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公开(公告)号：US20190159345A1
公开(公告)日：2019-05-23
申请号：US15735772
申请日：2016-06-22
Applicant: DEXERIALS CORPORATION
Inventor： Makiya ITO , Ryosuke ENDO , Kazuo GOTO
CPC classification number: H05K3/1208 , H05K1/0326 , H05K1/034 , H05K1/09 , H05K3/381 , H05K2201/0145 , H05K2201/015 , H05K2201/09681 , H05K2203/0195 , H05K2203/1105 , H05K2203/1173
Abstract: A wiring board manufacturing method and a wiring board in which a pattern can be simply and easily formed even when using a coating composition having a high surface tension are provided. The method includes a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a surface free energy which is higher than that of the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing the resin composition to form a base material to which the surface free energy difference pattern is transferred; and a conductor pattern forming step of applying a conductive coating composition onto a pattern transfer surface of the base material to form a conductor pattern, the base material having a pattern of a high surface free energy region and a low surface free energy region, and the high surface free energy region having a surface free energy of more than 62 mJ/m2.
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公开(公告)号：US20160032184A1
公开(公告)日：2016-02-04
申请号：US14806391
申请日：2015-07-22
Applicant: Dexerials Corporation
Inventor： Kazuhiro YAGIHASHI , Tsuneo KUSUNOKI , Masahide DAIMON , Yu NOMURA , Shuji OHASHI
CPC classification number: C09K11/886 , C09K11/025
Abstract: A fluorescent substance, represented by the following general formula (1): Ca1-x(SeyS1-y):Eux (1) where y is a value in the range of 0.5 to 1, wherein an absolute value of a difference between an optimal value (nm) of an emission peak wavelength corresponding to the value of y, and a measured value (nm) of the emission peak wavelength is 5 nm or less, and wherein an absolute value of a difference between an optimal value (nm) of a full width at half maximum of emission corresponding to the value of y, and a measured value (nm) of the full width at half maximum of emission is 6 nm or less.
Abstract translation: 由以下通式（1）表示的荧光物质：Ca1-x（SeyS1-y）：Eux（1）其中y是0.5〜1的范围内的值，其中，优选的 对应于y值的发射峰值波长的值（nm）和发射峰值波长的测量值（nm）为5nm以下，其中，最佳值（nm） 对应于y的值的发射的最大半径的全宽度，发射半峰全宽度的测量值（nm）为6nm以下。
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公开(公告)号：US12237096B2
公开(公告)日：2025-02-25
申请号：US17607466
申请日：2020-04-23
Applicant: DEXERIALS CORPORATION
Inventor： Yusuke Tanaka , Masaharu Aoki , Saori Sugioka , Hidetsugu Namiki , Shoko Kuga
Abstract: A connection structure, a method of manufacturing the connection structure, a connection material, and a coated conductive particle capable of reducing and stabilizing a conduction resistance value. The connection structure includes: a first electronic component having a first terminal; a second electronic component having a second terminal, and a cured film provided between the first electronic component and the second electronic component and formed by curing the connection material, wherein, with regard to the coated conductive particles between the first terminal and the second terminal, metal atoms of the conductive layer diffuse into the metal of the metal fine particles, and metal atoms of the first terminal and the metal atoms of the second terminal diffuse into the metal of the metal fine particles.
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公开(公告)号：US12233493B2
公开(公告)日：2025-02-25
申请号：US18276497
申请日：2022-02-03
Applicant: DEXERIALS CORPORATION
Inventor： Keisuke Mukasa , Yusuke Kubo , Keisuke Aramaki
Abstract: A method for producing a heat transfer sheet, includes: (A1) forming a mixture including at least one of a carbon fiber and a boron nitride flake, an inorganic filler, and a binder resin into a molded body in which the at least one of the carbon fiber and the boron nitride flake is oriented in a thickness direction of the molded body; (B1) slicing the molded body into a sheet shape to obtain a molded sheet; (C1) pressing the molded sheet; and (D1), after the pressing, inserting the molded sheet between films and performing a vacuum packing of the molded sheet with the films such that an uncured component of the binder resin present inside the molded sheet is exuded to a surface of the molded sheet, which is the heat transfer sheet.
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公开(公告)号：US20250012948A1
公开(公告)日：2025-01-09
申请号：US18895761
申请日：2024-09-25
Applicant: DEXERIALS CORPORATION
Inventor： Hitoshi WAKO , Izumi KIDA
Abstract: This optical laminate includes a transparent substrate; an adhesion layer provided on at least one surface of the transparent substrate; and an optical layer provided on a surface of the adhesion layer on a side opposite to the transparent substrate, wherein the adhesion layer is formed of a metal material, and the metal material has a melting point in a range of 100° C. or more and 700° C. or less.
