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公开(公告)号：US20070178232A1
公开(公告)日：2007-08-02
申请号：US11642751
申请日：2006-12-21
Applicant: Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
Inventor： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
Abstract: Precursor compositions in the form of a tape that can be transferred to a substrate and converted to an electronic feature at a relatively low temperature, such as not greater than about 200° C. The tape composition can be disposed on a carrier to form a ribbon structure that is flexible and can be handled in a variety of industrial processes.
Abstract translation: 胶带形式的前体组合物可以转移到基底并在相对低的温度例如不大于约200℃下转化成电子特征。胶带组合物可以设置在载体上以形成带状物 结构灵活，可以在各种工业过程中处理。
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2.发明申请Methods and compositions for the formation of recessed electrical features on a substrate 审中-公开用于在基底上形成凹陷电特征的方法和组合物公开(公告)号：US20070122932A1
公开(公告)日：2007-05-31
申请号：US11642665
申请日：2006-12-21
Applicant: Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
Inventor： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC: H01L21/00
CPC classification number: C09D11/30 , C23C18/08 , H01B1/026 , H01C17/06506 , H01C17/06533 , H01C17/06573 , H01L21/02205 , H01L21/288 , H01L21/31691 , H05K1/0346 , H05K1/097 , H05K1/162 , H05K3/105 , H05K3/107 , H05K3/125 , H05K3/1258 , H05K3/4061 , H05K3/4069 , H05K2201/09036 , H05K2203/013 , H05K2203/1142 , H05K2203/121 , H05K2203/125
Abstract: Precursor compositions having a low conversion temperature and methods for the fabrication of recessed electrical features from the precursor compositions. The electrical features can be conductors, resistors and dielectric features. The precursor compositions are deposited into recessed features, such as trenches, formed in a substrate and are reacted at a low temperature to form electrical features having good electrical and mechanical properties. The substrate can be a low temperature substrate, such as an organic substrate.
Abstract translation: 具有低转化温度的前体组合物和用于从前体组合物制造凹陷电特征的方法。 电气特征可以是导体，电阻和电介质特征。 将前体组合物沉积到形成在基底中的凹陷特征，例如沟槽，并在低温下反应以形成具有良好电学和机械性能的电特征。 衬底可以是低温衬底，例如有机衬底。
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3.发明申请公开(公告)号：US20070104881A1
公开(公告)日：2007-05-10
申请号：US11642720
申请日：2006-12-21
Applicant: Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
Inventor： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC: B05D3/02
CPC classification number: H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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4.发明申请公开(公告)号：US20070104869A1
公开(公告)日：2007-05-10
申请号：US11642749
申请日：2006-12-21
Applicant: Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
Inventor： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
CPC classification number: H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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5.发明申请公开(公告)号：US20070102685A1
公开(公告)日：2007-05-10
申请号：US11642748
申请日：2006-12-21
Applicant: Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
Inventor： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC: H01B1/12
CPC classification number: H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20070096063A1
公开(公告)日：2007-05-03
申请号：US11642667
申请日：2006-12-21
Applicant: Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
Inventor： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC: H01B1/12
CPC classification number: H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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公开(公告)号：US20070034052A1
公开(公告)日：2007-02-15
申请号：US11331230
申请日：2006-01-13
Applicant: Karel Vanheusden , Klaus Kunze , Hyungrak Kim , Aaron Stump , Allen Schult , Mark Hampden-Smith , Chuck Edwards , Anthony James , James Caruso , Toivo Kodas , Scott Haubrich , Mark Kowalski
Inventor： Karel Vanheusden , Klaus Kunze , Hyungrak Kim , Aaron Stump , Allen Schult , Mark Hampden-Smith , Chuck Edwards , Anthony James , James Caruso , Toivo Kodas , Scott Haubrich , Mark Kowalski
IPC: B22F9/24
CPC classification number: B22F1/0018 , B22F1/0022 , B22F9/24 , B22F2998/10 , B82Y30/00 , C09D11/101 , C09D11/30 , C09D11/38 , C22B3/20 , C22B11/04 , C22B23/0453 , H01B1/22 , H01L21/288 , H05K1/097 , H05K3/125 , H05K2203/013 , Y02P10/234 , Y10S977/777 , Y10S977/896
Abstract: A process for the production of metal nanoparticles. The process comprises a rapid mixing of a solution of at least about 0.1 mole of a metal compound that is capable of being reduced to a metal by a polyol with a heated solution of a polyol and a substance that is capable of being adsorbed on the nanoparticles.
