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公开(公告)号：US20240222831A1
公开(公告)日：2024-07-04
申请号：US18603218
申请日：2024-03-13
申请人： KMW INC.
发明人： Nam Shin PARK , Yeon Ho SHIN
摘要： The present invention relates to a waveguide filter having an enhanced property of a specific passband through cross coupling using a resonator, and can set cross coupling in a limited space by providing a notch post, simplify the complexity of a filter by allowing the properties or strength of the cross coupling to be changed according to the position or form thereof, and implement various filter performances.
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公开(公告)号：US20240204412A1
公开(公告)日：2024-06-20
申请号：US18591003
申请日：2024-02-29
发明人： Masataka OHIRA , Kaoru SUDO , Yoshinori TAGUCHI
CPC分类号： H01Q9/0442 , H01Q1/243 , H01Q23/00 , H01P1/20
摘要： An antenna module includes a dielectric substrate, a radiating element that is arranged in the dielectric substrate, ground electrodes that are arranged to be opposed to the radiating element, and a resonance circuit. The resonance circuit is arranged between the radiating element and the ground electrode and includes resonators. The radiating element and the resonance circuit constitute a filter device. The resonance circuit includes an input line that receives a radio frequency signal from an RFIC, a resonance portion that is coupled with the input line, and a resonance portion that is coupled with the input line and the radiating element. The ground electrode is arranged between the radiating element and the input line. The resonance portion functions as an extracted pole unit. The input line is arranged between the resonance portion and the resonance portion.
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公开(公告)号：US20240186671A1
公开(公告)日：2024-06-06
申请号：US18060746
申请日：2022-12-01
发明人： Layne A. Berge , Matthew Doyle , Kyle Schoneck , Thomas W. Liang , John R. Dangler , Matthew A. Walther , Jason J. Bjorgaard , Trevor Timpane
CPC分类号： H01P1/20 , H01P3/06 , H01P11/005
摘要： One or more devices and/or methods provided herein relate to a method for fabricating a filtering electronic device having a co-integrated impedance modification element and signal transmission line. An electronic structure can comprise a signal transmission line, and an impedance modification element adjacent to and external to the signal transmission line, wherein the impedance modification element comprises a structure having differentiated sections, along the signal transmission line, that provide corresponding differentiated impedances. In an embodiment, the impedance modification element can comprise a plurality of impedance sub-elements spaced apart from one another along and adjacent to the signal transmission line to facilitate the different impedances.
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公开(公告)号：US11949142B2
公开(公告)日：2024-04-02
申请号：US17280873
申请日：2020-08-13
发明人： Haocheng Jia , Tienlun Ting , Ying Wang , Jie Wu , Liang Li , Cuiwei Tang , Qiangqiang Li
摘要： A feeding structure is provided, which includes first and second substrates opposite to each other, a reference electrode, and a dielectric layer between the first and second substrates. The first substrate includes a coupling branch and a delay branch, which are respectively connected to two output terminals of a power divider and form a current loop with the reference electrode, on a side of a first base plate proximal to the dielectric layer. The second substrate includes a receiving electrode on a side of a second base plate proximal to the dielectric layer, the receiving electrode and the coupling branch form a coupling structure, and their orthographic projections on the first base plate at least partially overlap each other. A length of an orthographic projection of both the coupling branch and the receiving electrode on the first base plate is different from a length of the delay branch.
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公开(公告)号：US11929537B2
公开(公告)日：2024-03-12
申请号：US17580281
申请日：2022-01-20
发明人： ShanCe Lyu , Ye Wang , XingHua Sun
摘要： Disclosed is a resonant filter, which includes a housing including an input hole and an output hole, an input resonator including an input resonant body and an input port extending from the input resonant body and out of the housing through the input hole, and an output resonator including an output resonant body and an output port extending from the output resonant body and out of the housing through the output hole. The input resonator and the output resonator are fixed in the housing. The input resonator body and the output resonator body, which are sheets with a metal surface or metal sheets, respectively include a resonant rod with an upright segment, an extension segment extending from the upright segment and one end of which away from the extension segment is connected to the housing, and a first branch extending from the extension segment away from the upright segment.
