公开(公告)号：US20140077923A1

公开(公告)日：2014-03-20

申请号：US14034092

申请日：2013-09-23

Applicant: Bourns, Inc.

Inventor： Gordon L. Bourns ,  Stelar Chu ,  Daniel E. Grindell ,  David Huang ,  John Kelly ,  Erik Meijer

IPC: H01C1/14 ,  H01C17/02

CPC classification number: H01C7/021 ,  H01C1/016 ,  H01C1/1406 ,  H01C1/1413 ,  H01C7/005 ,  H01C7/028 ,  H01C7/041 ,  H01C7/049 ,  H01C7/18 ,  H01C17/02 ,  H01C17/281 ,  Y10T29/49165

Abstract: Surface-mountable conductive polymer devices include a conductive polymer layer between first and second electrodes, on which are disposed first and second insulation layers, respectively. First and second planar conductive terminals are on the second insulation layer. A first cross-conductor connects the second electrode to the first terminal, and is separated from the first electrode by a portion of the first insulation layer. A second cross-conductor connects the first electrode to the second terminal, and is separated from the second electrode by a portion of the second insulation layer. In some embodiments, at least one cross-conductor includes a beveled portion through the first insulation layer to provide enhanced adhesion between the cross-conductor and the first insulation layer, while allowing greater thermal expansion without undue stress. In other embodiments, these advantages are achieved by having at least one cross-conductor in physical contact with a metallized anchor pad on the first insulation layer.

Abstract translation: 可表面安装的导电聚合物器件包括在第一和第二电极之间的导电聚合物层，其上分别设置有第一和第二绝缘层。 第一和第二平面导电端子在第二绝缘层上。 第一交叉导体将第二电极连接到第一端子，并且通过第一绝缘层的一部分与第一电极分离。 第二交叉导体将第一电极连接到第二端子，并且通过第二绝缘层的一部分与第二电极分离。 在一些实施例中，至少一个交叉导体包括穿过第一绝缘层的倾斜部分，以在交叉导体和第一绝缘层之间提供增强的粘附，同时允许更大的热膨胀而没有过度的应力。 在其它实施例中，这些优点通过使至少一个交叉导体与第一绝缘层上的金属化锚垫物理接触来实现。

公开(公告)号：US20110175700A1

公开(公告)日：2011-07-21

申请号：US12294675

申请日：2007-04-16

Applicant: Gordon L. Bourns ,  Stelar Chu ,  Daniel E. Grindell ,  David Huang ,  John Kelly ,  Eric Meijer

Inventor： Gordon L. Bourns ,  Stelar Chu ,  Daniel E. Grindell ,  David Huang ,  John Kelly ,  Eric Meijer

IPC: H01C7/13 ,  H05K3/10

CPC classification number: H01C7/021 ,  H01C1/016 ,  H01C1/1406 ,  H01C1/1413 ,  H01C7/005 ,  H01C7/028 ,  H01C7/041 ,  H01C7/049 ,  H01C7/18 ,  H01C17/02 ,  H01C17/281 ,  Y10T29/49165

Abstract: Surface-mountable conductive polymer electronic devices include at least one conductive polymer active layer laminated between upper and lower electrodes. Upper and lower insulation layers, respectively, sandwich the upper and lower electrodes. First and second planar conductive terminals are formed on the lower insulation layer. First and second cross-conductors are provided by plated through-hole vias, whereby the cross-conductors connect each of the electrodes to one of the terminals. Certain embodiments include two or more active layers, arranged in a vertically-stacked configuration and electrically connected by the cross-conductors and electrodes in parallel. Several embodiments include at least one cross-conductor having a chamfered or beveled entry hole through the upper insulation layer to provide enhanced adhesion between the cross-conductor and the insulation layer. Several methods for manufacturing the present surface-mountable conductive polymer electronic devices are also provided.

Abstract translation: 表面安装导电聚合物电子器件包括层压在上电极和下电极之间的至少一个导电聚合物有源层。 上下绝缘层分别夹着上下电极。 第一和第二平面导电端子形成在下绝缘层上。 第一和第二导体由电镀通孔通孔提供，由此将导体将每个电极连接到其中一个端子。 某些实施方案包括两个或更多个有源层，其被布置成垂直堆叠的构造并且由交叉导体和电极并联电连接。 几个实施例包括至少一个具有通过上绝缘层的倒角或斜面进入孔的交叉导体，以在交叉导体和绝缘层之间提供增强的粘合。 还提供了用于制造本表面安装导电聚合物电子器件的几种方法。

公开(公告)号：US07575778B2

公开(公告)日：2009-08-18

申请号：US10913869

申请日：2004-08-07

Applicant: Te-Yeu Su ,  Hsin-Herng Wang ,  Ying-Ti Chu ,  Chin-Ming Chu ,  Li-Chung Ping