Abstract translation: 一种生产金属纳米粒子的方法。 该方法包括将至少约0.1摩尔能够被多元醇还原成金属的金属化合物与多元醇的加热溶液和能够吸附在纳米颗粒上的物质快速混合 。
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公开(公告)号：US20060189113A1
公开(公告)日：2006-08-24
申请号：US11331211
申请日：2006-01-13
Applicant: Karel Vanheusden , Klaus Kunze , Hyungrak Kim , Aaron Stump , Allen Schult , Mark Hampden-Smith , Chuck Edwards , Anthony James , James Caruso , Toivo Kodas , Scott Haubrich , Mark Kowalski
Inventor： Karel Vanheusden , Klaus Kunze , Hyungrak Kim , Aaron Stump , Allen Schult , Mark Hampden-Smith , Chuck Edwards , Anthony James , James Caruso , Toivo Kodas , Scott Haubrich , Mark Kowalski
CPC classification number: B22F1/0018 , B22F1/0022 , B22F9/24 , B22F2998/10 , B82Y30/00 , C09D11/101 , C09D11/30 , C09D11/38 , C22B3/20 , C22B11/04 , C22B23/0453 , H01B1/22 , H01L21/288 , H05K1/097 , H05K3/125 , H05K2203/013 , Y02P10/234 , Y10S977/777 , Y10S977/896
Abstract: A metal nanoparticle composition for the fabrication of conductive features. The metal nanoparticle composition advantageously has a low viscosity permitting deposition of the composition by direct-write tools. The metal nanoparticle composition advantageously also has a low conversion temperature, permitting its deposition and conversion to an electrical feature on polymeric substrates.
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公开(公告)号：US20060163744A1
公开(公告)日：2006-07-27
申请号：US11331231
申请日：2006-01-13
Applicant: Karel Vanheusden , Klaus Kunze , Hyungrak Kim , Aaron Stump , Allen Schult , Mark Hampden-Smith , Chuck Edwards , Anthony James , James Caruso , Toivo Kodas , Scott Haubrich , Mark Kowalski
Inventor： Karel Vanheusden , Klaus Kunze , Hyungrak Kim , Aaron Stump , Allen Schult , Mark Hampden-Smith , Chuck Edwards , Anthony James , James Caruso , Toivo Kodas , Scott Haubrich , Mark Kowalski
IPC: H01L23/48
CPC classification number: B82Y30/00 , C09D11/101 , C09D11/322 , C09D11/36 , C09D11/52 , H01L21/288 , H01L23/49883 , H01L23/5328 , H01L51/0022 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/095 , H05K1/097 , H05K3/12 , H05K3/125 , H05K3/1283 , H05K2201/0116 , H05K2203/1131 , H01L2924/00
Abstract: An electrical conductor formed from one or more metallic inks. The electrical conductor comprises a network of interconnected metallic nodes. Each node comprises a metallic composition, e.g., one or more metals or alloys. The network defines a plurality of pores having an average pore volume of less than about 10,000,000 nm3. The electrical conductors advantageously have a high degree of conductivity, e.g., a resistivity of not greater than about 10× the resistivity of the (bulk) metallic composition, which forms the individual nodes.
Abstract translation: 由一种或多种金属油墨形成的电导体。 电导体包括互连金属节点的网络。 每个节点包括金属组合物，例如一种或多种金属或合金。 网络限定平均孔体积小于约10,000,000nm 3的多个孔。 电导体有利地具有高度的导电性，例如电阻率不大于构成各个节点的（体）金属组合物的电阻率的约10倍。
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10.发明申请公开(公告)号：US20080093423A1
公开(公告)日：2008-04-24
申请号：US11642752
申请日：2006-12-21
Applicant: Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
Inventor： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
CPC classification number: H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
Abstract: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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