专利检索 cpc:"H01L2224/29563" 第 1 页

1.

发明授权
Electronic component mounting structure 失效
标题翻译：电子元件安装结构

公开(公告)号：US08497432B2

公开(公告)日：2013-07-30

申请号：US12561526

申请日：2009-09-17

申请人： Nobuaki Hashimoto

发明人： Nobuaki Hashimoto

IPC分类号： H05K1/16

CPC分类号： H05K3/305 , G02F1/13458 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/80 , H01L24/83 , H01L2224/02311 , H01L2224/02313 , H01L2224/02373 , H01L2224/02377 , H01L2224/02379 , H01L2224/02381 , H01L2224/0239 , H01L2224/0331 , H01L2224/0332 , H01L2224/03515 , H01L2224/0361 , H01L2224/0362 , H01L2224/03831 , H01L2224/0519 , H01L2224/05191 , H01L2224/05548 , H01L2224/05551 , H01L2224/05553 , H01L2224/05556 , H01L2224/05572 , H01L2224/05582 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/0569 , H01L2224/05691 , H01L2224/061 , H01L2224/06155 , H01L2224/06505 , H01L2224/08058 , H01L2224/08238 , H01L2224/09055 , H01L2224/2731 , H01L2224/2732 , H01L2224/27515 , H01L2224/2761 , H01L2224/27825 , H01L2224/27831 , H01L2224/29008 , H01L2224/29011 , H01L2224/29013 , H01L2224/29017 , H01L2224/29023 , H01L2224/29082 , H01L2224/29101 , H01L2224/29124 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/29191 , H01L2224/29563 , H01L2224/2957 , H01L2224/29582 , H01L2224/29624 , H01L2224/29644 , H01L2224/29647 , H01L2224/29655 , H01L2224/29664 , H01L2224/29666 , H01L2224/29671 , H01L2224/29684 , H01L2224/301 , H01L2224/30155 , H01L2224/30505 , H01L2224/32058 , H01L2224/32238 , H01L2224/33055 , H01L2224/80194 , H01L2224/80203 , H01L2224/80385 , H01L2224/80424 , H01L2224/80444 , H01L2224/80447 , H01L2224/80488 , H01L2224/8085 , H01L2224/80862 , H01L2224/8088 , H01L2224/80902 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83203 , H01L2224/83385 , H01L2224/834 , H01L2224/83424 , H01L2224/83444 , H01L2224/83447 , H01L2224/83488 , H01L2224/8385 , H01L2224/83862 , H01L2224/8388 , H01L2224/83902 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H05K3/325 , H05K2201/0367 , H05K2201/0382 , H05K2201/091 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/01023 , H01L2924/00 , H01L2924/01022 , H01L2924/01028

摘要： An electronic component mounting structure includes a substrate having a terminal, an electronic component having an active face, an electrode that is formed on the active face of the electronic component, a base resin that is formed on the active face, a first opening that is formed at the base resin to expose the electrode, and a conductive film that covers a part of a top surface of the base resin and that is electrically connected to the electrode via the first opening. Because the base resin is bonded to the substrate, the bonding strength between the conductive film located on the top surface of the base resin and the terminal of the substrate is increased. Therefore, the reliability of electrical connection between the conductive film and the terminal is improved.

摘要翻译： 一种电子部件安装结构，包括具有端子的基板，具有有源面的电子部件，形成在电子部件的主动面上的电极，形成在主动面上的基体树脂，第一开口部形成在所述基体树脂上以露出所述电极;以及导电膜，其覆盖所述基础树脂的顶表面的一部分并且经由所述第一开口电连接到所述电极。由于基体树脂与基板结合，所以位于基体树脂的上表面的导电膜与基板的端子之间的接合强度提高。因此，提高了导电膜和端子之间的电连接的可靠性。

2.

