公开(公告)号：US12090579B2

公开(公告)日：2024-09-17

申请号：US17856765

申请日：2022-07-01

申请人： INDIUM CORPORATION

发明人： Weiping Liu ,  Ning-Cheng Lee

IPC分类号： C22C13/00 ,  B23K35/26 ,  C22C13/02 ,  H01L23/00

CPC分类号： B23K35/262 ,  C22C13/00 ,  C22C13/02 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/04026 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05639 ,  H01L2224/1131 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/81815 ,  H01L2224/83815 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2224/05639 ,  H01L2924/00014 ,  H01L2224/05166 ,  H01L2924/00014 ,  H01L2224/05155 ,  H01L2924/00014 ,  H01L2224/29111 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/014 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/014 ,  H01L2224/29111 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/014

摘要： A SnAgCuSbBi-based Pb-free solder alloy is disclosed. The disclosed solder alloy is particularly suitable for, but not limited to, producing solder joints, in the form of solder preforms, solder balls, solder powder, or solder paste (a mixture of solder powder and flux), for harsh environment electronics.

公开(公告)号：US20240243091A1

公开(公告)日：2024-07-18

申请号：US18415074

申请日：2024-01-17

申请人： THE INDIUM CORPORATION OF AMERICA

发明人： Richard McDonough ,  Milos Lazic ,  David P. Socha

IPC分类号： H01L23/00 ,  H01L21/48

CPC分类号： H01L24/27 ,  H01L21/4882 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/16221 ,  H01L2224/2743 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/29171 ,  H01L2224/2918 ,  H01L2224/29184 ,  H01L2224/32245 ,  H01L2224/32506 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2924/01048 ,  H01L2924/0133

摘要： Thermal interface materials deposited in solid form, in a layered manner, and their uses in electronics assembly are described. In one implementation, a method includes: forming an assembly including multiple solid metal thermal interface materials (TIMs) between a first device and a second device such that a first surface of the solid metal TIMs is in touching relation with a surface of the first device, and a second surface of the solid metal TIMs opposite the first surface is in touching relation with a surface of the second device, the solid metal TIMs including a first solid metal TIM and a second solid metal TIM; and forming a liquid TIM alloy from the solid metal TIMs by heating the assembly above a first solidus temperature of the first solid metal TIM, the liquid TIM alloy having a second solidus temperature below the first solidus temperature.

公开(公告)号：US12030126B2

公开(公告)日：2024-07-09

申请号：US17383150

申请日：2021-07-22

申请人： THE INDIUM CORPORATION OF AMERICA

发明人： Martin Thuo ,  Ian Tevis

IPC分类号： B22F9/06

CPC分类号： B22F9/06 ,  B22F2201/01 ,  B22F2201/03

摘要： A droplet comprises a core including an alloy comprising a majority of a first metallic element and a minority of a second element, wherein the core is in a liquid state below a solidus temperature of the alloy. A shell is arranged to enclose the core and includes an exterior surface comprising a majority of the second element and a minority of the first metallic element, wherein the shell is in a solid state below the solidus temperature of the alloy. The alloy can comprise a solder material that can be used to form solder connections below a solidus temperature of the alloy.

公开(公告)号：US20230405677A1

公开(公告)日：2023-12-21

申请号：US18454606

申请日：2023-08-23

申请人： INDIUM CORPORATION

发明人： David P. Socha

IPC分类号： B22F10/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B22F12/30

CPC分类号： B22F10/00 ,  B33Y10/00 ,  B22F10/28 ,  B33Y40/00 ,  B22F12/30 ,  B33Y30/00

摘要： A method includes: obtaining a build plate useable in a 3D printing device, the build plate including a recessed section extending through a top surface of the build plate, and the recessed section including first and second sidewalls, and a lower surface extending from the first sidewall to the second sidewall; filling the recessed section with a liquid form of a metal or metal alloy; and cooling the metal or metal alloy below its solidus temperature such that the liquid form of the metal or metal alloy solidifies into a solid form of the metal or metal alloy. The solid form contacts the first sidewall, the second sidewall, and the lower surface. The solid form includes a build surface for forming a 3D printed metal object in the 3D printing device. The 3D printed metal object is releasable by melting the solid form of the metal or metal alloy.

