Invention Application
- Patent Title: ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE MANUFACTURING APPARATUS
- Patent Title (中): 电子设备，制造方法和电子设备制造设备
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Application No.: US13671970Application Date: 2012-11-08
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Publication No.: US20130187293A1Publication Date: 2013-07-25
- Inventor: Taiji SAKAI , Nobuhiro IMAIZUMI
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki-shi
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki-shi
- Priority: JP2012-009728 20120120; JP2012-149410 20120703
- Main IPC: H01L21/762
- IPC: H01L21/762 ; G21K5/02 ; H01L23/488
Abstract:
According to this disclosure, a method of manufacturing an electronic device is provided, which includes exposing a top surface of a first electrode of a first electronic component to organic acid, irradiating the top surface of the first electrode exposed to the organic acid with ultraviolet light, and bonding the first electrode and a second electrode of a second electronic component by heating and pressing the first electrode and the second electrode each other.
Public/Granted literature
- US08922027B2 Electronic device having electrodes bonded with each other Public/Granted day:2014-12-30
Information query
IPC分类:
