公开(公告)号：US20170077056A1

公开(公告)日：2017-03-16

申请号：US15116033

申请日：2015-02-03

Applicant: DEXERIALS CORPORATION

Inventor： Reiji TSUKAO ,  Yasushi AKUTSU

IPC: H01L23/00 ,  B32B27/38 ,  B32B27/14

CPC classification number: H01L24/29 ,  B32B27/08 ,  B32B27/14 ,  B32B27/16 ,  B32B27/20 ,  B32B27/308 ,  B32B27/38 ,  B32B37/02 ,  B32B37/24 ,  B32B2307/202 ,  B32B2310/0831 ,  B32B2457/00 ,  C08K2201/001 ,  C09J4/00 ,  C09J7/10 ,  C09J9/02 ,  C09J11/00 ,  C09J163/00 ,  C09J201/00 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2463/00 ,  H01L24/27 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/27001 ,  H01L2224/27003 ,  H01L2224/27848 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/2021 ,  H01L2924/2064 ,  H01L2924/3511 ,  H05K3/323

Abstract: An anisotropic conductive film has a first connection layer and a second connection layer formed on a surface of the first connection layer. The first connection layer is a photopolymerized resin layer, and the second connection layer is a thermo- or photo-cationically, anionically, or radically polymerizable resin layer. Conductive particles for anisotropic conductive connection are arranged on a surface of the first connection layer on a side of the second connection layer so that the embedding ratio of the conductive particles in the first connection layer is 80% or more, or 1% or more and 20% or less.

Abstract translation: 各向异性导电膜具有形成在第一连接层的表面上的第一连接层和第二连接层。 第一连接层是光聚合树脂层，第二连接层是热阳离子，光阴离子或自由基聚合性树脂层。 用于各向异性导电连接的导电颗粒被布置在第二连接层侧的第一连接层的表面上，使得第一连接层中的导电颗粒的嵌入比为80％以上或1％以上， 20％以下。

公开(公告)号：US20240021563A1

公开(公告)日：2024-01-18

申请号：US18351748

申请日：2023-07-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seokhyun Lee

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L24/27 ,  H01L25/0657 ,  H01L25/50 ,  H01L24/48 ,  H01L24/32 ,  H01L2225/06506 ,  H01L2224/48105 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/27416 ,  H01L2224/27515 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2924/2021

Abstract: A method of manufacturing a semiconductor package includes preparing a wafer having a first surface on which a plurality of semiconductor chips are disposed and a second surface, opposite to the first surface. The second surface of the wafer is ground. The ground second surface of the wafer is coated with a liquid adhesive material to form an uncured adhesive layer having a thickness of 5 μm or less. The uncured adhesive layer on the wafer is semi-cured. The wafer is cut so as to separate the plurality of semiconductor chips from one another. The plurality of semiconductor chips are stacked using the semi-cured adhesive layer. The semi-cured adhesive layer disposed between the plurality of stacked semiconductor chips is fully cured.

公开(公告)号：US09911642B2

公开(公告)日：2018-03-06

申请号：US14452754

申请日：2014-08-06

Applicant: FUJITSU LIMITED

Inventor： Taiji Sakai ,  Nobuhiro Imaizumi

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/762 ,  H01L23/488 ,  G21K5/02 ,  H01L21/67 ,  H01L23/00 ,  B23K20/02 ,  B23K20/24 ,  B23K20/26 ,  H01L21/268 ,  H01L21/3213 ,  B23K101/42

CPC classification number: H01L21/76254 ,  B23K20/026 ,  B23K20/24 ,  B23K20/26 ,  B23K2101/42 ,  G21K5/02 ,  H01L21/2686 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67069 ,  H01L21/67092 ,  H01L21/67115 ,  H01L21/67144 ,  H01L23/488 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/11462 ,  H01L2224/118 ,  H01L2224/1182 ,  H01L2224/1184 ,  H01L2224/11845 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16501 ,  H01L2224/75102 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/757 ,  H01L2224/7598 ,  H01L2224/81002 ,  H01L2224/8101 ,  H01L2224/81013 ,  H01L2224/81014 ,  H01L2224/8102 ,  H01L2224/81031 ,  H01L2224/81047 ,  H01L2224/81054 ,  H01L2224/81075 ,  H01L2224/8109 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8122 ,  H01L2224/818 ,  H01L2224/8183 ,  H01L2224/81907 ,  H01L2224/81986 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/20105 ,  H01L2924/20108 ,  H01L2924/2021 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

Abstract: According to this disclosure, a method of manufacturing an electronic device is provided, which includes exposing a top surface of a first electrode of a first electronic component to organic acid, irradiating the top surface of the first electrode exposed to the organic acid with ultraviolet light, and bonding the first electrode and a second electrode of a second electronic component by heating and pressing the first electrode and the second electrode each other.

