公开(公告)号：US20070142525A1

公开(公告)日：2007-06-21

申请号：US11303600

申请日：2005-12-16

申请人： Nyrissa Rogado ,  Munirpallam Subramanian ,  Jerome Smith

发明人： Nyrissa Rogado ,  Munirpallam Subramanian ,  Jerome Smith

IPC分类号： C09D5/08

CPC分类号： H01C17/06533 ,  H01C7/005 ,  H01C7/06 ,  H01C17/06573 ,  H05K1/167

摘要： Provided is a composition comprising 20 to 60 weight % of a reduced oxide of a metal selected from the group consisting of Mo, Nb, Cr and Ti, 1 to 9 weight % of a carbon allotrope and a polymer binder. A process for making a polymeric resistor having low temperature of resistance comprising mixing a polymer binder with the provided composition.

摘要翻译： 提供了包含20至60重量％的还原氧化物的金属，其选自Mo，Nb，Cr和Ti，1至9重量％的碳同素异形体和聚合物粘合剂。 制备具有低耐电阻性的聚合物电阻的方法，包括将聚合物粘合剂与所提供的组合物混合。

公开(公告)号：US20030175411A1

公开(公告)日：2003-09-18

申请号：US10265070

申请日：2002-10-04

发明人： Toivo T. Kodas ,  Mark J. Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron D. Stump ,  Allen B. Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： B05D005/12 ,  B05D003/02

CPC分类号： H01L21/02205 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D11/30 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01C17/06506 ,  H01C17/06533 ,  H01C17/06573 ,  H01G4/1227 ,  H01G4/1254 ,  H01L21/02255 ,  H01L21/02282 ,  H01L21/02288 ,  H01L21/288 ,  H01L21/31691 ,  H05K1/0346 ,  H05K1/097 ,  H05K1/162 ,  H05K1/167 ,  H05K3/105 ,  H05K3/125 ,  H05K2203/013 ,  H05K2203/1142 ,  Y10T29/49099

摘要： Precursor compositions for the deposition of electronic features such as resistors and dielectric components and methods for the deposition of the precursor compositions. The precursor compositions have a low viscosity, such as not greater than about 1000 centipoise and can be deposited using a direct-write tool. The precursors also have a low conversion temperature, enabling the formation of electronic features on a wide variety of substrates, including low temperature substrates.

公开(公告)号：US20070122932A1

公开(公告)日：2007-05-31

申请号：US11642665

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： H01L21/00

CPC分类号： C09D11/30 ,  C23C18/08 ,  H01B1/026 ,  H01C17/06506 ,  H01C17/06533 ,  H01C17/06573 ,  H01L21/02205 ,  H01L21/288 ,  H01L21/31691 ,  H05K1/0346 ,  H05K1/097 ,  H05K1/162 ,  H05K3/105 ,  H05K3/107 ,  H05K3/125 ,  H05K3/1258 ,  H05K3/4061 ,  H05K3/4069 ,  H05K2201/09036 ,  H05K2203/013 ,  H05K2203/1142 ,  H05K2203/121 ,  H05K2203/125

摘要： Precursor compositions having a low conversion temperature and methods for the fabrication of recessed electrical features from the precursor compositions. The electrical features can be conductors, resistors and dielectric features. The precursor compositions are deposited into recessed features, such as trenches, formed in a substrate and are reacted at a low temperature to form electrical features having good electrical and mechanical properties. The substrate can be a low temperature substrate, such as an organic substrate.

摘要翻译： 具有低转化温度的前体组合物和用于从前体组合物制造凹陷电特征的方法。 电气特征可以是导体，电阻和电介质特征。 将前体组合物沉积到形成在基底中的凹陷特征，例如沟槽，并在低温下反应以形成具有良好电学和机械性能的电特征。 衬底可以是低温衬底，例如有机衬底。

公开(公告)号：US20030124259A1

公开(公告)日：2003-07-03

申请号：US10265296

申请日：2002-10-04

发明人： Toivo T. Kodas ,  Mark J. Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron D. Stump ,  Allen B. Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： B05D003/02 ,  C23C016/06

CPC分类号： H01C17/06506 ,  C09D11/30 ,  C23C18/08 ,  H01B1/026 ,  H01C17/06533 ,  H01C17/06573 ,  H01L21/288 ,  H01L21/31691 ,  H05K1/097 ,  H05K3/105

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a viscosity of at least about 1000 centipoise and can be deposited by screen printing. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver and/or copper metal for the formation of highly conductive features.