发明授权
Nanomicrocrystallite paste for pressureless sintering 有权

公开(公告)号：US09875983B2

公开(公告)日：2018-01-23

申请号：US15142263

申请日：2016-04-29

申请人： Indium Corporation

发明人： Sihai Chen , Ning-Cheng Lee

IPC分类号： H01L29/40 , H01L23/00

CPC分类号： H01L24/29 , H01L24/27 , H01L24/83 , H01L2224/27013 , H01L2224/2732 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29164 , H01L2224/29169 , H01L2224/29173 , H01L2224/29176 , H01L2224/29178 , H01L2224/29563 , H01L2224/8302 , H01L2224/83095 , H01L2224/8384

摘要： A sintering paste includes solvent and nanomicrocrystallite (NMC) particles. Each NMC particle is a single crystallite having at least one dimension in the range of 1 nm to 100 nm and at least one dimension in the range of 0.1 μm to 1000 μm. The sintering paste may be used in a pressureless sintering process to form a low porosity joint having high bond strength, high electrical and thermal conductivity, and high thermal stability.

3.

发明申请
NANOMICROCRYSTALLITE PASTE FOR PRESSURELESS SINTERING 有权

公开(公告)号：US20170317046A1

公开(公告)日：2017-11-02

申请号：US15142263

申请日：2016-04-29

申请人： Indium Corporation

发明人： Sihai Chen , Ning-Cheng Lee

IPC分类号： H01L23/00

CPC分类号： H01L24/29 , H01L24/27 , H01L24/83 , H01L2224/27013 , H01L2224/2732 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29164 , H01L2224/29169 , H01L2224/29173 , H01L2224/29176 , H01L2224/29178 , H01L2224/29563 , H01L2224/8302 , H01L2224/83095 , H01L2224/8384

摘要： A sintering paste includes solvent and nanomicrocrystallite (NMC) particles. Each NMC particle is a single crystallite having at least one dimension in the range of 1 nm to 100 nm and at least one dimension in the range of 0.1 μm to 1000 μm. The sintering paste may be used in a pressureless sintering process to form a low porosity joint having high bond strength, high electrical and thermal conductivity, and high thermal stability.

4.

发明申请
ELECTRONIC COMPONENT MOUNTING STRUCTURE 失效
标题翻译：电子元件安装结构

公开(公告)号：US20100071946A1

公开(公告)日：2010-03-25

申请号：US12561526

申请日：2009-09-17

申请人： Nobuaki HASHIMOTO

发明人： Nobuaki HASHIMOTO

IPC分类号： H05K1/16 , H05K1/02

CPC分类号： H05K3/305 , G02F1/13458 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/80 , H01L24/83 , H01L2224/02311 , H01L2224/02313 , H01L2224/02373 , H01L2224/02377 , H01L2224/02379 , H01L2224/02381 , H01L2224/0239 , H01L2224/0331 , H01L2224/0332 , H01L2224/03515 , H01L2224/0361 , H01L2224/0362 , H01L2224/03831 , H01L2224/0519 , H01L2224/05191 , H01L2224/05548 , H01L2224/05551 , H01L2224/05553 , H01L2224/05556 , H01L2224/05572 , H01L2224/05582 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/0569 , H01L2224/05691 , H01L2224/061 , H01L2224/06155 , H01L2224/06505 , H01L2224/08058 , H01L2224/08238 , H01L2224/09055 , H01L2224/2731 , H01L2224/2732 , H01L2224/27515 , H01L2224/2761 , H01L2224/27825 , H01L2224/27831 , H01L2224/29008 , H01L2224/29011 , H01L2224/29013 , H01L2224/29017 , H01L2224/29023 , H01L2224/29082 , H01L2224/29101 , H01L2224/29124 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/29191 , H01L2224/29563 , H01L2224/2957 , H01L2224/29582 , H01L2224/29624 , H01L2224/29644 , H01L2224/29647 , H01L2224/29655 , H01L2224/29664 , H01L2224/29666 , H01L2224/29671 , H01L2224/29684 , H01L2224/301 , H01L2224/30155 , H01L2224/30505 , H01L2224/32058 , H01L2224/32238 , H01L2224/33055 , H01L2224/80194 , H01L2224/80203 , H01L2224/80385 , H01L2224/80424 , H01L2224/80444 , H01L2224/80447 , H01L2224/80488 , H01L2224/8085 , H01L2224/80862 , H01L2224/8088 , H01L2224/80902 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83203 , H01L2224/83385 , H01L2224/834 , H01L2224/83424 , H01L2224/83444 , H01L2224/83447 , H01L2224/83488 , H01L2224/8385 , H01L2224/83862 , H01L2224/8388 , H01L2224/83902 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H05K3/325 , H05K2201/0367 , H05K2201/0382 , H05K2201/091 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/01023 , H01L2924/00 , H01L2924/01022 , H01L2924/01028

