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公开(公告)号：US20250071303A1
公开(公告)日：2025-02-27
申请号：US18943341
申请日：2024-11-11
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Shyam Jagannathan , Naveen Srinivasamurthy
IPC: H04N19/433 , H04N19/43
Abstract: A video encoder including a first buffer containing a plurality of data values defining a macroblock of pixels of a video frame. The video encoder also includes a second buffer and an entropy encoder coupled to the first and second buffers and configured to encode a macroblock based on another macroblock. The entropy encoder identifies a subset of the data values from the first buffer defining a given macroblock and copies the identified subset to the second buffer, the subset of data values being just those data values used by the entropy encoder when subsequently encoding another macroblock.
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公开(公告)号：US20250070635A1
公开(公告)日：2025-02-27
申请号：US18453776
申请日：2023-08-22
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Raul BLECIC , Syed Wasif MEHDI , Pavol BALAZ
IPC: H02M1/00 , H03K17/687 , H03K19/003
Abstract: A circuit includes a high-side driver having a high-side slew control input, a high-side drive input and a high-side drive output. A low-side driver has a low-side slew control input, a low-side drive input and a low-side drive output. Drive control circuitry has a high-side drive control output, a low-side drive control output, and a slew control output. The high-side drive control output is coupled to the high-side drive input, the low-side drive control output is coupled to the low-side drive input. The slew control output is coupled to at least one of the high-side slew control input and the low-side slew control input, and the drive control circuitry is configured to provide a slew control signal at the slew control output. The high-side and/or low-side driver is configured to modulate a slew rate of a drive signal at a respective drive output thereof based on the slew control signal.
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公开(公告)号：US20250070280A1
公开(公告)日：2025-02-27
申请号：US18454652
申请日：2023-08-23
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Shyam Krishnan VENKATESWARAN , Ariton E. XHAFA
Abstract: In some examples, a battery management system (BMS) includes a set of battery cells and a secondary network node coupled to the set of battery cells. The secondary network node is configured to, responsive to determination by the secondary network node of an exception event, wirelessly transmit a series of periodically repeating reverse wake up data frames to a primary network node. The secondary network node is also configured to, responsive to receipt of a synchronization frame from the primary network node after transmitting the series of reverse wake up data frames, transmit an uplink data frame to the primary network node.
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公开(公告)号：US20250069976A1
公开(公告)日：2025-02-27
申请号：US18455163
申请日：2023-08-24
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Vernon BUCK , Katleen Fajardo TIMBOL , Jeffrey SOLAS
Abstract: An electronic device includes a substrate and a die having an active surface disposed on the substrate. A sensor is in communication with the active surface of the die and a ring is disposed on the die and encircles the sensor. The ring includes a cylindrical wall and a cap, where the cylindrical wall has an open top and the cap has a partial circular shape that extends beyond each side of the cylindrical wall, A cover is disposed on the cap such that the cover closes off the open top of the ring to form a cavity inside the ring to prevent foreign substance from entering the cavity. A mold compound covers the die and the cover, and abuts an outer surface of the cylindrical wall.
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公开(公告)号：US20250068516A1
公开(公告)日：2025-02-27
申请号：US18942874
申请日：2024-11-11
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Siva Srinivas KOTHAMASU
Abstract: In described examples, a memory module includes a memory array with a primary access port coupled to the memory array. Error correction logic is coupled to the memory array. A statistics register is coupled to the error correction logic. A secondary access port is coupled to the statistics register to allow access to the statistics register by an external device without using the primary interface.
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Patent Agency Ranking
公开(公告)号：US20250066526A1
公开(公告)日：2025-02-27
申请号：US18942875
申请日：2024-11-11
Applicant: Texas Instruments Incorporated
Inventor： Nazila Dadvand , Benjamin Stassen Cook , Archana Venugopal , Luigi Colombo
IPC: C08F292/00 , C08F8/42 , C08J5/00 , C08K3/04 , C08K3/08 , C08K7/00 , C08L25/06 , C08L33/12 , G03F1/78
Abstract: A method of forming a composite material includes photo-initiating a polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice. Unpolymerized monomer is removed from the polymer microlattice. The polymer microlattice is coated with a metal. The metal-coated polymer microlattice is dispersed in a polymer matrix.
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公开(公告)号：US12237249B2
公开(公告)日：2025-02-25
申请号：US16175279
申请日：2018-10-30
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Bernardo Gallegos , Madison Koziol
IPC: H01L23/495 , H01L21/48 , H01L23/00
Abstract: A system comprises a substrate. The substrate comprises a lead. The system also comprises a solder barrier formed on the lead. The solder barrier is to contain a solder bump within a solder area on the lead. The system further includes a solder bump in the solder area and a die having an active surface coupled to the solder bump.
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公开(公告)号：US12237247B2
公开(公告)日：2025-02-25
申请号：US18527457
申请日：2023-12-04
Applicant: Texas Instruments Incorporated
Inventor： Barry Jon Male , Paul Merle Emerson , Sandeep Shylaja Krishnan
IPC: H01L23/495 , H01L21/56 , H01L23/00 , H01L23/31
Abstract: A packaged integrated circuit (IC) includes a leadframe including a die pad. The packaged IC also includes a first circuit on the die pad, the first circuit having a region. The packaged IC also includes a second circuit on the first circuit, the second circuit being spaced from the region by a gap. The packaged IC also includes an attachment layer between the first and second circuits, the attachment layer and the first and second circuits enclosing at least a part of the gap over the region. The packaged IC also includes a mold compound encapsulating the first and second circuits, the attachment layer, and the at least part of the gap.
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公开(公告)号：US12236177B2
公开(公告)日：2025-02-25
申请号：US17586516
申请日：2022-01-27
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Lawrence James Gewax , Timothy Paul Duryea
IPC: G06F30/33 , G06F30/327 , G06F30/367 , G06F30/398 , G06F119/02
Abstract: One example includes a method for validating a circuit design. The method includes providing a set of coded rules. Each of the coded rules can define conditions for circuit cells to qualify the circuit design as being radiation-hardened. The method also includes accessing a circuit design netlist associated with the circuit design from a circuit design database. The method also includes evaluating each of the circuit cells in the circuit design netlist with respect to each of the coded rules. The method further includes providing a circuit evaluation report comprising an indication of failure of a set of the circuit cells with respect to one or more of the coded rules in response to the evaluation.
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公开(公告)号：US12235168B2
公开(公告)日：2025-02-25
申请号：US18206684
申请日：2023-06-07
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Nathan Richard Schemm
Abstract: Methods, apparatus, systems and articles of manufacture to trim temperature sensors are disclosed. An example method includes: sampling a first value indicative of a temperature of a first die of a multi-chip module (MCM) with a first temperature sensor, the first die including a first transistor having a channel including a first material; and calibrating a second temperature sensor configured to sample a second value indicative of a temperature of a second die including a second transistor have a second channel including a second material, the calibrating based on the first value.
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