公开(公告)号：US20130187293A1

公开(公告)日：2013-07-25

申请号：US13671970

申请日：2012-11-08

Applicant: FUJITSU LIMITED

Inventor： Taiji SAKAI ,  Nobuhiro IMAIZUMI

IPC: H01L21/762 ,  G21K5/02 ,  H01L23/488

CPC classification number: H01L21/76254 ,  B23K20/026 ,  B23K20/24 ,  B23K20/26 ,  B23K2101/42 ,  G21K5/02 ,  H01L21/2686 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67069 ,  H01L21/67092 ,  H01L21/67115 ,  H01L21/67144 ,  H01L23/488 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/11462 ,  H01L2224/118 ,  H01L2224/1182 ,  H01L2224/1184 ,  H01L2224/11845 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16501 ,  H01L2224/75102 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/757 ,  H01L2224/7598 ,  H01L2224/81002 ,  H01L2224/8101 ,  H01L2224/81013 ,  H01L2224/81014 ,  H01L2224/8102 ,  H01L2224/81031 ,  H01L2224/81047 ,  H01L2224/81054 ,  H01L2224/81075 ,  H01L2224/8109 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8122 ,  H01L2224/818 ,  H01L2224/8183 ,  H01L2224/81907 ,  H01L2224/81986 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/20105 ,  H01L2924/20108 ,  H01L2924/2021 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

Abstract: According to this disclosure, a method of manufacturing an electronic device is provided, which includes exposing a top surface of a first electrode of a first electronic component to organic acid, irradiating the top surface of the first electrode exposed to the organic acid with ultraviolet light, and bonding the first electrode and a second electrode of a second electronic component by heating and pressing the first electrode and the second electrode each other.

Abstract translation: 根据本发明，提供了一种制造电子器件的方法，其包括将第一电子部件的第一电极的顶表面暴露于有机酸，用紫外线照射暴露于有机酸的第一电极的顶表面 并且通过对所述第一电极和所述第二电极进行加热和加压而将所述第一电极和第二电子部件的第二电极接合。

公开(公告)号：US09997486B2

公开(公告)日：2018-06-12

申请号：US15115827

申请日：2015-02-03

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi Akutsu ,  Reiji Tsukao

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  B32B27/18 ,  C09J4/00 ,  C09J7/00 ,  C09J9/02 ,  C09J163/00 ,  C09J201/00 ,  H01B1/02 ,  C08F220/18 ,  B32B27/08 ,  B32B27/20 ,  B32B27/38 ,  B32B27/14 ,  H01R4/04 ,  H05K3/32

CPC classification number: H01L24/29 ,  B32B27/08 ,  B32B27/14 ,  B32B27/18 ,  B32B27/20 ,  B32B27/38 ,  B32B2307/202 ,  B32B2457/00 ,  C08F220/18 ,  C08K2201/001 ,  C09J4/00 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J163/00 ,  C09J201/00 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01B1/02 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27848 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83204 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2924/06 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/2021 ,  H01L2924/2064 ,  H01L2924/3511 ,  H01R4/04 ,  H05K3/323 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/066 ,  H01L2924/0675 ,  H01L2924/069 ,  H01L2924/07025 ,  H01L2924/061 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An anisotropic conductive film has a first connection layer and a second connection layer formed on surface of the first connection layer. The first connection layer is a photopolymerized resin layer, and the second connection layer is a thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of first connection layer on the side of second connection layer, conductive particles for anisotropic conductive connection are arranged in a single layer. A region in which the curing ratio is lower than that of the surface of the first connection layer exists in a direction oblique to the thickness direction of the first connection layer. Alternatively, the curing ratio of a region relatively near another surface of the first connection layer among regions of the first connection layer in the vicinity of the conductive particles is lower than that of the surface of the first connection layer.

