公开(公告)号：US20140057369A1

公开(公告)日：2014-02-27

申请号：US13719082

申请日：2012-12-18

Applicant: SK HYNIX INC.

Inventor： Kyu Won LEE ,  Cheol-Ho JOH ,  Ji Eun KIM ,  Hee-Min SHIN ,  Chong Ho CHO

IPC: H01L21/48

CPC classification number: H01L21/4846 ,  H01L21/4867 ,  H01L23/3178 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/02311 ,  H01L2224/02317 ,  H01L2224/02375 ,  H01L2224/0332 ,  H01L2224/03515 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05554 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Methods of forming an interconnection line pattern using a screen printing technique. The method includes preparing a substrate having unevenness, aligning a stencil mask on the substrate, and printing a paste including materials for forming the interconnection line pattern on a convex portion of the unevenness formed on the substrate.

Abstract translation: 使用丝网印刷技术形成互连线图案的方法。 该方法包括制备具有凹凸的基板，使基板上的模板掩模对准，以及在形成在基板上的凹凸的凸部上印刷包括用于形成互连线图案的材料的浆料。

公开(公告)号：US20130341785A1

公开(公告)日：2013-12-26

申请号：US13530835

申请日：2012-06-22

Applicant: Lei Fu ,  Xuefeng Zhang ,  Lihong Cao

Inventor： Lei Fu ,  Xuefeng Zhang ,  Lihong Cao

IPC: H01L23/498 ,  H01L21/50 ,  H01L21/28

CPC classification number: H01L23/3192 ,  H01L23/293 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03416 ,  H01L2224/0347 ,  H01L2224/03515 ,  H01L2224/03614 ,  H01L2224/0401 ,  H01L2224/05005 ,  H01L2224/05026 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05541 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05562 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05583 ,  H01L2224/05584 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/16506 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/01082 ,  H01L2924/00012 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01074 ,  H01L2924/20755 ,  H01L2924/20754 ,  H01L2924/20753 ,  H01L2924/20752 ,  H01L2924/20751 ,  H01L2924/2076 ,  H01L2924/20759 ,  H01L2924/00

Abstract: Methods and apparatus to protect fragile dielectric layers in a semiconductor chip are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first polymer layer over a conductor pad of a semiconductor chip where the conductor pad has a first lateral dimension. An underbump metallization structure is formed on the first polymer layer and in ohmic contact with the conductor pad. The underbump metallization structure has a second lateral dimension greater than the first lateral dimension. A second polymer layer is formed on the first polymer layer with a first opening exposing at least a portion of the underbump metallization structure.

Abstract translation: 公开了用于保护半导体芯片中易碎介质层的方法和装置。 一方面，提供一种制造方法，其包括在半导体芯片的导体焊盘上形成第一聚合物层，其中导体焊盘具有第一横向尺寸。 在第一聚合物层上形成底部金属化结构并与导电垫欧姆接触。 底部喷涂金属化结构具有大于第一横向尺寸的第二横向尺寸。 在第一聚合物层上形成第二聚合物层，其中第一开口露出底部金属化结构的至少一部分。

公开(公告)号：US12048948B2

公开(公告)日：2024-07-30

申请号：US16427723

申请日：2019-05-31

Applicant: APPLIED MATERIALS, INC.

Inventor： Yueh Sheng Ow ,  Yue Cui ,  Arvind Sundarrajan ,  Nuno Yen-Chu Chen ,  Guan Huei See ,  Felix Deng

IPC: B05D3/06 ,  H01L23/00 ,  H01P3/08 ,  H01P11/00

CPC classification number: B05D3/06 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/03515 ,  H01L2224/0401 ,  H01L2224/05024 ,  H01L2924/19031 ,  H01L2924/19032 ,  H01L2924/3511 ,  H01P3/08 ,  H01P11/003

Abstract: Methods of curing a polymer layer on a substrate using variable microwave frequency are provided herein. In some embodiments, methods of curing a polymer layer on a substrate using variable microwave frequency include (a) forming a first thin-film polymer layer on a substrate, the first thin-film polymer layer including at least one first base dielectric material and at least one microwave tunable material, (b) applying a variable frequency microwave energy to the substrate and the first thin-film polymer layer to heat the substrate and the first thin-film polymer layer to a first temperature, and (c) adjusting the variable frequency microwave energy applied to the substrate and the first thin-film polymer layer to tune at least one material property of the first thin-film polymer layer.