摘要： An electronic component mounting structure includes: an electronic component including a plurality of bump electrodes that includes a base resin provided on an active face of the electronic component and a plurality of conductive films that cover a part of a surface of the base resin, expose an area excluding the part of the surface, and are electrically coupled to a plurality of electrode terminals provided on the active face; and a substrate including a plurality of terminals. In the structure, the electronic component is mounted on the substrate, and the base resin includes: a first opening surrounding the plurality of the electrode terminals; a connection portion in which a part of one ends of the plurality of the conductive films that are drawn out on the surface of the base resin is disposed, the other ends of the conductive films being coupled to the electrode terminals; and a bonding portion that is bonded to the substrate, and is formed in an area excluding the first opening and the connection portion, and an elastic deformation of the base resin at the connection portion allows the bonding portion to bond the substrate so as to maintain the conductive films and the plurality of the terminals on the substrate in a bonded state.

摘要翻译： 电子部件安装结构包括：电子部件，包括多个突起电极，所述突起电极包括设置在所述电子部件的有效面上的基体树脂和覆盖所述基础树脂的表面的一部分的多个导电膜，并且电耦合到设置在有源面上的多个电极端子; 以及包括多个端子的基板。在该结构中，电子部件安装在基板上，基体树脂包括：围绕多个电极端子的第一开口; 所述多个导电膜的一端的一部分被设置在所述基体树脂的表面上的连接部，所述导电膜的另一端与所述电极端子连接; 以及接合部，其接合到所述基板，并且形成在除了所述第一开口和所述连接部之外的区域中，并且所述基部树脂在所述连接部处的弹性变形使得所述接合部分接合所述基板以便保持导电膜和处于接合状态的基板上的多个端子。

5.

发明申请
ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：各向异性导电膜及其制造方法

公开(公告)号：US20140106160A1

公开(公告)日：2014-04-17

申请号：US14030065

申请日：2013-09-18

申请人： HON HAI PRECISION INDUSTRY CO., LTD.

发明人： CHANG-CHIN WU , PEI-RONG SHIEH

IPC分类号： C09J9/02

CPC分类号： C09J9/02 , C08K7/18 , C08K9/02 , C09J7/35 , C09J2203/318 , C09J2203/326 , C09J2205/102 , C09J2463/00 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/27003 , H01L2224/271 , H01L2224/27848 , H01L2224/2929 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/29424 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29487 , H01L2224/2949 , H01L2224/29499 , H01L2224/29541 , H01L2224/29561 , H01L2224/29563 , H01L2224/29582 , H01L2224/3201 , H01L2224/32505 , H01L2224/83201 , H01L2224/83851 , H01L2224/83856 , H01L2924/07802 , Y10T428/252 , H01L2924/0665 , H01L2924/00014 , H01L2924/05442 , H01L2924/05341 , H01L2924/05342 , H01L2924/05042 , H01L2924/00012 , H01L2924/00

摘要： An anisotropic conductive film includes a base board and an insulation adhesive layer coated on a side surface of the base board. The insulation adhesive layer includes a plurality of conductive particles dispersed in the insulation adhesive layer. Each of the plurality of conductive particles includes a spherical base portion, a conductive film formed on the spherical base portion, and an insulation layer with ceramic materials formed on the conductive film. When the conductive particle is being pressed, the insulation layer is capable of being peeled to partly expose the conductive layer. A method for manufacturing the anisotropic conductive film is also provided.

摘要翻译： 各向异性导电膜包括基板和涂覆在基板的侧表面上的绝缘粘合剂层。绝缘粘合剂层包括分散在绝缘粘合剂层中的多个导电颗粒。多个导电粒子中的每一个包括球形基部，形成在球形基部上的导电膜，以及在导电膜上形成有陶瓷材料的绝缘层。当导电颗粒被压制时，绝缘层能够被剥离以部分地暴露导电层。还提供了制造各向异性导电膜的方法。