公开(公告)号：US08922027B2

公开(公告)日：2014-12-30

申请号：US13671970

申请日：2012-11-08

Applicant: Fujitsu Limited

Inventor： Taiji Sakai ,  Nobuhiro Imaizumi

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/12 ,  H01L23/00 ,  H01L23/488 ,  G21K5/02 ,  H01L21/67 ,  H01L21/762

CPC classification number: H01L21/76254 ,  B23K20/026 ,  B23K20/24 ,  B23K20/26 ,  B23K2101/42 ,  G21K5/02 ,  H01L21/2686 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67069 ,  H01L21/67092 ,  H01L21/67115 ,  H01L21/67144 ,  H01L23/488 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/11462 ,  H01L2224/118 ,  H01L2224/1182 ,  H01L2224/1184 ,  H01L2224/11845 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16501 ,  H01L2224/75102 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/757 ,  H01L2224/7598 ,  H01L2224/81002 ,  H01L2224/8101 ,  H01L2224/81013 ,  H01L2224/81014 ,  H01L2224/8102 ,  H01L2224/81031 ,  H01L2224/81047 ,  H01L2224/81054 ,  H01L2224/81075 ,  H01L2224/8109 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8122 ,  H01L2224/818 ,  H01L2224/8183 ,  H01L2224/81907 ,  H01L2224/81986 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/20105 ,  H01L2924/20108 ,  H01L2924/2021 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

Abstract: According to this disclosure, a method of manufacturing an electronic device is provided, which includes exposing a top surface of a first electrode of a first electronic component to organic acid, irradiating the top surface of the first electrode exposed to the organic acid with ultraviolet light, and bonding the first electrode and a second electrode of a second electronic component by heating and pressing the first electrode and the second electrode each other.

Abstract translation: 根据本发明，提供了一种制造电子器件的方法，其包括将第一电子部件的第一电极的顶表面暴露于有机酸，用紫外线照射暴露于有机酸的第一电极的顶表面 并且通过对所述第一电极和所述第二电极进行加热和加压而将所述第一电极和第二电子部件的第二电极接合。

公开(公告)号：US20140342504A1

公开(公告)日：2014-11-20

申请号：US14452754

申请日：2014-08-06

Applicant: FUJITSU LIMITED

Inventor： Taiji SAKAI ,  Nobuhiro IMAIZUMI

IPC: H01L23/00 ,  G21K5/02 ,  H01L21/3213 ,  H01L21/268 ,  H01L21/67

CPC classification number: H01L21/76254 ,  B23K20/026 ,  B23K20/24 ,  B23K20/26 ,  B23K2101/42 ,  G21K5/02 ,  H01L21/2686 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67069 ,  H01L21/67092 ,  H01L21/67115 ,  H01L21/67144 ,  H01L23/488 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/11462 ,  H01L2224/118 ,  H01L2224/1182 ,  H01L2224/1184 ,  H01L2224/11845 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16501 ,  H01L2224/75102 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/757 ,  H01L2224/7598 ,  H01L2224/81002 ,  H01L2224/8101 ,  H01L2224/81013 ,  H01L2224/81014 ,  H01L2224/8102 ,  H01L2224/81031 ,  H01L2224/81047 ,  H01L2224/81054 ,  H01L2224/81075 ,  H01L2224/8109 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8122 ,  H01L2224/818 ,  H01L2224/8183 ,  H01L2224/81907 ,  H01L2224/81986 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/20105 ,  H01L2924/20108 ,  H01L2924/2021 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

Abstract: According to this disclosure, a method of manufacturing an electronic device is provided, which includes exposing a top surface of a first electrode of a first electronic component to organic acid, irradiating the top surface of the first electrode exposed to the organic acid with ultraviolet light, and bonding the first electrode and a second electrode of a second electronic component by heating and pressing the first electrode and the second electrode each other.