摘要翻译： 用于沉积和形成诸如导电特征的电特征的前体组合物。 前体组合物有利地具有至少约1000厘泊的粘度，并且可以通过丝网印刷沉积。 前体组合物还具有低的转化温度，使得能够沉积并转化成低温基底上的电特征。 特别优选的前体组合物包括用于形成高导电特征的银和/或铜金属。

公开(公告)号：US07524528B2

公开(公告)日：2009-04-28

申请号：US10265070

申请日：2002-10-04

申请人： Toivo T. Kodas ,  Mark J. Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron D. Stump ,  Allen B. Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo T. Kodas ,  Mark J. Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron D. Stump ,  Allen B. Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： B05D5/12 ,  B05D3/00 ,  H01C17/28

CPC分类号： H01L21/02205 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D11/30 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01C17/06506 ,  H01C17/06533 ,  H01C17/06573 ,  H01G4/1227 ,  H01G4/1254 ,  H01L21/02255 ,  H01L21/02282 ,  H01L21/02288 ,  H01L21/288 ,  H01L21/31691 ,  H05K1/0346 ,  H05K1/097 ,  H05K1/162 ,  H05K1/167 ,  H05K3/105 ,  H05K3/125 ,  H05K2203/013 ,  H05K2203/1142 ,  Y10T29/49099

摘要： Precursor compositions for the deposition of electronic features such as resistors and dielectric components and methods for the deposition of the precursor compositions. The precursor compositions have a low viscosity, such as not greater than about 1000 centipoise and can be deposited using a direct-write tool. The precursors also have a low conversion temperature, enabling the formation of electronic features on a wide variety of substrates, including low temperature substrates.

摘要翻译： 用于沉积诸如电阻器和电介质组分的电子特征的前体组合物和沉积前体组合物的方法。 前体组合物具有低粘度，例如不大于约1000厘泊，并且可以使用直写工具进行沉积。 前体还具有低的转化温度，使得能够在各种基材上形成电子特征，包括低温底物。

公开(公告)号：US20070117271A1

公开(公告)日：2007-05-24

申请号：US11642687

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： H01L21/00

CPC分类号： C09D11/30 ,  C23C18/08 ,  H01B1/026 ,  H01C17/06506 ,  H01C17/06533 ,  H01C17/06573 ,  H01L21/02205 ,  H01L21/288 ,  H01L21/31691 ,  H05K1/0346 ,  H05K1/097 ,  H05K1/162 ,  H05K3/105 ,  H05K3/107 ,  H05K3/125 ,  H05K3/1258 ,  H05K3/4061 ,  H05K3/4069 ,  H05K2201/09036 ,  H05K2203/013 ,  H05K2203/1142 ,  H05K2203/121 ,  H05K2203/125

摘要： Precursor compositions having a low conversion temperature and methods for the fabrication of recessed electrical features from the precursor compositions. The electrical features can be conductors, resistors and dielectric features. The precursor compositions are deposited into recessed features, such as trenches, formed in a substrate and are reacted at a low temperature to form electrical features having good electrical and mechanical properties. The substrate can be a low temperature substrate, such as an organic substrate.

公开(公告)号：US20030015690A1

公开(公告)日：2003-01-23

申请号：US09897275

申请日：2001-07-03

申请人： Xerox Corporation

发明人： Ihor W. Tamawskyj ,  Xiaoying (Elizabeth) Yuan ,  Raymond K. Crandall

IPC分类号： H01B001/00 ,  H01C001/00 ,  H01B001/06 ,  H01B001/12

CPC分类号： H01C17/06573 ,  C08L33/00 ,  C08L33/20 ,  C08L77/00 ,  C09J9/02 ,  C09J177/00 ,  C09J177/06 ,  H01B1/20 ,  H01B1/24

摘要： A process for preparing a mixed solvent adhesive solution involving mixing an alcohol and an adhesive to form an adhesive solution; mixing a charge transporting molecule and a solvent other than alcohol to form a charge transport solution; mixing the charge transport solution with the adhesive solution to form a mixed solvent solution; mixing an electrically conductive filler and a solvent to form a filled solvent solution; and mixing the filled solvent solution to the mixed solvent solution so as to form a mixed solvent adhesive solution.

摘要翻译： 一种制备混合溶剂粘合剂溶液的方法，包括混合醇和粘合剂以形成粘合剂溶液; 混合电荷输送分子和醇以外的溶剂形成电荷输送溶液; 将电荷输送溶液与粘合剂溶液混合以形成混合溶剂溶液; 混合导电填料和溶剂以形成填充的溶剂溶液; 并将填充的溶剂溶液与混合溶剂溶液混合，以形成混合溶剂粘合剂溶液。

公开(公告)号：US5817423A

公开(公告)日：1998-10-06

申请号：US607636

申请日：1996-02-27

申请人： Hiroshi Kajimaru ,  Keiichi Asami ,  Yoshiaki Iwaya ,  Yoshiaki Echigo ,  Akira Ito

发明人： Hiroshi Kajimaru ,  Keiichi Asami ,  Yoshiaki Iwaya ,  Yoshiaki Echigo ,  Akira Ito