Inventor： Te-Yeu Su ,  Hsin-Herng Wang ,  Ying-Ti Chu ,  Chin-Ming Chu ,  Li-Chung Ping

IPC: B05D5/12 ,  B05D3/12

CPC classification number: H01C7/005 ,  H01C17/06593 ,  H05K1/095 ,  H05K1/167 ,  H05K3/1233 ,  H05K2203/1453

Abstract: The present invention teaches formulations, apparatus and a method of applying high thixotropic index polymer thick-film resistive pastes for making polymer thick-film resistors with improved tolerances by providing a squeegee with a blade tilted at an angle of 10° to 85° to the surface of the printed circuit board thus causing a fluid rotational motion within the bead of the polymer thick-film resistive paste as the squeegee blade moves relative to the printed circuit board. This rotational motion increases the shear strain rate experienced by the paste within the bead and results in a more effective filling of the resistor-shaped cavity without including air bubbles, experiencing elastic recovery of the paste and, without surface fractures of the paste.

Abstract translation: 本发明教导了施加高触变性折射率聚合物厚膜电阻浆料以制备具有改进的公差的聚合物厚膜电阻器的配方，设备和方法，其中提供了刮刀，其具有与10°至85°的角度倾斜 因此当刮板相对于印刷电路板移动时，印刷电路板的表面因此导致聚合物厚膜电阻浆料的珠粒内的流体旋转运动。 该旋转运动增加了焊道内的焊膏所经历的剪切应变速率，并且导致电阻器形状的空腔的更有效的填充，而不包括气泡，经历糊状物的弹性恢复，并且没有粘合剂的表面裂缝。

公开(公告)号：US07417194B2

公开(公告)日：2008-08-26

申请号：US10875372

申请日：2004-06-24

Applicant: Karen P. Shrier

Inventor： Karen P. Shrier

IPC: H05K1/00

CPC classification number: H01R13/6485 ,  H01C7/005 ,  H01C17/06586 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/0052 ,  H05K2201/0738 ,  Y10T29/49107 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49195 ,  Y10T29/49222

Abstract: Devices capable of protecting electronic components during the occurrence of a disturbance event using printed circuit board manufacturing techniques. A three (3) layer structure is formed comprising a polymer-based formulation sandwiched between two electrode layers. The devices can be manufactured in panel form providing high quantities of devices which can be removed from the panel and applied directly to the component to be protected. Desired patterns can be formed on either one of the electrode layers by photo-etch techniques thereby providing a process that can be tailored to a large number of applications.

Abstract translation: 在使用印刷电路板制造技术的干扰事件发生期间能够保护电子部件的装置。 形成三（3）层结构，其包含夹在两个电极层之间的聚合物基配方。 这些装置可以以面板形式制造，提供大量的装置，其可以从面板上移除并直接施加到待保护的部件上。 期望的图案可以通过光蚀刻技术形成在任一个电极层上，从而提供可以针对大量应用而定制的工艺。

公开(公告)号：US20080185561A1

公开(公告)日：2008-08-07

申请号：US11985950

申请日：2007-11-19

Applicant: John D. Summers

Inventor： John D. Summers

IPC: H01B1/12 ,  C08G59/24

CPC classification number: H01B1/22 ,  C08G59/245 ,  C08L63/00 ,  C08L79/08 ,  H01C7/005 ,  H01C17/06586 ,  H05K1/095 ,  H05K1/167 ,  H05K2201/0154 ,  C08L2666/22

Abstract: Resistor compositions are disclosed, made from polymer thick film resistor formulations comprising a polyimide component, a sterically hindered hydrophobic epoxy component and a solvent component having a Hanson polar solubility parameter between 2.1 and 3.0 and having a normal boiling point between 210 and 260° C. The weight ratio of polyimide component (“A”) to epoxy component (“B”) is A:B, where A is between and including 1 to 15 and where B is 1.

Abstract translation: 公开了由包含聚酰亚胺组分，空间位阻疏水环氧组分和具有2.1至3.0之间的汉森极性溶解度参数并且具有210-260℃的标准沸点的溶剂组分的聚合物厚膜电阻器制剂制成的电阻器组合物。 聚酰亚胺成分（“A”）与环氧成分（“B”）的重量比为A：B，其中A在1〜15之间，B为1。

公开(公告)号：US20060270098A1

公开(公告)日：2006-11-30

申请号：US11499364

申请日：2006-08-04

Applicant: Lawrence Clevenger ,  Louis Hsu ,  Carl Radens ,  Li-Kong Wang ,  Kwong Wong

Inventor： Lawrence Clevenger ,  Louis Hsu ,  Carl Radens ,  Li-Kong Wang ,  Kwong Wong

IPC: H01L21/00 ,  H01L21/20 ,  H01L21/30

CPC classification number: H01C7/005 ,  H01C7/006 ,  H01C17/075 ,  H01G4/18 ,  H01G4/33 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/5228 ,  H01L23/5328 ,  H01L27/0688 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method and structure for an integrated circuit chip has a logic core which includes a plurality of insulating and conducting levels, an exterior conductor level and passive devices having a conductive polymer directly connected to the exterior conductor level. The passive devices contain RF devices which also includes resistor, capacitor, and/or inductor. The resistors can be serpentine resistors and the capacitors can be interdigitated capacitors.

