Invention Grant
- Patent Title: Anisotropic conductive film including oblique region having lower curing ratio
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Application No.: US15115827Application Date: 2015-02-03
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Publication No.: US09997486B2Publication Date: 2018-06-12
- Inventor: Yasushi Akutsu , Reiji Tsukao
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2014-019864 20140204; JP2014-019865 20140204
- International Application: PCT/JP2015/052910 WO 20150203
- International Announcement: WO2015/119090 WO 20150813
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/00 ; B32B27/18 ; C09J4/00 ; C09J7/00 ; C09J9/02 ; C09J163/00 ; C09J201/00 ; H01B1/02 ; C08F220/18 ; B32B27/08 ; B32B27/20 ; B32B27/38 ; B32B27/14 ; H01R4/04 ; H05K3/32

Abstract:
An anisotropic conductive film has a first connection layer and a second connection layer formed on surface of the first connection layer. The first connection layer is a photopolymerized resin layer, and the second connection layer is a thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of first connection layer on the side of second connection layer, conductive particles for anisotropic conductive connection are arranged in a single layer. A region in which the curing ratio is lower than that of the surface of the first connection layer exists in a direction oblique to the thickness direction of the first connection layer. Alternatively, the curing ratio of a region relatively near another surface of the first connection layer among regions of the first connection layer in the vicinity of the conductive particles is lower than that of the surface of the first connection layer.
Public/Granted literature
- US20170077055A1 ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME Public/Granted day:2017-03-16
Information query
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