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公开(公告)号：US20240186671A1
公开(公告)日：2024-06-06
申请号：US18060746
申请日：2022-12-01
发明人： Layne A. Berge , Matthew Doyle , Kyle Schoneck , Thomas W. Liang , John R. Dangler , Matthew A. Walther , Jason J. Bjorgaard , Trevor Timpane
CPC分类号： H01P1/20 , H01P3/06 , H01P11/005
摘要： One or more devices and/or methods provided herein relate to a method for fabricating a filtering electronic device having a co-integrated impedance modification element and signal transmission line. An electronic structure can comprise a signal transmission line, and an impedance modification element adjacent to and external to the signal transmission line, wherein the impedance modification element comprises a structure having differentiated sections, along the signal transmission line, that provide corresponding differentiated impedances. In an embodiment, the impedance modification element can comprise a plurality of impedance sub-elements spaced apart from one another along and adjacent to the signal transmission line to facilitate the different impedances.
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公开(公告)号：US11262776B2
公开(公告)日：2022-03-01
申请号：US16454264
申请日：2019-06-27
发明人： Layne A. Berge , John R. Dangler , Jason J. Bjorgaard , Kyle Schoneck , Matthew Doyle , Thomas W. Liang , Matthew A. Walther
摘要： A system can control, with a positive temperature-voltage correlation, an output of a voltage regulator with a Peltier device. The Peltier device can receive heat from a heat-producing electronic device, and can have a positive terminal and a negative terminal. A voltage regulator circuit can include a driver device electrically coupled to an input voltage and an output terminal electrically coupled to one of the Peltier device terminals. The voltage regulator circuit can also include a differential amplifier electrically coupled to a reference voltage, an input electrically coupled to another Peltier device terminal and an output electrically coupled to the driver device. The differential amplifier can, in response to a voltage produced by the Peltier device, modulate, with a positive temperature-voltage correlation, an output voltage on the output terminal of the driver device.
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公开(公告)号：US20220317092A1
公开(公告)日：2022-10-06
申请号：US17217592
申请日：2021-03-30
发明人： Layne A. Berge , Matthew Doyle , John R. Dangler , Thomas W. Liang , Jason J. Bjorgaard , Kyle Schoneck , Matthew A. Walther
摘要： A system, apparatus, and method for determining ultrasonic vital product data of coaxial cables and side-band communications through a water medium of a water-cooling system and/or apparatus. The system may include a first electronic device. The system may also include a second electronic device. The system may also include one or more cables running between the first electronic device and the second electronic device. The system may also include a water jacket filled with water encasing the one or more cables. The system may also include one or more transducers connected to the water jacket, the one or more transducers configured to send signals through the water to gather information about each cable. The system may also include a computer system connected to the one or more transducers, where the computer system is configured to control the one or more transducers.
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公开(公告)号：US11226369B2
公开(公告)日：2022-01-18
申请号：US16583521
申请日：2019-09-26
发明人： Layne A. Berge , Matthew Doyle , Kyle Schoneck , Thomas W. Liang , Matthew A. Walther , Jason J. Bjorgaard , John R. Dangler
IPC分类号： G01R31/28
摘要： Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB). A current sense loop can be fabricated on a wiring plane of the PCB to encircle a current supply via that supplies current to an IC mounted on the BGA package. A MUX/Sequencer can sequentially connect wires of the current sense loop to an amplifier. The amplifier can amplify a voltage induced on the current sense mesh by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.
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公开(公告)号：US20220005649A1
公开(公告)日：2022-01-06
申请号：US16918251
申请日：2020-07-01
发明人： Layne A. Berge , Matthew Doyle , John R. Dangler , Kyle Schoneck , Thomas W. Liang , Matthew A. Walther , Jason J. Bjorgaard
摘要： A grid array capacitor can be used to physically and electrically couple an integrated circuit (IC) package to a printed circuit board (PCB). The grid array capacitor includes an inner conductor and an inner dielectric coaxially surrounding the inner conductor. A secondary conductor can be located to surround, in a coaxial orientation, the inner dielectric. Both the inner conductor and the secondary conductor can be electrically connected to the IC package and to the PCB. In certain applications, the structure of the inner conductor, inner dielectric, and secondary conductor can provide capacitance used to decouple electronic circuits.
