公开(公告)号：US11837540B2

公开(公告)日：2023-12-05

申请号：US17866780

申请日：2022-07-18

申请人： KYOCERA AVX Components Corporation

发明人： Dan Rozbroj ,  Yehuda Seidman ,  Elinor O'Neill

IPC分类号： H01H85/041 ,  H01L23/525

CPC分类号： H01L23/5256 ,  H01H85/0411 ,  H01H2085/0414

摘要： A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.

公开(公告)号：US20180261418A1

公开(公告)日：2018-09-13

申请号：US15912945

申请日：2018-03-06

申请人： Phoenix Contact GmbH & Co. KG

发明人： Rainer Durth ,  Thomas Meyer ,  Jan-Erik Schmutz

IPC分类号： H01H85/02 ,  H01H85/17 ,  H01H85/36 ,  H01H85/041 ,  H01H85/34 ,  H01C7/12

CPC分类号： H01H85/0241 ,  H01C7/12 ,  H01C7/126 ,  H01H85/0411 ,  H01H85/17 ,  H01H85/34 ,  H01H85/36 ,  H01H85/38 ,  H01H2085/0216 ,  H01H2085/0275 ,  H01H2085/383 ,  H01H2085/388 ,  H01H2203/028

摘要： A cut-off element for electrical isolation of an electrical component or for opening of a circuit in overload has two terminal contacts, an insulating housing and a fuse element which is located within the insulating housing. In the normal state of the cut-off element, the two terminal contacts (2,3) are connected to one another in an electrically conductive manner via the fuse element. In the cut-off element, reliable isolation of an electrical component, in particular an overvoltage arrangement, is possible by the insulating housing being formed of two parts which are connected to one another and the first part of the housing, in case of overload, being isolated from the second part of the housing so that the connection of the two terminal contacts is broken via the fuse element.

公开(公告)号：US09899171B2

公开(公告)日：2018-02-20

申请号：US13811700

申请日：2011-07-26

申请人： Joachim Aurich ,  Ulf Zum Felde ,  Bernd Krueger ,  Laurent Mex ,  Wolfgang Werner

发明人： Joachim Aurich ,  Ulf Zum Felde ,  Bernd Krueger ,  Laurent Mex ,  Wolfgang Werner

IPC分类号： H01H37/32 ,  B22D41/015 ,  H01H37/76 ,  H01H85/06 ,  H01H85/12 ,  H01H85/041 ,  H01H85/08

CPC分类号： H01H37/32 ,  B22D41/015 ,  H01H37/761 ,  H01H85/0411 ,  H01H85/06 ,  H01H85/08 ,  H01H85/12 ,  H01H2037/768 ,  H01H2085/0412 ,  H01H2085/0414

摘要： In order to provide a method for isolating a circuit and a thermal link, wherein the link has a very low resistance and is suitable for high currents, in particular very high short load currents, and also has a high degree of reliability, in particular under difficult conditions, such as thermal and mechanical loading which lasts for a relatively long time, for example, the invention proposes that, during the phase transition of the material of the fusible element (10) from the solid to the liquid state, the volume of the fusible element (10) increases and the pressure increases and, owing to the increase in volume and the increase in pressure, the fusible element (10) is dislodged so as to break the electrical connection.

公开(公告)号：US09336978B2

公开(公告)日：2016-05-10

申请号：US13962837

申请日：2013-08-08

申请人： CYNTEC CO., LTD.

发明人： Chung-Hsiung Wang ,  Hung-Ming Lin ,  Wen-Shiang Luo ,  Chun-Tiao Liu ,  Kuo-Shu Chen

IPC分类号： H01H85/48 ,  H01H85/02 ,  H01H85/00 ,  H01H69/02 ,  H01H85/041 ,  H01H85/046 ,  H01H85/048 ,  H01H85/11 ,  H01H85/46

CPC分类号： H01H85/48 ,  H01H69/022 ,  H01H85/0047 ,  H01H85/0241 ,  H01H85/0411 ,  H01H85/046 ,  H01H85/048 ,  H01H85/11 ,  H01H2085/0283 ,  H01H2085/466

摘要： A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting.

