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公开(公告)号：US12107311B2
公开(公告)日：2024-10-01
申请号：US17514011
申请日：2021-10-29
申请人： Dell Products L.P.
发明人： Bhyrav Mutnury , Sandor Farkas
CPC分类号： H01P1/20 , H01P11/007
摘要： A system for preventing crosstalk between adjacent channels comprises a crossover connector positioned along a length of one channel such that a portion of a positive trace for a first channel is positioned adjacent to a positive trace of a positive trace of an adjacent channel. The position of the crossover connector is based on preventing crosstalk and crossover connectors on adjacent channels may be staggered to further prevent crosstalk. A crossover connector may be based on capacitors or resistors to prevent crosstalk.
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公开(公告)号：US12095134B2
公开(公告)日：2024-09-17
申请号：US17651334
申请日：2022-02-16
发明人： Chengchun Tang
CPC分类号： H01P11/003 , C23F1/20 , H01P3/003
摘要： A method for preparing a coplanar waveguide structure includes acquiring a structure to be etched, the structure to be etched including an aluminum film provided on a substrate structure and a photoresist structure provided at an upper end of the aluminum film, wherein the photoresist structure is configured to cover partial areas of the aluminum film; performing a first etching operation on the aluminum film provided on the substrate structure by using an acidic solution to obtain a first etched structure; rinsing the first etched structure to obtain an intermediate structure; performing a second etching operation on the intermediate structure by using an alkaline solution to obtain a second etched structure; and rinsing the second etched structure to obtain a target structure for generating a coplanar waveguide structure, the target structure including the aluminum film and the photoresist structure, wherein the photoresist structure covers all areas of the aluminum film.
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公开(公告)号：US20240304974A1
公开(公告)日：2024-09-12
申请号：US18001798
申请日：2021-06-16
申请人： SWISSto12 SA
CPC分类号： H01P3/14 , H01P11/002
摘要： The invention concerns a flexible waveguide device (10), of the bellows type, for guiding a radio frequency signal at a given frequency range. The device comprises: a core (12) comprising outer and inner side walls (14a, 14b), the inner walls (14b) delimiting a waveguide channel (16); two fixing flanges (18a, 18b) connected to or integral with respective ends of the core (12), and at least one flexible corrugated portion (20) formed on a part of the outer side walls (14a) of the core (12) and comprising a plurality of circumferential ribs (22) adjacent to each other. Each rib (22) is devoid of corrugation along its circumference. The invention also relates to a method of manufacturing the flexible waveguide device.
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公开(公告)号：US20240266708A1
公开(公告)日：2024-08-08
申请号：US18429314
申请日：2024-01-31
CPC分类号： H01P7/06 , H01P11/008
摘要： A tunable radio frequency (RF) resonator may include an RF cavity core defining an RF cavity. The RF cavity core may include a post positioned within the RF cavity. The tunable RF resonator may further include a flexible membrane covering the RF cavity. A gap may be defined between the flexible membrane and the post. An actuator may cause movement of the flexible membrane and vary the distance between the membrane and the post. The RF cavity core is may be injection molded plastic with a metalized electroplating.
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公开(公告)号：US12057612B2
公开(公告)日：2024-08-06
申请号：US18299181
申请日：2023-04-12
CPC分类号： H01P3/003 , H05K1/0237 , G06N10/00 , H01P11/003
摘要： A waveguide includes: a substrate; a first ground wire; a second ground wire; a signal wire; and a compensation structure. The first ground wire, the second ground wire, and the signal wire are disposed on the substrate at intervals, and the signal wire is located between the first ground wire and the second ground wire. The compensation structure is configured to contact at least one of the substrate, the first ground wire, the second ground wire, or the signal wire; and the compensation structure comprises a superconducting material.
