Invention Grant
- Patent Title: Method for bonding substrates
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Application No.: US15317686Application Date: 2014-06-26
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Publication No.: US09929124B2Publication Date: 2018-03-27
- Inventor: Jurgen Burggraf
- Applicant: EV GROUP E. THALLNER GMBH
- Applicant Address: AT St. Florian am Inn
- Assignee: EV GROUP E. THALLNER GMBH
- Current Assignee: EV GROUP E. THALLNER GMBH
- Current Assignee Address: AT St. Florian am Inn
- Agency: Kusner & Jaffe
- International Application: PCT/EP2014/063603 WO 20140626
- International Announcement: WO2015/197126 WO 20151230
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L23/00 ; C03C27/10 ; C09J5/00 ; C23C14/58
Abstract:
A method for bonding a first substrate with a second substrate by means of a connecting layer that is arranged between the substrates and that is comprised of a connecting material with the following steps: applying the connecting material to the first substrate and/or the second substrate in liquid form, and distributing the connecting material between the substrates by bringing the substrates closer and as a result forming the shape of the connecting layer with a thickness t.
Public/Granted literature
- US20170117247A1 METHOD FOR BONDING SUBSTRATES Public/Granted day:2017-04-27
Information query
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