- 专利标题： SYSTEM, ELECTRONIC DEVICE AND PACKAGE WITH VERTICAL TO HORIZONTAL SUBSTRATE INTEGRATED WAVEGUIDE TRANSITION AND HORIZONTAL GROUNDED COPLANAR WAVEGUIDE TRANSITION
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申请号： US18146886申请日： 2022-12-27
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公开(公告)号： US20240213185A1公开(公告)日： 2024-06-27
- 发明人: Aditya Nitin Jogalekar , Harshpreet Singh Phull Bakshi , Rajen Manicon Murugan , Sylvester Ankamah-Kusi
- 申请人： Texas Instruments Incorporated
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 主分类号： H01L23/66
- IPC分类号： H01L23/66 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/498 ; H01P3/00 ; H01P3/12 ; H01P5/107 ; H01P11/00
摘要：
An electronic device includes a multilevel package substrate with a horizontal substrate integrated waveguide (SIW) with a channel, a vertical SIW with an opening, a grounded coplanar waveguide (GCPW), a first transition between the horizontal SIW and the GCPW, and a second transition between the horizontal and vertical SIWs, as well as a semiconductor die having conductive structures coupled to a signal trace and a ground trace of the GCPW, and a package structure that encloses the semiconductor die and a portion of the multilevel package substrate.
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