发明公开
- 专利标题： BONDING SYSTEMS, AND METHODS OF PROVIDING A REDUCING GAS ON A BONDING SYSTEM
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申请号： US18768219申请日： 2024-07-10
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公开(公告)号： US20240363580A1公开(公告)日： 2024-10-31
- 发明人: Adeel Ahmad Bajwa , Thomas J. Colosimo, JR. , Matthew B. Wasserman
- 申请人： Kulicke and Soffa Industries, Inc.
- 申请人地址： US PA Fort Washington
- 专利权人： Kulicke and Soffa Industries, Inc.
- 当前专利权人： Kulicke and Soffa Industries, Inc.
- 当前专利权人地址： US PA Fort Washington
- 分案原申请号： US18123166 2023.03.17
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; B23K1/00 ; B23K20/16
摘要：
A bonding system is provided. The bonding system includes (a) a bond head assembly configured for carrying a bonding tool for bonding a semiconductor element to a substrate and (b) a reducing gas conduit for carrying a reducing gas from (i) a reducing gas source to (ii) a bonding area of a bonding system. The reducing gas is configured for use during bonding of the semiconductor element to the substrate at the bonding area. The reducing gas conduit includes a catalyst for producing excess reducing species in the reducing gas prior to the reducing gas reaching the bonding area.
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