140583A

公开(公告)日：2000-10-31

申请号：US864339

申请日：1997-05-28

申请人： Satoshi Suzuki , Morimasa Tanimoto

发明人： Satoshi Suzuki , Morimasa Tanimoto

IPC分类号： C23C28/02 , H01L21/60 , H01L23/48 , H01L23/49 , H01L23/50 , H05K1/00

CPC分类号： H01L24/45 , H01L24/43 , H01L2224/43825 , H01L2224/43848 , H01L2224/45139 , H01L2224/45147 , H01L2224/4516 , H01L2224/45565 , H01L2224/45572 , H01L2224/45573 , H01L2224/45611 , H01L2224/45639 , H01L2224/45644 , H01L2224/45647 , H01L2224/45655 , H01L2224/45657 , H01L2224/45663 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/45676 , H01L2224/45678 , H01L2224/4851 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01007 , H01L2924/01011 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/19041 , H01L2924/19043

摘要： A lead member for electronic parts which has excellent heat resistance, oxidation resistance and corrosion resistance and is especially excellent in solderability and a process of producing such a lead member at low cost by plating are provided. The lead member comprises a base, at least a surface region of which is made of Cu or a Cu alloy, a primary coat of Ni, Co, a Ni alloy or a Co alloy and a surface layer of Pd, Ru, a Pd alloy or a Ru alloy formed sequentially on the base in the order mentioned. The primary coat consists of grains having a grain size of 20 .mu.m or more.

摘要翻译： 提供了具有优异的耐热性，抗氧化性和耐腐蚀性并且特别优异的可焊性的电子部件的引线部件和通过电镀以低成本制造这种引线部件的工艺。引线构件包括基底，至少其表面区域由Cu或Cu合金制成，Ni，Co，Ni合金或Co合金的初级涂层以及Pd，Ru，Pd合金的表面层或Ru合金按照所述顺序依次形成在基材上。初级涂层由粒径20μm以上的晶粒构成。