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公开(公告)号：US11881608B2
公开(公告)日：2024-01-23
申请号：US17088637
申请日：2020-11-04
发明人： Tomoya Sato
CPC分类号： H01P1/20 , H03H9/02543 , H03H9/14582 , H03H9/25 , H03H9/6406 , H03H9/6483
摘要： A filter device includes a first filter connected between a common terminal and a first individual terminal, and a second filter connected between the common terminal and a second individual terminal. A pass band of the second filter is in a frequency range lower than a pass band of the first filter. The first filter includes SAW resonators, at least one of which includes divided resonators connected in parallel with each other. Each of the divided resonators includes an IDT. A pitch of the IDT of one of the divided resonators is different from that of another of the divided resonators.
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公开(公告)号：US11862834B2
公开(公告)日：2024-01-02
申请号：US17130715
申请日：2020-12-22
CPC分类号： H01P1/20 , H01L23/66 , H02M1/44 , H01L27/016 , H01L2223/6627
摘要： A distributed LC filter structure is disclosed. The distributed LC filter structure provides simultaneously a distributed inductance and a distributed capacitance in the same structure. Accordingly, discrete passive elements are eliminated and high, homogenous integration is achieved. Interconnections between the distributed inductance and the distributed capacitance are tailored to leverage a parasitic inductance of the distributed capacitance to increase the overall inductance of the distributed LC filter structure. Similarly, the interconnections are tailored to leverage a parasitic capacitance resulting from the distributed inductance to add up with the distributed capacitance augmenting the overall capacitance of the structure.
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公开(公告)号：US11804454B2
公开(公告)日：2023-10-31
申请号：US17194006
申请日：2021-03-05
申请人： Tahoe Research, Ltd.
发明人： Hao-Han Hsu , Dong-Ho Han , Steven C. Wachtman , Ryan K. Kuhlmann
IPC分类号： H01L23/64 , H01L21/48 , H01L23/498 , H01L23/552 , H01P1/20
CPC分类号： H01L23/64 , H01L21/4857 , H01L23/49816 , H01L23/49822 , H01L23/552 , H01P1/20
摘要： A semiconductor package and a packaged electronic device are described. The semiconductor package has a foundation layer and a planar filtering circuit. The circuit is formed in the foundation layer to provide EMI/RFI mitigation. The circuit has one or more conductive traces that are patterned to form an equivalent circuit of inductors and capacitors. The one or more conductive traces include planar metal shapes, such as meanders, loops, inter-digital fingers, and patterned shapes, to reduce the z-height of the package. The packaged electronic device has a semiconductor die, a foundation layer, a motherboard, a package, and the circuit. The circuit removes undesirable interferences generated from the semiconductor die. The circuit has a z-height that is less than a z-height of solder balls used to attach the foundation layer to the motherboard. A method of forming a planar filtering circuit in a foundation layer is also described.
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公开(公告)号：US20230254972A1
公开(公告)日：2023-08-10
申请号：US18166562
申请日：2023-02-09
发明人： Michael D. Grady , Mark M. Bolding
CPC分类号： H05K1/115 , H01P1/20 , H05K1/0219 , H05K2201/09854
摘要： In an embodiment, a 3D-printed electrical structure such as an electromagnetic bandgap is provided. The structure includes a dielectric material with an embedded electrical interconnect that functions like a via and electrically connects a first surface of the dielectric material with a second surface of the dielectric material such as a ground plane. Unlike conventional vias, the embedded interconnect is not limited to straight lines and can take a variety of shapes and paths in the dielectric material allowing for the electrical interconnect to have a longer length than the thickness of the dielectric material. Increasing the length of the electrical interconnect increases the inductance of the electrical interconnect which in turn increases the bandwidth and reduces the frequency of the electrical structure without an increase in the height of the dielectric material.
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公开(公告)号：US20230178867A1
公开(公告)日：2023-06-08
申请号：US18072588
申请日：2022-11-30
申请人： THALES
发明人： Francis CHAN WAI PO , Vincent PETIT , Bruno LOUIS
CPC分类号： H01P1/20 , H03H11/08 , H03H21/0001
摘要： An adaptive radio frequency including an input, an output, at least one fixed passive inductor and at least one variable active inductor connected between the input and the output.
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