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12 条记录 (耗时 0.017 秒)

    BUILD PLATE WITH THERMALLY DECOMPOSING TOP SURFACE FOR FACILE RELEASE OF 3D PRINTED OBJECTS
    1.
    发明申请
    BUILD PLATE WITH THERMALLY DECOMPOSING TOP SURFACE FOR FACILE RELEASE OF 3D PRINTED OBJECTS 有权

    公开(公告)号：US20220266344A1

    公开(公告)日：2022-08-25

    申请号：US17678820

    申请日：2022-02-23

    申请人： INDIUM CORPORATION

    发明人： David P. Socha ,  Mark K. Olearczyk

    IPC分类号： B22F12/30 ,  B29C64/245 ,  B33Y10/00 ,  B33Y30/00

    摘要： Thermally decomposable build plates that enable the facile release of 3D printed parts are described. In one implementation, an additive manufacturing build plate comprises: a body including a top surface, a bottom surface, and sidewalls dimensioned such that the build plate is useable in a 3D printing device; and a layer of a solid metal or metal alloy on the top surface of the additive manufacturing build plate, the layer having a solidus temperature that is lower than a solidus temperature of the body, and the layer configured to provide a surface for forming a 3D object in the 3D printing device. In one implementation, an additive manufacturing build plate comprises a recessed section for receiving an insert including a layer of a solid metal or metal alloy on a surface of the insert.

    THERMALLY DECOMPOSING BUILD PLATE FOR FACILE RELEASE OF 3D PRINTED OBJECTS
    4.
    发明公开
    THERMALLY DECOMPOSING BUILD PLATE FOR FACILE RELEASE OF 3D PRINTED OBJECTS 审中-公开

    公开(公告)号：US20230405677A1

    公开(公告)日：2023-12-21

    申请号：US18454606

    申请日：2023-08-23

    申请人： INDIUM CORPORATION

    发明人： David P. Socha

    IPC分类号： B22F10/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B22F12/30

    CPC分类号： B22F10/00 ,  B33Y10/00 ,  B22F10/28 ,  B33Y40/00 ,  B22F12/30 ,  B33Y30/00

    摘要： A method includes: obtaining a build plate useable in a 3D printing device, the build plate including a recessed section extending through a top surface of the build plate, and the recessed section including first and second sidewalls, and a lower surface extending from the first sidewall to the second sidewall; filling the recessed section with a liquid form of a metal or metal alloy; and cooling the metal or metal alloy below its solidus temperature such that the liquid form of the metal or metal alloy solidifies into a solid form of the metal or metal alloy. The solid form contacts the first sidewall, the second sidewall, and the lower surface. The solid form includes a build surface for forming a 3D printed metal object in the 3D printing device. The 3D printed metal object is releasable by melting the solid form of the metal or metal alloy.

    SOLID METAL FOAM THERMAL INTERFACE MATERIAL
    5.
    发明申请
    SOLID METAL FOAM THERMAL INTERFACE MATERIAL 有权

    公开(公告)号：US20220375816A1

    公开(公告)日：2022-11-24

    申请号：US17747923

    申请日：2022-05-18

    申请人： INDIUM CORPORATION

    发明人： Ross B. Berntson ,  David P. Socha

    IPC分类号： H01L23/373 ,  H01L23/367 ,  H01L21/48

    摘要： Solid metal foam thermal interface materials and their uses in electronics assembly are described. In one implementation, a method includes: applying a thermal interface material (TIM) between a first device and a second device to form an assembly having a first surface of the TIM in in touching relation with a surface of the first device, and a second surface of the TIM opposite the first surface in touching relation with a surface of the second device, the TIM comprising a solid metal foam and a first liquid metal; and compressing the assembly to form an alloy from the TIM that bonds the first device to the second device.

    THERMALLY DECOMPOSING BUILD PLATE FOR FACILE RELEASE OF 3D PRINTED OBJECTS
    8.
    发明申请
    THERMALLY DECOMPOSING BUILD PLATE FOR FACILE RELEASE OF 3D PRINTED OBJECTS 有权

    公开(公告)号：US20210053122A1

    公开(公告)日：2021-02-25

    申请号：US16998650

    申请日：2020-08-20

    申请人： INDIUM CORPORATION

    发明人： David P. Socha ,  James E. Hisert ,  Elizabeth Claire Hotvedt ,  Ross B. Berntson

    IPC分类号： B22F3/105 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00

    摘要： Implementations of the disclosure are directed to thermally decomposable build plates that enable the facile release of 3D metal printed parts created by additive manufacturing. In some implementations, an additive manufacturing build plate comprises: a top surface, a bottom surface, and sidewalls comprised of a material, wherein the top surface, bottom surface, and sidewalls are dimensioned such that the build plate is useable in a 3D printing device; and a recessed section formed through the top surface, wherein the recessed section is configured to be filled with a solid metal or metal alloy to provide a surface for forming a 3D printed object in the 3D printing device.

    BUILD PLATE WITH INTERCHANGEABLE INSERT TO REDUCE LIFT-UP DURING METAL 3D PRINTING
    9.
    发明公开
    BUILD PLATE WITH INTERCHANGEABLE INSERT TO REDUCE LIFT-UP DURING METAL 3D PRINTING 审中-公开

    公开(公告)号：US20240342802A1

    公开(公告)日：2024-10-17

    申请号：US18633203

    申请日：2024-04-11

    申请人： THE INDIUM CORPORATION OF AMERICA

    发明人： David P. Socha ,  Brent Muncy

    IPC分类号： B22F12/30 ,  B33Y30/00

    CPC分类号： B22F12/30 ,  B33Y30/00

    摘要： Some implementations of the disclosure are directed to a build plate assembly including a body dimensioned for use in a 3D printing device, and a solid insert of a metal or metal alloy. The body includes an interior cavity formed through a top of the body, and extending to an opening at a first side of the body. The solid insert includes a top surface for forming a 3D printed metal object in the 3D printing device. The solid insert is configured to slidably couple, through the opening at the first side of the body, into the interior cavity of the body.