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    WELDING METHOD FOR MANUFACTURING TOOL PARTS
    2.
    发明公开
    WELDING METHOD FOR MANUFACTURING TOOL PARTS 审中-公开

    公开(公告)号：US20240123540A1

    公开(公告)日：2024-04-18

    申请号：US18046837

    申请日：2022-10-14

    Applicant: Man Cheong LI

    Inventor： JingHua ZHI

    IPC: B23K20/02 ,  B23K20/22 ,  B23K20/24

    CPC classification number: B23K20/02 ,  B23K20/22 ,  B23K20/24 ,  B23K2101/002

    Abstract: The method of manufacturing a tool part includes the steps of providing a first shaft portion and a separate second shaft portion formed of a different material to the first shaft portion, the first shaft portion having a first contacting face at an end thereof, and the second shaft portion having a second contacting face at an end thereof. The method also includes aligning the first and second shaft portions along a common central axis; contacting the first contacting face with the second contacting face; and passing a current through the first and second shaft portions. The temperature increases at an interface between the first and second contacting faces, and pressure is simultaneously applied between the first and second shaft portions in a direction of the common central axis, thereby welding the first shaft portion to the second shaft portion—to form a shaft of the tool part.

    LOW TEMPERATURE HYBRID BONDING
    5.
    发明公开
    LOW TEMPERATURE HYBRID BONDING 审中-公开

    公开(公告)号：US20230201952A1

    公开(公告)日：2023-06-29

    申请号：US17563830

    申请日：2021-12-28

    Applicant: ADVANCED MICRO DEVICES, INC.

    Inventor： PRIYAL SHAH ,  RAHUL AGARWAL ,  RAJA SWAMINATHAN ,  BRETT P. WILKERSON

    IPC: B23K20/02 ,  B23K20/24

    CPC classification number: B23K20/02 ,  B23K20/24 ,  B23K2101/40

    Abstract: A semiconductor device includes a first die, the first die including a first dielectric layer and a plurality of first bond pads formed within apertures in the first dielectric layer, and a second die bonded to the first die, the second die including a second dielectric layer and a plurality of second bond pads protruding from the second dielectric layer. The first die is bonded to the second die such that the plurality of second bond pads protrude into the apertures in the first dielectric layer to establish respective metallurgical bonds with the plurality of first bond pads. A reduction in the distance between the respective bond pads of the dies results in a lower temperature for establishing a hybrid bond.

    METHODS FOR METAL FLOW REACTOR MODULES AND MODULES PRODUCED
    6.
    发明公开
    METHODS FOR METAL FLOW REACTOR MODULES AND MODULES PRODUCED 审中-公开

    公开(公告)号：US20230150050A1

    公开(公告)日：2023-05-18

    申请号：US17914085

    申请日：2021-03-29

    Applicant: CORNING INCORPORATED

    Inventor： George Edward Berkey ,  Richard Alan Quinn

    IPC: B23K20/02 ,  B01J19/24 ,  B23K20/24 ,  B23K35/36

    CPC classification number: B23K20/02 ,  B01J19/249 ,  B23K20/24 ,  B23K35/3602 ,  B01J2219/2493 ,  B01J2219/2486

    Abstract: A method for forming a metal flow module includes stacking together a first metal plate having opposing first and second major surfaces and one or more flow channels defined at least in part in the first major surface with a second metal plate having opposing first and second major surfaces, the plates stacked together with their respective first major surfaces facing each other and with a layer of flux positioned in between contacting portions of the respective first major surfaces defined as those portions of the respective first and second major surfaces which would be in contact absent the flux; then heating the plates together in a non-oxidizing atmosphere to thermally bond the contacting portions of the respective first major surfaces of the first and second metal plates. Resulting modules are also disclosed.

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