公开(公告)号：US12020951B2

公开(公告)日：2024-06-25

申请号：US17594346

申请日：2020-04-14

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ankit Mahajan ,  Saagar A. Shah ,  Mikhail L. Pekurovsky ,  Kayla C. Niccum ,  Kara A. Meyers ,  Matthew R. D. Smith ,  Gino L. Pitera ,  Graham M. Clarke ,  Jeremy K. Larsen ,  Teresa M. Goeddel

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L21/56 ,  H01L23/293 ,  H01L23/3107 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/03312 ,  H01L2224/0332 ,  H01L2224/03505 ,  H01L2224/03515 ,  H01L2224/04105 ,  H01L2224/05567

Abstract: A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.

公开(公告)号：US08497432B2

公开(公告)日：2013-07-30

申请号：US12561526

申请日：2009-09-17

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H05K1/16

CPC classification number: H05K3/305 ,  G02F1/13458 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02373 ,  H01L2224/02377 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/0331 ,  H01L2224/0332 ,  H01L2224/03515 ,  H01L2224/0361 ,  H01L2224/0362 ,  H01L2224/03831 ,  H01L2224/0519 ,  H01L2224/05191 ,  H01L2224/05548 ,  H01L2224/05551 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/0569 ,  H01L2224/05691 ,  H01L2224/061 ,  H01L2224/06155 ,  H01L2224/06505 ,  H01L2224/08058 ,  H01L2224/08238 ,  H01L2224/09055 ,  H01L2224/2731 ,  H01L2224/2732 ,  H01L2224/27515 ,  H01L2224/2761 ,  H01L2224/27825 ,  H01L2224/27831 ,  H01L2224/29008 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/29017 ,  H01L2224/29023 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29563 ,  H01L2224/2957 ,  H01L2224/29582 ,  H01L2224/29624 ,  H01L2224/29644 ,  H01L2224/29647 ,  H01L2224/29655 ,  H01L2224/29664 ,  H01L2224/29666 ,  H01L2224/29671 ,  H01L2224/29684 ,  H01L2224/301 ,  H01L2224/30155 ,  H01L2224/30505 ,  H01L2224/32058 ,  H01L2224/32238 ,  H01L2224/33055 ,  H01L2224/80194 ,  H01L2224/80203 ,  H01L2224/80385 ,  H01L2224/80424 ,  H01L2224/80444 ,  H01L2224/80447 ,  H01L2224/80488 ,  H01L2224/8085 ,  H01L2224/80862 ,  H01L2224/8088 ,  H01L2224/80902 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/834 ,  H01L2224/83424 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83488 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83902 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H05K3/325 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/00 ,  H01L2924/01022 ,  H01L2924/01028

Abstract: An electronic component mounting structure includes a substrate having a terminal, an electronic component having an active face, an electrode that is formed on the active face of the electronic component, a base resin that is formed on the active face, a first opening that is formed at the base resin to expose the electrode, and a conductive film that covers a part of a top surface of the base resin and that is electrically connected to the electrode via the first opening. Because the base resin is bonded to the substrate, the bonding strength between the conductive film located on the top surface of the base resin and the terminal of the substrate is increased. Therefore, the reliability of electrical connection between the conductive film and the terminal is improved.

Abstract translation: 一种电子部件安装结构，包括具有端子的基板，具有有源面的电子部件，形成在电子部件的主动面上的电极，形成在主动面上的基体树脂，第一开口部 形成在所述基体树脂上以露出所述电极;以及导电膜，其覆盖所述基础树脂的顶表面的一部分并且经由所述第一开口电连接到所述电极。 由于基体树脂与基板结合，所以位于基体树脂的上表面的导电膜与基板的端子之间的接合强度提高。 因此，提高了导电膜和端子之间的电连接的可靠性。

公开(公告)号：US20240096835A1

公开(公告)日：2024-03-21

申请号：US18055890

申请日：2022-11-16

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Pin-Jing SU ,  Liang-Yi HUNG ,  Yu-Po WANG

IPC: H01L23/00

CPC classification number: H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/02379 ,  H01L2224/03515 ,  H01L2224/17519 ,  H01L2224/24998 ,  H01L2224/33519 ,  H01L2224/7525 ,  H01L2924/16235

Abstract: A method of manufacturing an electronic package is provided, in which an electronic element is disposed on a carrier structure; a heat dissipation body of a heat dissipation structure is disposed on the electronic element via a heat dissipation material; the heat dissipation material is cured; supporting legs of the heat dissipation structure are fixed on the carrier structure via a bonding layer; and the bonding layer is cured. Therefore, the heat dissipation structure can be effectively fixed to the heat dissipation material and the bonding layer by completing the arrangements of the heat dissipation material and the bonding layer in stages.