公开(公告)号：US08976001B2

公开(公告)日：2015-03-10

申请号：US13291884

申请日：2011-11-08

申请人： Kuo-Shu Chen ,  Chung-Hsiung Wang

发明人： Kuo-Shu Chen ,  Chung-Hsiung Wang

IPC分类号： H01H85/44 ,  H01H85/044 ,  H01H85/055 ,  H01H85/046 ,  H01H85/041 ,  H01H85/02 ,  H01H85/46 ,  H01H69/02

CPC分类号： H01H85/044 ,  H01H69/02 ,  H01H69/022 ,  H01H85/0241 ,  H01H85/0411 ,  H01H85/046 ,  H01H85/055 ,  H01H85/463

摘要： A protective device includes a substrate, two first electrodes, a low-melting point metal layer and an assisting layer. The first electrodes are respectively arranged at two opposite sides of the substrate. The low melting point metal layer is arranged over the two first electrodes. The assisting layer is formed on the low melting point metal layer. The liquidus temperature of the assisting layer is below the liquidus temperature of the low melting point metal layer, and the liquidus temperature of the assisting layer is not below a predetermined temperature which is below the maximum working temperature of reflow soldering process by 25 degrees.

摘要翻译： 保护装置包括基板，两个第一电极，低熔点金属层和辅助层。 第一电极分别布置在基板的两个相对侧。 低熔点金属层布置在两个第一电极上。 辅助层形成在低熔点金属层上。 辅助层的液相线温度低于低熔点金属层的液相线温度，辅助层的液相线温度不低于低于回流焊接工艺的最高工作温度25度的预定温度。

公开(公告)号：US20140133059A1

公开(公告)日：2014-05-15

申请号：US14162185

申请日：2014-01-23

申请人： CYNTEC CO., LTD.

发明人： Chung-Hsiung WANG ,  Hung-Ming LIN ,  Lang-Yi CHIANG ,  Wen-Shiang LUO ,  Kuo-Shu CHEN ,  Han-Yang CHUNG ,  Hui-Wen HSU ,  Po-Wei SU ,  Hong-Ming CHEN

IPC分类号： H01H85/041

CPC分类号： H01H85/0411 ,  H01H69/022 ,  H01H85/0047 ,  H01H85/0065 ,  H01H85/046 ,  H01H85/048 ,  H01H85/11 ,  H01H85/18 ,  H01H2085/466

摘要： A protective device includes a substrate, an electrode layer, a metal structure, an outer cover and an arc extinguishing structure. The electrode layer is disposed on the substrate. The electrode layer includes at least one gap. The metal structure is disposed on the electrode layer and located above the gap, and the metal structure has a melting temperature lower than a melting temperature of the electrode layer. The outer cover is disposed on the substrate and covers the metal structure and a portion of the electrode layer. The arc extinguishing structure is disposed between the outer cover and the substrate. A protective module is further provided.

摘要翻译： 保护装置包括基板，电极层，金属结构，外盖和灭弧结构。 电极层设置在基板上。 电极层包括至少一个间隙。 金属结构设置在电极层上并位于间隙上方，金属结构的熔融温度低于电极层的熔融温度。 外盖设置在基板上并覆盖金属结构和电极层的一部分。 灭弧结构设置在外盖和基板之间。 还提供保护模块。

公开(公告)号：US08576041B2

公开(公告)日：2013-11-05

申请号：US12337274

申请日：2008-12-17

申请人： Essie Rahdar ,  Seong Kook Kim

发明人： Essie Rahdar ,  Seong Kook Kim

IPC分类号： H01H85/143 ,  H01H85/165 ,  H01H85/00

CPC分类号： H01H85/2045 ,  H01H85/0411 ,  H01H85/205 ,  H01H2085/2085

摘要： Radial fuses for protecting an electrical circuit include a nonconductive base provided with inverted flat faces sloped obliquely relative to one another that define a wider receiving area for installation of a fuse element. Restricted freedom of movement of the fuse element is accomplished, and greater fuse reliability is ensured.

