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公开(公告)号：US11837540B2
公开(公告)日：2023-12-05
申请号：US17866780
申请日：2022-07-18
发明人： Dan Rozbroj , Yehuda Seidman , Elinor O'Neill
IPC分类号： H01H85/041 , H01L23/525
CPC分类号： H01L23/5256 , H01H85/0411 , H01H2085/0414
摘要： A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.
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公开(公告)号：US20220359389A1
公开(公告)日：2022-11-10
申请号：US17866780
申请日：2022-07-18
发明人： Dan Rozbroj , Yehuda Seidman , Elinor O'Neill
IPC分类号： H01L23/525 , H01H85/041
摘要： A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.
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公开(公告)号：US20220416385A1
公开(公告)日：2022-12-29
申请号：US17894214
申请日：2022-08-24
发明人： Michael Marek , Elinor O'Neill , Ronit Nissim
摘要： A high frequency, stripline filter may have a bottom surface for mounting to a mounting surface. The filter may include a monolithic base substrate having a top surface and a plurality of thin-film microstrips, including a first thin-film microstrip and a second thin-film microstrip, formed over the top surface of the substrate. Each of the plurality of thin-film microstrips may have a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms. A port may be exposed along the bottom surface of the filter. A conductive path may include a via formed in the substrate. The conductive path may electrically connect the first thin-film microstrip with the port on the bottom surface of the filter. The filter may exhibit an insertion loss that is greater than −3.5 dB at a frequency that is greater than about 15 GHz.
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公开(公告)号：US20230006326A1
公开(公告)日：2023-01-05
申请号：US17902338
申请日：2022-09-02
发明人： Michael Marek , Elinor O'Neill , Ronit Nissim
摘要： A surface mountable coupler may include a monolithic base substrate having a first surface, a second surface, a length in an X-direction, and a width in a Y-direction that is perpendicular to the X-direction. A plurality of ports may be formed over the first surface of the monolithic base substrate including a coupling port, an input port, and an output port. The coupler may include a first thin film inductor and a second thin film inductor that is inductively coupled with the first thin film inductor and electrically connected between the input and output ports. A thin film circuit may electrically connect the first thin film inductor with the coupling port. The thin film circuit may include at least one thin film component.
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公开(公告)号：US20220165491A1
公开(公告)日：2022-05-26
申请号：US17533172
申请日：2021-11-23
IPC分类号： H01F38/14
摘要： A surface mountable thin-film coupler may include a monolithic base substrate and a plurality of ports formed over the monolithic base substrate. The surface mountable thin-film coupler may include at least one thin-film component connected with at least one port of the plurality of ports. The surface mountable thin-film coupler may provide a coupling factor that is greater than −5 dB and less than −1 dB over a coupling frequency range having a lower bound that is greater than 1 GHz and an upper bound that is at least 200 MHz greater than the lower bound. A footprint of the coupler may be less than about 3 mm2.
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公开(公告)号：US20220190802A1
公开(公告)日：2022-06-16
申请号：US17545067
申请日：2021-12-08
发明人： Michael Marek , Elinor O'Neill , Ronit Nissim
IPC分类号： H03H7/01
摘要： A thin-film filter may include a monolithic substrate and a patterned conductive layer formed over the monolithic substrate. The patterned conductive layer may include at least one thin-film inductor. The thin-film filter may have a power capacity that is greater than about 25 W. In some embodiments, the thin-film inductor(s) may be connected between the input port and the output port. A heat sink terminal may be exposed along the bottom surface of thin-film filter. In some embodiments, the heat sink terminal may have an exposed heat sink area, and the bottom surface of the thin-film filter has an area that is less than 20 times larger than the exposed heat sink area.
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公开(公告)号：US12051840B2
公开(公告)日：2024-07-30
申请号：US17894214
申请日：2022-08-24
发明人： Michael Marek , Elinor O'Neill , Ronit Nissim
CPC分类号： H01P1/203 , H01P3/081 , H01P11/003 , H01P11/007
摘要： A high frequency, stripline filter may have a bottom surface for mounting to a mounting surface. The filter may include a monolithic base substrate having a top surface and a plurality of thin-film microstrips, including a first thin-film microstrip and a second thin-film microstrip, formed over the top surface of the substrate. Each of the plurality of thin-film microstrips may have a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms. A port may be exposed along the bottom surface of the filter. A conductive path may include a via formed in the substrate. The conductive path may electrically connect the first thin-film microstrip with the port on the bottom surface of the filter. The filter may exhibit an insertion loss that is greater than −3.5 dB at a frequency that is greater than about 15 GHz.
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公开(公告)号：US11716066B2
公开(公告)日：2023-08-01
申请号：US17545067
申请日：2021-12-08
发明人： Michael Marek , Elinor O'Neill , Ronit Nissim
IPC分类号： H03H7/01
CPC分类号： H03H7/0115 , H03H7/1725 , H03H7/1791
摘要： A thin-film filter may include a monolithic substrate and a patterned conductive layer formed over the monolithic substrate. The patterned conductive layer may include at least one thin-film inductor. The thin-film filter may have a power capacity that is greater than about 25 W. In some embodiments, the thin-film inductor(s) may be connected between the input port and the output port. A heat sink terminal may be exposed along the bottom surface of thin-film filter. In some embodiments, the heat sink terminal may have an exposed heat sink area, and the bottom surface of the thin-film filter has an area that is less than 20 times larger than the exposed heat sink area.
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