公开(公告)号：US20180203353A1

公开(公告)日：2018-07-19

申请号：US15744676

申请日：2016-09-20

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yu SHOJI ,  Yuki MASUDA ,  Kimio ISOBE ,  Ryoji OKUDA

IPC: G03F7/038 ,  C08G69/02 ,  C08G69/40 ,  G03F7/16 ,  G03F7/20 ,  G03F7/26 ,  G03F7/40 ,  H01L23/00

CPC classification number: G03F7/0387 ,  C08G69/02 ,  C08G69/40 ,  G03F7/0226 ,  G03F7/023 ,  G03F7/0233 ,  G03F7/16 ,  G03F7/161 ,  G03F7/168 ,  G03F7/20 ,  G03F7/26 ,  G03F7/40 ,  H01L23/293 ,  H01L23/3192 ,  H01L23/562 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02331 ,  H01L2224/024 ,  H01L2224/03462 ,  H01L2224/03515 ,  H01L2224/0362 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2924/0695 ,  H01L2924/3511 ,  H01L2924/014

Abstract: Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.

公开(公告)号：US08975175B1

公开(公告)日：2015-03-10

申请号：US13930668

申请日：2013-06-28

Applicant: SunPower Corporation

Inventor： Thomas Pass

IPC: H01L21/44 ,  H01L21/322 ,  H01L21/265 ,  H01L21/8238 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00

CPC classification number: H01L24/03 ,  H01L24/05 ,  H01L24/40 ,  H01L24/84 ,  H01L31/022425 ,  H01L31/05 ,  H01L31/0504 ,  H01L33/62 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/03515 ,  H01L2224/03848 ,  H01L2224/04034 ,  H01L2224/05011 ,  H01L2224/05012 ,  H01L2224/05023 ,  H01L2224/05078 ,  H01L2224/0529 ,  H01L2224/05294 ,  H01L2224/05324 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05562 ,  H01L2224/05567 ,  H01L2224/05601 ,  H01L2224/05611 ,  H01L2224/05618 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05673 ,  H01L2224/05676 ,  H01L2224/05794 ,  H01L2224/05839 ,  H01L2224/40499 ,  H01L2224/84203 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/12041 ,  Y02E10/50 ,  H01L2924/00012 ,  H01L2924/01048 ,  H01L2924/014 ,  H01L2224/37099

Abstract: A contact region for a semiconductor substrate is disclosed. Embodiments can include forming a seed metal layer having an exposed solder pad region on the semiconductor substrate and forming a first metal layer on the seed metal layer. In an embodiment, a solderable material, such as silver, can be formed on the exposed solder pad region prior to forming the first metal layer. Embodiments can include forming a solderable material on the exposed solder pad region after forming the first metal layer. Embodiments can also include forming a plating contact region on the seed metal layer, where the plating contact region allows for electrical conduction during a plating process.

Abstract translation: 公开了一种用于半导体衬底的接触区域。 实施例可以包括在半导体衬底上形成具有暴露的焊盘区域的种子金属层，并在种子金属层上形成第一金属层。 在一个实施例中，在形成第一金属层之前，可以在暴露的焊盘区域上形成诸如银的可焊接材料。 实施例可以包括在形成第一金属层之后在暴露的焊盘区域上形成可焊接材料。 实施例还可以包括在种子金属层上形成电镀接触区域，其中电镀接触区域允许电镀过程中的导电。

公开(公告)号：US20130087371A1

公开(公告)日：2013-04-11

申请号：US13270268

申请日：2011-10-11

Applicant: Georg Meyer-Berg

Inventor： Georg Meyer-Berg

IPC: H05K1/09 ,  H01R9/00 ,  H05K1/11

CPC classification number: H01L24/03 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/03332 ,  H01L2224/03442 ,  H01L2224/03515 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0529 ,  H01L2224/053 ,  H01L2224/05564 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/0579 ,  H01L2224/058 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/05847 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/3512 ,  H05K3/3436 ,  H05K2201/10719 ,  Y10T29/49147 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01026 ,  H01L2924/0105 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A surface mount packaging connector includes an elastic conductor, an interconnect pad, and a conductive layer. The elastic conductor has a top surface. The interconnect pad is electrically coupled to the elastic conductor. The top surface of the elastic conductor is arranged away from the interconnect pad. The conductive layer is on the top surface of the elastic conductor. The conductive layer provides an increased electrically conductive surface area and may also be a solderable surface.