IPC分类号： H01C7/02 ,  H01C17/065 ,  B32B15/08 ,  B29C65/00 ,  B30B11/00 ,  H01C7/00

CPC分类号： H01C7/027 ,  H01C17/06573 ,  Y10T428/31678 ,  Y10T428/31692 ,  Y10T428/31855

摘要： A PTC element comprising a conductive sheet of a crystalline polyolefin matrix and a conductive filler, having provided on both sides thereof an electrode of a metallic foil, the PTC element having a resistivity at 20.degree. C. (.rho..sub.20) of not more than 1.8 .OMEGA..multidot.cm, a peak resistivity (.rho..sub.p) of not less than 2.0.times.10.sup.6 .OMEGA..multidot.cm, and a temperature difference �T.sub.a (0.degree.C.)-T.sub.b (.degree.C.)! of not greater than 10.degree. C., wherein T.sub.a (.degree.C.) is a temperature at which the resistivity is 10.sup.6 times the resistivity at 20.degree. C. (.rho..sub.20) and T.sub.b (.degree.C.) is a temperature at which the resistivity is 10 times the resistivity at 20.degree. C. (.rho..sub.20). The PTC element is produced by a process comprising mixing a crystalline polyolefin and a conductive filler, molding the mixture into a conductive sheet, press bonding under heat a metallic foil to both sides of the conductive sheet, and repeatedly subjecting the conductive sheet to a heating and cooling cycle consisting of heating at a temperature of not lower than (the melting point of the crystalline polyolefin minus 5.degree. C.) and then cooling to a temperature lower than (the melting point of the crystalline polyolefin minus 5.degree. C.). The PTC elements exhibit an extremely low resistivity at 20.degree. C. and a high resistivity at a peak temperature, showing a very steep increase in resistance in a narrow temperature range.

摘要翻译： 一种PTC元件，包括结晶聚烯烃基质和导电填料的导电片，其两侧均设有金属箔的电极，PTC元件的电阻率在20℃（rho 20）不大于1.8 OMEGA xcm，峰值电阻率（rho p）不小于2.0×10 6欧姆×xcm，温度差[Ta（0℃）-Tb（℃）]为10℃以下，其中Ta （℃）是电阻率为20℃时电阻率的106倍的温度（rho 20），Tb（℃）是电阻率为20℃电阻率10倍的温度。 （rho 20）。 PTC元件通过包括混合结晶聚烯烃和导电填料的方法制备，将该混合物成型为导电片，在导热片的两侧将金属箔加热压接，并重复地对导电片进行加热 和冷却循环由不低于（结晶聚烯烃的熔点减去5℃）的温度加热，然后冷却到低于（结晶聚烯烃的熔点减去5℃）的温度。 PTC元件在20℃下表现出非常低的电阻率，在峰值温度下表现出高电阻率，表现出在窄温度范围内电阻非常陡峭的增加。

公开(公告)号：US20070104878A1

公开(公告)日：2007-05-10

申请号：US11642706

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： B05D3/02

CPC分类号： H05K1/167 ,  B33Y10/00 ,  B33Y80/00 ,  C09D11/30 ,  H01C17/06506 ,  H01C17/06533 ,  H01C17/06573 ,  H01L21/288 ,  H01L21/31691 ,  H05K1/0346 ,  H05K1/097 ,  H05K1/162 ,  H05K3/105 ,  H05K3/125 ,  H05K2203/013 ,  H05K2203/1142 ,  H05K2203/121 ,  H05K2203/125

摘要： Precursor compositions for the fabrication of electronic features such as resistors and capacitors. The precursor compositions are formulated to have a low conversion temperature, such as not greater than about 350° C., thereby enabling the fabrication of such electronic features on a variety of substrates, including organic substrates such as polymer substrates.

摘要翻译： 用于制造诸如电阻器和电容器的电子特征的前体组合物。 将前体组合物配制成具有低转化温度，例如不大于约350℃，从而使得能够在各种基材上制造这样的电子特征，包括有机基底如聚合物基底。

公开(公告)号：US20070104877A1

公开(公告)日：2007-05-10

申请号：US11642705

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： B05D3/02

CPC分类号： H05K1/167 ,  B33Y10/00 ,  B33Y80/00 ,  C09D11/30 ,  H01C17/06506 ,  H01C17/06533 ,  H01C17/06573 ,  H01L21/288 ,  H01L21/31691 ,  H05K1/0346 ,  H05K1/097 ,  H05K1/162 ,  H05K3/105 ,  H05K3/125 ,  H05K2203/013 ,  H05K2203/1142 ,  H05K2203/121 ,  H05K2203/125

摘要： Precursor compositions for the fabrication of electronic features such as resistors and capacitors. The precursor compositions are formulated to have a low conversion temperature, such as not greater than about 350° C., thereby enabling the fabrication of such electronic features on a variety of substrates, including organic substrates such as polymer substrates.