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    SOLDER PREFORM WITH INTERNAL FLUX CORE INCLUDING THERMOCHROMIC INDICATOR
    4.
    发明公开
    SOLDER PREFORM WITH INTERNAL FLUX CORE INCLUDING THERMOCHROMIC INDICATOR 审中-公开

    公开(公告)号：US20230191541A1

    公开(公告)日：2023-06-22

    申请号：US18110766

    申请日：2023-02-16

    Applicant: INDIUM CORPORATION

    Inventor： Craig K. Merritt ,  Anthony D. Lanza, JR. ,  James B. Hevel

    IPC: B23K35/02 ,  B23K35/26 ,  B23K35/22

    CPC classification number: B23K35/0227 ,  B23K35/262 ,  B23K35/22 ,  B23K2101/32

    Abstract: A solder preform in the shape of a solder tube or washer includes: a cylindrically shaped solder alloy body including an inner surface, an outer surface, a first end, a second end, a first opening located at the first end, and a second opening located at the second end, the second end interlocking with the first end, and the first opening and the second opening cut along an entire height of the solder alloy body; and a flux core embedded in the solder alloy body between the inner surface and the outer surface, the flux core including a thermochromic indicator. During reflow soldering, the flux core including the thermochromic indicator flows out of the first opening of the first end and the second opening of the second end to coat the inner surface of the solder alloy body and the outer surface of the solder alloy body.

    THERMALLY DECOMPOSING BUILD PLATE FOR FACILE RELEASE OF 3D PRINTED OBJECTS
    6.
    发明申请
    THERMALLY DECOMPOSING BUILD PLATE FOR FACILE RELEASE OF 3D PRINTED OBJECTS 有权

    公开(公告)号：US20210053122A1

    公开(公告)日：2021-02-25

    申请号：US16998650

    申请日：2020-08-20

    Applicant: INDIUM CORPORATION

    Inventor： David P. Socha ,  James E. Hisert ,  Elizabeth Claire Hotvedt ,  Ross B. Berntson

    IPC: B22F3/105 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00

    Abstract: Implementations of the disclosure are directed to thermally decomposable build plates that enable the facile release of 3D metal printed parts created by additive manufacturing. In some implementations, an additive manufacturing build plate comprises: a top surface, a bottom surface, and sidewalls comprised of a material, wherein the top surface, bottom surface, and sidewalls are dimensioned such that the build plate is useable in a 3D printing device; and a recessed section formed through the top surface, wherein the recessed section is configured to be filled with a solid metal or metal alloy to provide a surface for forming a 3D printed object in the 3D printing device.

    SNBI AND SNIN SOLDER ALLOYS
    9.
    发明申请
    SNBI AND SNIN SOLDER ALLOYS 审中-公开

    公开(公告)号：US20200070287A1

    公开(公告)日：2020-03-05

    申请号：US16557587

    申请日：2019-08-30

    Applicant: INDIUM CORPORATION

    Inventor： Francis M. Mutuku ,  Ning-Cheng Lee ,  Hongwen Zhang

    IPC: B23K35/26 ,  C22C13/02 ,  C22C12/00

    Abstract: Some implementations of the disclosure are directed to low melting temperature (e.g., liquidus temperature below 210° C.) SnBi or Snln solder alloys. A SnBi solder alloy may consist of 2 to 60 wt % Bi; optionally, one or more of: up to 16 wt % In, up to 4.5 wt % Ag, up to 2 wt % Cu, up to 12 wt % Sb, up to 2.5 wt % Zn, up to 1.5 wt % Ni, up to 1.5 wt % Co, up to 1.5 wt % Ge, up to 1.5 wt % P, and up to 1.5 wt % Mn; and a remainder of Sn. A Snln solder alloy may consist of: 8 to 20 wt % In; optionally, one or more of: up to 12 wt % Bi, up to 4 wt % Ag, up to 5 wt % Sb, up to 3 wt % Cu, up to 2.5 wt % Zn, up to 1.5 wt % Ni, up to 1.5 wt % Co, up to 1.5 wt % Ge, up to 1.5 wt % P, and up to 1.5 wt % Mn; and a remainder of Sn.

    SOLDER RIBBON WITH EMBEDDED MESH FOR IMPROVED RELIABILITY OF SEMICONDUCTOR DIE TO SUBSTRATE ATTACHMENT
    10.
    发明申请
    SOLDER RIBBON WITH EMBEDDED MESH FOR IMPROVED RELIABILITY OF SEMICONDUCTOR DIE TO SUBSTRATE ATTACHMENT 审中-公开

    公开(公告)号：US20190030653A1

    公开(公告)日：2019-01-31

    申请号：US16132393

    申请日：2018-09-15

    Applicant: Indium Corporation

    Inventor： Seth Homer ,  Craig Merritt

    IPC: B23K35/02 ,  B23K1/00

    Abstract: A solder ribbon with an embedded mesh for improved reliability of semiconductor die to substrate attachment is described. A solder ribbon is embedded with a mesh having a melting point greater than that of the solder. The mesh is embedded through substantially the entire area of the solder ribbon. The embedded solder ribbon may then be wound onto a spool. During a reflow soldering process, the ribbon on the spool may be cut into segments that are placed between a semiconductor die and substrate to which the semiconductor die is to be bonded. When the semiconductor assembly is heated, the solder melts, but the mesh does not, allowing for uniform bondline thickness control.

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