Abstract translation: 表面贴装封装连接器包括弹性导体，互连焊盘和导电层。 弹性导体具有顶面。 互连焊盘电耦合到弹性导体。 弹性导体的顶表面远离互连垫布置。 导电层位于弹性导体的顶表面上。 导电层提供增加的导电表面积并且还可以是可焊接表面。

公开(公告)号：US20100071946A1

公开(公告)日：2010-03-25

申请号：US12561526

申请日：2009-09-17

Applicant: Nobuaki HASHIMOTO

Inventor： Nobuaki HASHIMOTO

IPC: H05K1/16 ,  H05K1/02

CPC classification number: H05K3/305 ,  G02F1/13458 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02373 ,  H01L2224/02377 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/0331 ,  H01L2224/0332 ,  H01L2224/03515 ,  H01L2224/0361 ,  H01L2224/0362 ,  H01L2224/03831 ,  H01L2224/0519 ,  H01L2224/05191 ,  H01L2224/05548 ,  H01L2224/05551 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/0569 ,  H01L2224/05691 ,  H01L2224/061 ,  H01L2224/06155 ,  H01L2224/06505 ,  H01L2224/08058 ,  H01L2224/08238 ,  H01L2224/09055 ,  H01L2224/2731 ,  H01L2224/2732 ,  H01L2224/27515 ,  H01L2224/2761 ,  H01L2224/27825 ,  H01L2224/27831 ,  H01L2224/29008 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/29017 ,  H01L2224/29023 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29563 ,  H01L2224/2957 ,  H01L2224/29582 ,  H01L2224/29624 ,  H01L2224/29644 ,  H01L2224/29647 ,  H01L2224/29655 ,  H01L2224/29664 ,  H01L2224/29666 ,  H01L2224/29671 ,  H01L2224/29684 ,  H01L2224/301 ,  H01L2224/30155 ,  H01L2224/30505 ,  H01L2224/32058 ,  H01L2224/32238 ,  H01L2224/33055 ,  H01L2224/80194 ,  H01L2224/80203 ,  H01L2224/80385 ,  H01L2224/80424 ,  H01L2224/80444 ,  H01L2224/80447 ,  H01L2224/80488 ,  H01L2224/8085 ,  H01L2224/80862 ,  H01L2224/8088 ,  H01L2224/80902 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/834 ,  H01L2224/83424 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83488 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83902 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H05K3/325 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/00 ,  H01L2924/01022 ,  H01L2924/01028

Abstract: An electronic component mounting structure includes: an electronic component including a plurality of bump electrodes that includes a base resin provided on an active face of the electronic component and a plurality of conductive films that cover a part of a surface of the base resin, expose an area excluding the part of the surface, and are electrically coupled to a plurality of electrode terminals provided on the active face; and a substrate including a plurality of terminals. In the structure, the electronic component is mounted on the substrate, and the base resin includes: a first opening surrounding the plurality of the electrode terminals; a connection portion in which a part of one ends of the plurality of the conductive films that are drawn out on the surface of the base resin is disposed, the other ends of the conductive films being coupled to the electrode terminals; and a bonding portion that is bonded to the substrate, and is formed in an area excluding the first opening and the connection portion, and an elastic deformation of the base resin at the connection portion allows the bonding portion to bond the substrate so as to maintain the conductive films and the plurality of the terminals on the substrate in a bonded state.

Abstract translation: 电子部件安装结构包括：电子部件，包括多个突起电极，所述突起电极包括设置在所述电子部件的有效面上的基体树脂和覆盖所述基础树脂的表面的一部分的多个导电膜， 并且电耦合到设置在有源面上的多个电极端子; 以及包括多个端子的基板。 在该结构中，电子部件安装在基板上，基体树脂包括：围绕多个电极端子的第一开口; 所述多个导电膜的一端的一部分被设置在所述基体树脂的表面上的连接部，所述导电膜的另一端与所述电极端子连接; 以及接合部，其接合到所述基板，并且形成在除了所述第一开口和所述连接部之外的区域中，并且所述基部树脂在所述连接部处的弹性变形使得所述接合部分接合所述基板以便保持 导电膜和处于接合状态的基板上的多个端子。