公开(公告)号：US20210315107A1

公开(公告)日：2021-10-07

申请号：US16839798

申请日：2020-04-03

申请人： DELL PRODUCTS L.P.

发明人： Subramanian Vasudevan ,  Edward Rhem ,  Philip Conde ,  Wallace Ables ,  Edwin C. Tinsley

IPC分类号： H05K3/34 ,  B23K1/00 ,  B23K35/26

摘要： Board assembly processes are disclosed that may be implemented using multiple different electrically conductive solder types to assemble or attach different electronic components to a printed circuit board (PCB). For example, multiple different electronic components may be attached to a common PCB using a multiple-step assembly process that may be performed at different solder reflow temperatures and/or which may incorporate multiple different solder types having different respective minimum reflow temperatures (i.e., melting point temperatures). The disclosed processes may be implementing using a variety of different forms of solder, such as solder paste form, wire solder form, ingot solder form, etc.

公开(公告)号：US20240341040A1

公开(公告)日：2024-10-10

申请号：US18745805

申请日：2024-06-17

申请人： DELL PRODUCTS L.P.

发明人： Subramanian Vasudevan ,  Edward Rhem ,  Philip Conde ,  Wallace Ables ,  Edwin C. Tinsley

IPC分类号： H05K3/34 ,  B23K1/00 ,  B23K35/26 ,  B23K101/42

CPC分类号： H05K3/3494 ,  B23K1/0016 ,  B23K35/262 ,  H05K3/3421 ,  H05K3/3489 ,  B23K2101/42

摘要： Board assembly processes are disclosed that may be implemented using multiple different electrically conductive solder types to assemble or attach different electronic components to a printed circuit board (PCB). For example, multiple different electronic components may be attached to a common PCB using a multiple-step assembly process that may be performed at different solder reflow temperatures and/or which may incorporate multiple different solder types having different respective minimum reflow temperatures (i.e., melting point temperatures). The disclosed processes may be implementing using a variety of different forms of solder, such as solder paste form, wire solder form, ingot solder form, etc.

公开(公告)号：US12035483B2

公开(公告)日：2024-07-09

申请号：US16839798

申请日：2020-04-03

申请人： DELL PRODUCTS L.P.

发明人： Subramanian Vasudevan ,  Edward Rhem ,  Philip Conde ,  Wallace Ables ,  Edwin C. Tinsley

IPC分类号： H05K3/34 ,  B23K1/00 ,  B23K35/26 ,  B23K101/42

CPC分类号： H05K3/3494 ,  B23K1/0016 ,  B23K35/262 ,  H05K3/3421 ,  H05K3/3489 ,  B23K2101/42

摘要： Board assembly processes are disclosed that may be implemented using multiple different electrically conductive solder types to assemble or attach different electronic components to a printed circuit board (PCB). For example, multiple different electronic components may be attached to a common PCB using a multiple-step assembly process that may be performed at different solder reflow temperatures and/or which may incorporate multiple different solder types having different respective minimum reflow temperatures (i.e., melting point temperatures). The disclosed processes may be implementing using a variety of different forms of solder, such as solder paste form, wire solder form, ingot solder form, etc.