- 专利标题： Method for bonding substrates
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申请号： US15317686申请日： 2014-06-26
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公开(公告)号： US09929124B2公开(公告)日： 2018-03-27
- 发明人: Jurgen Burggraf
- 申请人： EV GROUP E. THALLNER GMBH
- 申请人地址： AT St. Florian am Inn
- 专利权人： EV GROUP E. THALLNER GMBH
- 当前专利权人： EV GROUP E. THALLNER GMBH
- 当前专利权人地址： AT St. Florian am Inn
- 代理机构： Kusner & Jaffe
- 国际申请： PCT/EP2014/063603 WO 20140626
- 国际公布： WO2015/197126 WO 20151230
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L23/00 ; C03C27/10 ; C09J5/00 ; C23C14/58
摘要：
A method for bonding a first substrate with a second substrate by means of a connecting layer that is arranged between the substrates and that is comprised of a connecting material with the following steps: applying the connecting material to the first substrate and/or the second substrate in liquid form, and distributing the connecting material between the substrates by bringing the substrates closer and as a result forming the shape of the connecting layer with a thickness t.
公开/授权文献
- US20170117247A1 METHOD FOR BONDING SUBSTRATES 公开/授权日：2017-04-27
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