公开(公告)号：US12237096B2

公开(公告)日：2025-02-25

申请号：US17607466

申请日：2020-04-23

Applicant: DEXERIALS CORPORATION

Inventor： Yusuke Tanaka ,  Masaharu Aoki ,  Saori Sugioka ,  Hidetsugu Namiki ,  Shoko Kuga

IPC: H01B1/22 ,  H01B5/16

Abstract: A connection structure, a method of manufacturing the connection structure, a connection material, and a coated conductive particle capable of reducing and stabilizing a conduction resistance value. The connection structure includes: a first electronic component having a first terminal; a second electronic component having a second terminal, and a cured film provided between the first electronic component and the second electronic component and formed by curing the connection material, wherein, with regard to the coated conductive particles between the first terminal and the second terminal, metal atoms of the conductive layer diffuse into the metal of the metal fine particles, and metal atoms of the first terminal and the metal atoms of the second terminal diffuse into the metal of the metal fine particles.