公开(公告)号：US11807536B2

公开(公告)日：2023-11-07

申请号：US16977699

申请日：2020-03-13

申请人： INDIUM CORPORATION

发明人： Hongtao Xia ,  Fen Chen ,  Ning-Cheng Lee

IPC分类号： B05D3/00 ,  C01B32/225 ,  C01B32/205 ,  B32B3/26 ,  B32B9/00 ,  B26F1/24 ,  B05D3/12 ,  H01L23/373 ,  C23C2/02 ,  C23C2/04 ,  C23C2/40 ,  B05D1/18

CPC分类号： C01B32/225 ,  B05D3/002 ,  B05D3/12 ,  B26F1/24 ,  B32B3/266 ,  B32B9/007 ,  C01B32/205 ,  C23C2/02 ,  C23C2/04 ,  C23C2/40 ,  H01L23/373 ,  B05D1/18 ,  B05D2252/02 ,  B05D2252/10 ,  B32B2255/205 ,  B32B2255/26

摘要： Some implementations of the disclosure are directed to a method, comprising: receiving a sheet of graphite comprising a first surface and a second surface opposite the first surface; and perforating the sheet in a first plurality of locations from the first surface through the second surface to form a first plurality of perforations through the sheet and a first plurality of protrusions of the graphite oriented outward from the second surface, the first plurality of protrusions configured to conduct heat away from a plane of the sheet. Further implementations comprise perforating the sheet in a second plurality of locations from the second surface through the first surface to form a second plurality of perforations through the sheet and a second plurality of protrusions of graphite material oriented outward from the first surface, wherein the second plurality of protrusions are configured to conduct heat away from the plane of the sheet.

公开(公告)号：US20220375816A1

公开(公告)日：2022-11-24

申请号：US17747923

申请日：2022-05-18

申请人： INDIUM CORPORATION

发明人： Ross B. Berntson ,  David P. Socha

IPC分类号： H01L23/373 ,  H01L23/367 ,  H01L21/48

摘要： Solid metal foam thermal interface materials and their uses in electronics assembly are described. In one implementation, a method includes: applying a thermal interface material (TIM) between a first device and a second device to form an assembly having a first surface of the TIM in in touching relation with a surface of the first device, and a second surface of the TIM opposite the first surface in touching relation with a surface of the second device, the TIM comprising a solid metal foam and a first liquid metal; and compressing the assembly to form an alloy from the TIM that bonds the first device to the second device.

公开(公告)号：US20220184749A1

公开(公告)日：2022-06-16

申请号：US17688735

申请日：2022-03-07

申请人： INDIUM CORPORATION

发明人： Hongwen Zhang ,  Fen Chen ,  Francis Mutuku ,  Jie Geng ,  Ning-Cheng Lee

IPC分类号： B23K35/26 ,  C22C13/02 ,  B23K35/02 ,  B23K1/008

摘要： Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.

公开(公告)号：US10943795B2

公开(公告)日：2021-03-09

申请号：US16246417

申请日：2019-01-11

申请人： Indium Corporation

发明人： Ross B. Berntson ,  James E. Hisert ,  Robert N. Jarrett ,  Jordan P. Ross

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/367 ,  H01L23/373 ,  H01L33/64

摘要： A method of joining a semiconductor die to a passive heat exchanger can include applying a bond enhancing agent to a semiconductor device; creating an assembly that includes a thermal interface disposed on the semiconductor device such that a first major surface of the thermal interface material is in touching relation with the bond enhancing agent on the semiconductor device, and a heat exchanger disposed in touching relation with a second major surface of the thermal interface material; and reflowing the assembly such that the thermal interface bonds the heat exchanger to the semiconductor device. Embodiments can use the ability of indium to bond to a non-metallic surface to form the thermal interface, which may be enhanced by a secondary coating on either or both joining surfaces.

公开(公告)号：US20200269360A1

公开(公告)日：2020-08-27

申请号：US16801556

申请日：2020-02-26

申请人： INDIUM CORPORATION

发明人： Jie Geng ,  Hongwen Zhang ,  Ning-Cheng Lee

IPC分类号： B23K35/26 ,  B23K35/02

摘要： High reliability leadfree solder alloys for harsh service conditions are disclosed. In some embodiments, a solder alloy comprises 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a component comprising: a main ceramic body, and a side surface having disposed thereon an electrode and a thermal pad; a copper substrate; and a solder alloy electrically coupling the component and the copper substrate, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a light-emitting diode (LED) component; a Metal Core Printed Circuit Board (MCPCB); and a solder alloy electrically coupling the LED component and the MCPCB, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn.

公开(公告)号：US20190394883A1

公开(公告)日：2019-12-26

申请号：US16445904

申请日：2019-06-19

申请人： INDIUM CORPORATION

发明人： Lee C. Kresge ,  Elaina J. Zito ,  Ning-Cheng Lee

IPC分类号： H05K3/30 ,  H05K1/11 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K3/32 ,  H05K3/42

摘要： Implementations of the disclosure describe techniques for eliminating or reducing hot tearing in via-in-pad plated over (VIPPO) solder joints by incorporating an adhesive into a printed circuit board assembly (PCBA). In an embodiment, the adhesive is an adhesive containing fluxing agent that prevents tearing by reducing a differential in thermal expansion caused by a coefficient of thermal expansion (CTE) mismatch between a plated metal of the VIPPO pads and the PCB substrate.