Abstract translation: 根据本发明，提供了一种制造电子器件的方法，其包括将第一电子部件的第一电极的顶表面暴露于有机酸，用紫外线照射暴露于有机酸的第一电极的顶表面 并且通过对所述第一电极和所述第二电极进行加热和加压而将所述第一电极和第二电子部件的第二电极接合。

公开(公告)号：US20180228022A1

公开(公告)日：2018-08-09

申请号：US15942742

申请日：2018-04-02

Applicant: International Business Machines Corporation

Inventor： Mark K. Hoffmeyer

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H05K1/18 ,  H05K3/28 ,  H01L21/56 ,  H05K3/34 ,  H01L21/48 ,  H05K3/40

CPC classification number: H05K1/0271 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/3142 ,  H01L23/49838 ,  H01L23/5386 ,  H01L23/562 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2224/83948 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/2021 ,  H05K1/181 ,  H05K3/284 ,  H05K3/303 ,  H05K3/341 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/09909

Abstract: A method and structure are provided for implementing enhanced reworkable strain relief packaging for electronic component interconnects. A plurality of custom strain relief pads is provided with a component footprint wiring layout on a component carrier or a component. The custom strain relief pads are disposed at component body perimeter locations. A solder mask is applied around these pad locations to provide a constrained area for a fusible surface coating. A fusible surface coating material is applied in the to the custom strain relief pads in the constrained area and then soldering of components is performed. Then a structural adhesive material is applied to the custom strain relief pad locations.

公开(公告)号：US20180168030A1

公开(公告)日：2018-06-14

申请号：US15373511

申请日：2016-12-09

Applicant: International Business Machines Corporation

Inventor： Mark K. Hoffmeyer

IPC: H05K1/02 ,  H01L23/00 ,  H05K3/40 ,  H01L21/48 ,  H05K3/34 ,  H01L21/56 ,  H05K3/28 ,  H05K1/18 ,  H01L23/498 ,  H01L23/31

CPC classification number: H05K1/0271 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/3142 ,  H01L23/49838 ,  H01L23/562 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2224/83948 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/2021 ,  H05K1/181 ,  H05K3/284 ,  H05K3/341 ,  H05K3/4007

Abstract: A method and structure are provided for implementing enhanced reworkable strain relief packaging for electronic component interconnects. A plurality of custom strain relief pads is provided with a component footprint wiring layout on a component carrier or a component. The custom strain relief pads are disposed at component body perimeter locations. A solder mask is applied around these pad locations to provide a constrained area for a fusible surface coating. A fusible surface coating material is applied in the to the custom strain relief pads in the constrained area and then soldering of components is performed. Then a structural adhesive material is applied to the custom strain relief pad locations.

公开(公告)号：US20170077055A1

公开(公告)日：2017-03-16

申请号：US15115827

申请日：2015-02-03

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU ,  Reiji TSUKAO

IPC: H01L23/00 ,  B32B27/38 ,  B32B27/14

CPC classification number: H01L24/29 ,  B32B27/08 ,  B32B27/14 ,  B32B27/18 ,  B32B27/20 ,  B32B27/38 ,  B32B2307/202 ,  B32B2457/00 ,  C08F220/18 ,  C08K2201/001 ,  C09J4/00 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J163/00 ,  C09J201/00 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01B1/02 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27848 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83204 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2924/06 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/2021 ,  H01L2924/2064 ,  H01L2924/3511 ,  H01R4/04 ,  H05K3/323 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/066 ,  H01L2924/0675 ,  H01L2924/069 ,  H01L2924/07025 ,  H01L2924/061 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An anisotropic conductive film has a first connection layer and a second connection layer formed on surface of the first connection layer. The first connection layer is a photopolymerized resin layer, and the second connection layer is a thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of first connection layer on the side of second connection layer, conductive particles for anisotropic conductive connection are arranged in a single layer. A region in which the curing ratio is lower than that of the surface of the first connection layer exists in a direction oblique to the thickness direction of the first connection layer. Alternatively, the curing ratio of a region relatively near another surface of the first connection layer among regions of the first connection layer in the vicinity of the conductive particles is lower than that of the surface of the first connection layer.

Abstract translation: 各向异性导电膜具有形成在第一连接层的表面上的第一连接层和第二连接层。 第一连接层是光聚合树脂层，第二连接层是热阳离子，光阴离子或自由基聚合性树脂层。 在第二连接层一侧的第一连接层的表面上，用于各向异性导电连接的导电颗粒被布置在单层中。 固化比低于第一连接层的表面的区域存在于与第一连接层的厚度方向倾斜的方向上。 或者，导电粒子附近的第一连接层的区域之间的第一连接层的另一个表面的相对接近的区域的固化比率低于第一连接层的表面的硬化率。