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公开(公告)号：US11963307B2
公开(公告)日：2024-04-16
申请号：US17216863
申请日：2021-03-30
发明人： Matthew Doyle , Thomas W. Liang , Layne A. Berge , John R. Dangler , Jason J. Bjorgaard , Kyle Schoneck , Matthew A. Walther
IPC分类号： B23K1/00 , B23K3/06 , B23K3/08 , H05K3/34 , B23K101/36
CPC分类号： H05K3/3478 , B23K1/0008 , B23K3/0623 , B23K3/08 , H05K3/3436 , B23K2101/36 , H05K2201/09136 , H05K2203/041 , H05K2203/082
摘要： A ball-grid-array component of a ball-grid array assembly is analyzed prior to reflow. A predicted warping pattern of the ball-grid-array component that is likely to occur during reflow is predicted based on the analyzing. A solder ball ball-grid-array defect that could be caused by the predicted warping pattern is predicted. An initial via suction pattern to mitigate the ball-grid-array defect is assigned. A vacuum head is applied to a via in the ball-grid-array assembly. The solder ball is located at the opposite end of the via from the vacuum head. Suction is applied to the via based on the via suction pattern. The suction draws a portion of the solder ball into the via during reflow.
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公开(公告)号：US11948807B2
公开(公告)日：2024-04-02
申请号：US17216932
申请日：2021-03-30
发明人： Matthew Doyle , Thomas W. Liang , Layne A. Berge , John R. Dangler , Jason J. Bjorgaard , Kyle Schoneck , Matthew A. Walther
CPC分类号： H01L21/485 , H05K3/4007 , H05K2203/043
摘要： A set of features for a product is identified. It is determined that preventing an electrical connection at a ball-grid-array location on a ball-grid-array assembly of the product would result in the set of features. The ball-grid-array location is established as a target BGA location based on that determination. Suction is applied to a via at the target BGA location during reflow of the ball-grid-array assembly. With that application of suction, a solder ball at the target BGA location is drawn into the via.
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公开(公告)号：US11929390B2
公开(公告)日：2024-03-12
申请号：US17174830
申请日：2021-02-12
发明人： Kyle Schoneck , Matthew A. Walther , Jason J. Bjorgaard , John R. Dangler , Layne A. Berge , Thomas W. Liang , Matthew Doyle
摘要： A temperature-dependent capacitor comprises a first conductive plate, a second conductive plate located in a parallel-planar orientation to the first conductive plate, and a dielectric material located between the first conductive plate and the second conductive plate, the dielectric material having a temperature-dependent dielectric constant (ε) value, wherein the temperature-dependent capacitor has a positive correlation of an operating temperature of the temperature-dependent capacitor to a capacitance value of the temperature-dependent capacitor.
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公开(公告)号：US20220319867A1
公开(公告)日：2022-10-06
申请号：US17216932
申请日：2021-03-30
发明人： Matthew Doyle , Thomas W. Liang , Layne A. Berge , John R. Dangler , Jason J. Bjorgaard , Kyle Schoneck , Matthew A. Walther
摘要： A set of features for a product is identified. It is determined that preventing an electrical connection at a ball-grid-array location on a ball-grid-array assembly of the product would result in the set of features. The ball-grid-array location is established as a target BGA location based on that determination. Suction is applied to a via at the target BGA location during reflow of the ball-grid-array assembly. With that application of suction, a solder ball at the target BGA location is drawn into the via.
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公开(公告)号：US20220262893A1
公开(公告)日：2022-08-18
申请号：US17174830
申请日：2021-02-12
发明人： Kyle Schoneck , Matthew A. Walther , Jason J. Bjorgaard , John R. Dangler , Layne A. Berge , Thomas W. Liang , Matthew Doyle
摘要： A temperature-dependent capacitor comprises a first conductive plate, a second conductive plate located in a parallel-planar orientation to the first conductive plate, and a dielectric material located between the first conductive plate and the second conductive plate, the dielectric material having a temperature-dependent dielectric constant (ε) value, wherein the temperature-dependent capacitor has a positive correlation of an operating temperature of the temperature-dependent capacitor to a capacitance value of the temperature-dependent capacitor.
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