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Patent Agency Ranking
公开(公告)号：US12184058B2
公开(公告)日：2024-12-31
申请号：US17755371
申请日：2020-11-09
Applicant: DEXERIALS CORPORATION
Inventor： Yuji Furuuchi , Chisato Komori
Abstract: Provided is a protection circuit capable of reliably preventing an overcurrent or a sneak current after cutoff to improve safety, implementing cost reduction with a device configuration simpler than conventional device configurations, and further reducing a failure rate of a device. In a protection circuit, after one of two fuse elements provided in each of a plurality of protection elements is blown due to an overcurrent flowing along a current-carrying path, a heater provided in at least one of the plurality of protection elements generates heat due to a sneak current flowing via the plurality of protection elements on the current-carrying path which is remained and blows the other of the two fuse elements provided in the at least one of the plurality of protection elements.
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公开(公告)号：US20240429331A1
公开(公告)日：2024-12-26
申请号：US18822267
申请日：2024-09-01
Applicant: Dexerials Corporation
Inventor： Takatomo ISOMURA , Etsuji OMURA
IPC: H01L31/0236 , H01L31/0216 , H01L31/0304 , H01L31/105
Abstract: In a semiconductor light receiving element having a light receiving part having a light absorption layer on a first surface side of a semiconductor substrate that is transparent to light with wavelengths in the infrared region for optical communication, a second surface side opposite to the first surface is provided with an inclined portion inclined at a predetermined angle with respect to the first surface in a region where transmitted light that has passed through the light absorption layer of incident light that has entered the light receiving part from the opposite side to the semiconductor substrate reaches, and a rough surface having irregularities with a height equal to or greater than the wavelength of the transmitted light is formed on the inclined portion, thereby reducing re-entry of the transmitted light into the light receiving part.
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公开(公告)号：US12176167B2
公开(公告)日：2024-12-24
申请号：US18021862
申请日：2021-08-20
Applicant: DEXERIALS CORPORATION
Inventor： Yoshihiro Yoneda
IPC: H01H39/00 , H01H85/00 , H01H85/055 , H01H85/165
Abstract: A protective element includes: a fuse element cuttable by energization in a first direction; a slider made of an insulating material, including: a plate-shaped portion extending in the first direction; a shielding portion erected in a second direction on the plate-shaped portion, having a shielding-portion through hole penetrating the shielding portion; and a case made of an insulating material, including a housing portion which houses a slider and a portion of the fuse element. The housing portion includes: a shielding-portion housing space which houses the shielding portion such that the shielding portion is movable in the second direction; and a plate-shaped-portion moving space which houses the plate-shaped portion such that the plate-shaped portion is movable in the second direction Prior to the fuse element being cut, the slider and the fuse element are housed such that the fuse element is inserted into the shielding-portion through hole.
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公开(公告)号：US20240393503A1
公开(公告)日：2024-11-28
申请号：US18697314
申请日：2022-09-28
Applicant: DEXERIALS CORPORATION
Inventor： Hitoshi WAKO
IPC: G02B1/115
Abstract: Disclosed an optical laminate in which at least two or more optical function layers with visible light transmittance are laminated, wherein the optical function layers include a first function layer that includes at least cerium oxide, has a refractive index in a range of 1.8 or more and 2.6 or less at a wavelength of 550 nm, and has a film thickness in a range of 60 nm or more and 130 nm or less, and a second function layer that is formed in contact with an upper surface of the first function layer, has a refractive index in a range of 1.4 or more and 1.6 or less at a wavelength of 550 nm, and has a film thickness in a range of 80 nm or more and 100 nm or less.
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公开(公告)号：US12147111B2
公开(公告)日：2024-11-19
申请号：US18224329
申请日：2023-07-20
Applicant: DEXERIALS CORPORATION
Inventor： Yoshihisa Shinya , Yusuke Kamata
IPC: G02F1/1335 , C08F290/06 , C08L51/00 , G02F1/1333
Abstract: A thin image display device is provided which is free from display defects caused by the deformation of an image display part and can display high brightness and high contrast images. The image display device includes an image display part, a light-transmitting protective part arranged on the image display part, and a cured resin layer interposed between the image display part and the protective part. The cured resin layer has a light transmittance in the visible region of 90% or more and a refractive index (nD) of 1.45 or more and 1.55 or less.
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