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公开(公告)号：US12051840B2
公开(公告)日：2024-07-30
申请号：US17894214
申请日：2022-08-24
发明人： Michael Marek , Elinor O'Neill , Ronit Nissim
CPC分类号： H01P1/203 , H01P3/081 , H01P11/003 , H01P11/007
摘要： A high frequency, stripline filter may have a bottom surface for mounting to a mounting surface. The filter may include a monolithic base substrate having a top surface and a plurality of thin-film microstrips, including a first thin-film microstrip and a second thin-film microstrip, formed over the top surface of the substrate. Each of the plurality of thin-film microstrips may have a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms. A port may be exposed along the bottom surface of the filter. A conductive path may include a via formed in the substrate. The conductive path may electrically connect the first thin-film microstrip with the port on the bottom surface of the filter. The filter may exhibit an insertion loss that is greater than −3.5 dB at a frequency that is greater than about 15 GHz.
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公开(公告)号：US12034196B2
公开(公告)日：2024-07-09
申请号：US17631664
申请日：2020-12-11
CPC分类号： H01P1/393 , H01P1/161 , H01P1/175 , H01P11/002
摘要： A hybrid circulator includes an isolator and an orthomode transducer coupled to the isolator. The hybrid circulator achieves high performance in the microwave and millimeter-wave (MMW) frequency range.
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公开(公告)号：US20240213185A1
公开(公告)日：2024-06-27
申请号：US18146886
申请日：2022-12-27
发明人： Aditya Nitin Jogalekar , Harshpreet Singh Phull Bakshi , Rajen Manicon Murugan , Sylvester Ankamah-Kusi
IPC分类号： H01L23/66 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/498 , H01P3/00 , H01P3/12 , H01P5/107 , H01P11/00
CPC分类号： H01L23/66 , H01L21/4853 , H01L21/4857 , H01L21/565 , H01L23/3121 , H01L23/49822 , H01L23/49838 , H01P3/003 , H01P3/121 , H01P5/107 , H01P11/002 , H01P11/003 , H01L2223/6633
摘要： An electronic device includes a multilevel package substrate with a horizontal substrate integrated waveguide (SIW) with a channel, a vertical SIW with an opening, a grounded coplanar waveguide (GCPW), a first transition between the horizontal SIW and the GCPW, and a second transition between the horizontal and vertical SIWs, as well as a semiconductor die having conductive structures coupled to a signal trace and a ground trace of the GCPW, and a package structure that encloses the semiconductor die and a portion of the multilevel package substrate.
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公开(公告)号：US20240204386A1
公开(公告)日：2024-06-20
申请号：US18449349
申请日：2023-08-14
IPC分类号： H01P11/00 , G06N10/00 , H01B12/02 , H01P1/20 , H01P1/203 , H01P1/22 , H01P1/30 , H01P3/00 , H05K7/20
CPC分类号： H01P11/001 , G06N10/00 , H01B12/02 , H01P1/20 , H01P1/203 , H01P1/30 , H01P3/003 , H01P11/007 , H05K7/20372 , H01P1/222
摘要： An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.
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公开(公告)号：US20240204382A1
公开(公告)日：2024-06-20
申请号：US18082647
申请日：2022-12-16
发明人： Nguyen Nguyen , Trong Phan , Duy Nguyen , Thanh Pham , Stefano D'Agostino , Wayne Kennan , William Allen
CPC分类号： H01P1/00 , H01P3/081 , H01P11/003
摘要： An enhanced electrical circuit can employ conductive fill components that can facilitate providing desirable resistive stabilization of the electrical circuit and other desirable circuit qualities without having to use a physical resistor. The electrical circuit can comprise a transmission line, which can be a microstrip line, that can have defined dimensions. The electrical circuit can comprise respective conductive fill components that can be in proximity to desired sides of the transmission line, wherein the respective conductive fill components can provide the desired resistive stabilization for the electrical circuit. The respective conductive fill components can be separated from, and not in contact with, each other based on respective gaps of a defined size(s) between respective adjacent conductive fill components. The respective conductive fill components can be across a single layer or multiple layers of conductive fill components.
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