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1.发明授权Method for packaging ultra-thin chip with solder ball thermo-compression in wafer level packaging process 有权用于在晶圆级封装工艺中封装具有焊球热压缩的超薄芯片的方法公开(公告)号：US08563417B2
公开(公告)日：2013-10-22
申请号：US13302219
申请日：2011-11-22
Applicant: Jun Lu , Alex Niu , Yueh-Se Ho , Ping Hoang , Jacky Gong , Yan Xun Xue , Xiaolian Zhang , Ming-Chen Lu
Inventor： Jun Lu , Alex Niu , Yueh-Se Ho , Ping Hoang , Jacky Gong , Yan Xun Xue , Xiaolian Zhang , Ming-Chen Lu
IPC: H01L21/78
CPC classification number: H01L21/561 , H01L21/566 , H01L21/568 , H01L23/3157 , H01L23/49524 , H01L23/49562 , H01L24/03 , H01L24/05 , H01L24/06 , H01L2224/03009 , H01L2224/0332 , H01L2224/0384 , H01L2224/03848 , H01L2224/03849 , H01L2224/04034 , H01L2224/05553 , H01L2224/05554 , H01L2224/05794 , H01L2224/058 , H01L2224/0603 , H01L2224/06051 , H01L2224/06135 , H01L2224/06164 , H01L2224/06181 , H01L2224/32245 , H01L2224/371 , H01L2224/40247 , H01L2224/73263 , H01L2224/84801 , H01L2224/94 , H01L2924/13091 , H01L2924/181 , H01L2224/03 , H01L2224/053 , H01L2924/014 , H01L2924/00
Abstract: The invention generally relates to a packaging method of an ultra-thin chip, more specifically, the invention relates to a method for packaging the ultra-thin chip with solder ball thermo-compression in wafer level packaging process. The method starts with disposing solder balls on metal pads arranged on the front surface of semiconductor chips that are formed at the front surface of a semiconductor wafer. The solder balls are soften by heating the wafer, a compression plate is applied with a pressure on the top ends of the solder balls thus forming a co-planar top surface at the top ends of the solder balls. A molding compound is deposited on the front surface of the wafer with the top ends of the solder balls exposed. The wafer is then ground from its back surface to reduce its thickness to achieve ultra-thin chip.
Abstract translation: 本发明一般涉及超薄芯片的封装方法，更具体地说，本发明涉及一种用于在晶片级封装工艺中封装具有焊球热压缩的超薄芯片的方法。 该方法开始于将焊球设置在形成在半导体晶片的前表面的半导体芯片的前表面上的金属焊盘上。 通过加热晶片来软化焊球，压力板在焊球的顶端施加压力，从而在焊球的顶端形成共面顶表面。 模具化合物沉积在晶片的前表面上，其中焊球的顶端被暴露。 然后将晶片从其背面研磨以减小其厚度以实现超薄芯片。
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公开(公告)号：US20130087371A1
公开(公告)日：2013-04-11
申请号：US13270268
申请日：2011-10-11
Applicant: Georg Meyer-Berg
Inventor： Georg Meyer-Berg
CPC classification number: H01L24/03 , H01L23/49816 , H01L24/05 , H01L24/13 , H01L24/16 , H01L2224/03332 , H01L2224/03442 , H01L2224/03515 , H01L2224/0401 , H01L2224/05022 , H01L2224/05027 , H01L2224/0529 , H01L2224/053 , H01L2224/05564 , H01L2224/05572 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/0579 , H01L2224/058 , H01L2224/05839 , H01L2224/05844 , H01L2224/05847 , H01L2224/131 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16225 , H01L2224/16227 , H01L2224/81011 , H01L2224/81191 , H01L2924/00014 , H01L2924/12044 , H01L2924/3512 , H05K3/3436 , H05K2201/10719 , Y10T29/49147 , H01L2924/00012 , H01L2924/014 , H01L2924/01026 , H01L2924/0105 , H01L2224/05552 , H01L2924/00
Abstract: A surface mount packaging connector includes an elastic conductor, an interconnect pad, and a conductive layer. The elastic conductor has a top surface. The interconnect pad is electrically coupled to the elastic conductor. The top surface of the elastic conductor is arranged away from the interconnect pad. The conductive layer is on the top surface of the elastic conductor. The conductive layer provides an increased electrically conductive surface area and may also be a solderable surface.
Abstract translation: 表面贴装封装连接器包括弹性导体，互连焊盘和导电层。 弹性导体具有顶面。 互连焊盘电耦合到弹性导体。 弹性导体的顶表面远离互连垫布置。 导电层位于弹性导体的顶表面上。 导电层提供增加的导电表面积并且还可以是可焊接表面。
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3.发明申请公开(公告)号：US20070125989A1
公开(公告)日：2007-06-07
申请号：US11642666
申请日：2006-12-21
Applicant: Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
Inventor： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC: H01B1/12
CPC classification number: H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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4.发明申请公开(公告)号：US20070104879A1
公开(公告)日：2007-05-10
申请号：US11642707
申请日：2006-12-21
Applicant: Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
Inventor： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC: B05D3/02
CPC classification number: H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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5.发明申请公开(公告)号：US20070099330A1
公开(公告)日：2007-05-03
申请号：US11642663
申请日：2006-12-21
Applicant: Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
Inventor： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
CPC classification number: H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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Patent Agency Ranking
6.发明申请Low viscosity precursor compositons and methods for the depositon of conductive electronic features 审中-公开低粘度前体组合物和导电电子特征沉积的方法公开(公告)号：US20030148024A1
公开(公告)日：2003-08-07
申请号：US10265351
申请日：2002-10-04
Inventor： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
IPC: B05D005/12 , B05D003/02 , C23C016/06
CPC classification number: H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
Abstract translation: 用于沉积和形成诸如导电特征的电特征的前体组合物。 前体组合物有利地具有低粘度，使得能够使用直接写入工具进行沉积。 前体组合物还具有低的转化温度，使得能够沉积并转化成低温基底上的电特征。 特别优选的前体组合物包括用于形成高导电性银特征的银金属。
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公开(公告)号：US07691664B2
公开(公告)日：2010-04-06
申请号：US11642664
申请日：2006-12-21
Applicant: Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
Inventor： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
IPC: H01L21/00
CPC classification number: H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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公开(公告)号：US20080108218A1
公开(公告)日：2008-05-08
申请号：US11642664
申请日：2006-12-21
Applicant: Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
Inventor： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
IPC: H01L21/44
CPC classification number: H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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9.发明申请公开(公告)号：US20070104881A1
公开(公告)日：2007-05-10
申请号：US11642720
申请日：2006-12-21
Applicant: Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
Inventor： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC: B05D3/02
CPC classification number: H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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10.发明申请公开(公告)号：US20070104869A1
公开(公告)日：2007-05-10
申请号：US11642749
申请日：2006-12-21
Applicant: Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
Inventor： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
CPC classification number: H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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