摘要翻译： 用于保护电路的径向熔丝包括非导电基体，其设置有相对于彼此倾斜倾斜的倒置的平坦表面，其限定用于安装熔丝元件的更宽的接收区域。 保险丝元件的限制自由度得以实现，确保了更大的保险丝可靠性。

公开(公告)号：US20100066477A1

公开(公告)日：2010-03-18

申请号：US12425527

申请日：2009-04-17

申请人： Stephen J. Whitney ,  William Travis ,  Jeffrey P. Youngblood ,  Sarah M. Book ,  Edward D. Barriball ,  Milea J. Kittle

发明人： Stephen J. Whitney ,  William Travis ,  Jeffrey P. Youngblood ,  Sarah M. Book ,  Edward D. Barriball ,  Milea J. Kittle

IPC分类号： H01H85/04 ,  H01H85/00

CPC分类号： H01H85/0073 ,  H01H85/0411 ,  H01H2085/0412

摘要： A fuse element includes a substrate disposed between first and second terminals. The substrate includes an electrically insulative material. A conductive film is disposed on a first surface of the substrate and in electrical contact with the first terminal and second terminals.

摘要翻译： 熔丝元件包括设置在第一和第二端子之间的衬底。 基板包括电绝缘材料。 导电膜设置在基板的第一表面上并与第一端子和第二端子电接触。

公开(公告)号：US07569907B2

公开(公告)日：2009-08-04

申请号：US11091665

申请日：2005-03-28

申请人： Vernon Raymond Spaunhorst

发明人： Vernon Raymond Spaunhorst

IPC分类号： H01L29/00 ,  H01L23/58

CPC分类号： H01H85/0411 ,  H01H69/022 ,  H01H85/046 ,  H01H85/143 ,  H01H2069/025 ,  H01H2085/0412 ,  H01H2085/266 ,  H01L24/01 ,  H05K3/3426 ,  H05K2201/10181 ,  H05K2201/10583 ,  H05K2201/10651 ,  Y02P70/613

摘要： A chip fuse includes a substrate, a fuse element extending on the substrate, and first and second wire leads coupled to the fuse element. Contact pads may extend over portions of the fuse element and establish electrical connection to the first and second leads. A conductive medium such as solder encircles the substrate to securely form a mechanical and electrical connection to the leads.

摘要翻译： 芯片熔丝包括衬底，在衬底上延伸的熔丝元件，以及耦合到熔丝元件的第一和第二引线。 接触焊盘可以延伸超过熔丝元件的一部分并建立与第一和第二引线的电连接。 诸如焊料的导电介质环绕衬底以牢固地形成与引线的机械和电连接。

公开(公告)号：US20080303626A1

公开(公告)日：2008-12-11

申请号：US11571787

申请日：2005-06-27

申请人： Werner Blum ,  Reiner Friedrich ,  Reimer Hinrichs ,  Wolfgang Werner

发明人： Werner Blum ,  Reiner Friedrich ,  Reimer Hinrichs ,  Wolfgang Werner

IPC分类号： H01H85/04 ,  H01H69/02

CPC分类号： H01H85/046 ,  H01H69/022 ,  H01H85/006 ,  H01H85/0411 ,  H01H2085/0414 ,  Y10T29/49107

摘要： In order to produce a cost-effective fuse (100) in chip design, which is applied to a carrier substrate (10) made of a Al2O3 ceramic having a high thermal conductivity, and which is provided with a fusible metallic conductor (13) and a cover layer (14), in which the melting point of the metallic conductor (13) may be defined reliably, it is suggested that an intermediate layer (11) having low thermal conductivity be positioned between the carrier substrate (10) and the metallic conductor (13), the intermediate layer (11) being formed by a low-melting-point inorganic glass paste applied in the screen-printing method or an organic intermediate layer (11) applied in island printing. Furthermore, a method for manufacturing the fuse (100) is specified.

摘要翻译： 为了制造贴片设计中具有成本效益的熔丝（100），其被施加到由具有高导热性的Al 2 O 3陶瓷制成的载体衬底（10）上并且设置有可熔金属导体（13）和 可以可靠地限定金属导体（13）的熔点的覆盖层（14），建议将具有低导热性的中间层（11）定位在载体基板（10）和金属导体 导体（13），中间层（11）由施加在丝网印刷法中的低熔点无机玻璃浆料或在岛印刷中应用的有机中间层（11）形成。 此外，规定了制造保险丝（100）的方法。