公开(公告)号：US07112502B2

公开(公告)日：2006-09-26

申请号：US10828374

申请日：2004-04-20

Applicant: Lawrence A. Clevenger ,  Louis L. Hsu ,  Carl J. Radens ,  Li-Kong Wang ,  Kwong Hon Wong

Inventor： Lawrence A. Clevenger ,  Louis L. Hsu ,  Carl J. Radens ,  Li-Kong Wang ,  Kwong Hon Wong

IPC: H01L21/20

CPC classification number: H01C7/005 ,  H01C7/006 ,  H01C17/075 ,  H01G4/18 ,  H01G4/33 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/5228 ,  H01L23/5328 ,  H01L27/0688 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method and structure for an integrated circuit chip has a logic core which includes a plurality of insulating and conducting levels, an exterior conductor level and passive devices having a conductive polymer directly connected to the exterior conductor level. The passive devices contain RF devices which also includes resistor, capacitor, and/or inductor. The resistors can be serpentine resistors and the capacitors can be interdigitated capacitors.

公开(公告)号：US07006344B2

公开(公告)日：2006-02-28

申请号：US10332548

申请日：2001-07-23

Applicant: Noriyasu Echigo ,  Kazuyoshi Honda ,  Yoshiaki Kai ,  Masaru Odagiri ,  Hisaaki Tachihara ,  Hideki Matsuda ,  Jun Katsube ,  Kazuo Iwaoka ,  Takanori Sugimoto ,  Nobuki Sunagare

Inventor： Noriyasu Echigo ,  Kazuyoshi Honda ,  Yoshiaki Kai ,  Masaru Odagiri ,  Hisaaki Tachihara ,  Hideki Matsuda ,  Jun Katsube ,  Kazuo Iwaoka ,  Takanori Sugimoto ,  Nobuki Sunagare

IPC: H01G4/14

CPC classification number: H01C7/005 ,  C07C323/12 ,  C08F22/24 ,  H01B3/301 ,  H01B3/442 ,  H01C17/06586 ,  H01G4/18

Abstract: The present invention provides a bis(4-mercaptophenyl) sulfide derivative represented by general formula 1. This derivative is a monomer that can form a dielectric film suitable for an electronic component. The present invention further provides a method for producing this derivative and an electronic component having high characteristics under excellent humidity and high temperature.

Abstract translation: 本发明提供由通式1表示的双（4-巯基苯基）硫化物衍生物。该衍生物是可以形成适用于电子部件的电介质膜的单体。 本发明还提供了一种制备该衍生物的方法和在优异的湿度和高温下具有高特性的电子元件。

公开(公告)号：US06958522B2

公开(公告)日：2005-10-25

申请号：US09897891

申请日：2001-07-05

Applicant: Lawrence A. Clevenger ,  Louis L. Hsu ,  Carl J. Radens ,  Li-Kong Wang ,  Kwong Hon Wong

Inventor： Lawrence A. Clevenger ,  Louis L. Hsu ,  Carl J. Radens ,  Li-Kong Wang ,  Kwong Hon Wong

IPC: H01L27/06 ,  H01L29/00 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

CPC classification number: H01C7/005 ,  H01C7/006 ,  H01C17/075 ,  H01G4/18 ,  H01G4/33 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/5228 ,  H01L23/5328 ,  H01L27/0688 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method and structure for an integrated circuit chip has a logic core which includes a plurality of insulating and conducting levels, an exterior conductor level and passive devices having a conductive polymer directly connected to the exterior conductor level. The passive devices contain RF devices which also includes resistor, capacitor, and/or inductor. The resistors can be serpentine resistors and the capacitors can be interdigitated capacitors.

Abstract translation: 集成电路芯片的方法和结构具有包括多个绝缘和导电水平的逻辑芯，外部导体水平和具有直接连接到外部导体水平的导电聚合物的无源器件。 无源器件包含还包括电阻器，电容器和/或电感器的RF器件。 电阻器可以是蛇形电阻器，电容器可以是交错电容器。

公开(公告)号：US20050001287A1

公开(公告)日：2005-01-06

申请号：US10883913

申请日：2004-07-01

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: H01C7/00 ,  H01C17/065 ,  H01L21/20 ,  H01L29/00

CPC classification number: H01C7/005 ,  H01C17/0652 ,  H01C17/06526 ,  H01C17/06586

Abstract: Resistor devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The conductive materials comprise between about 20% and about 50% of the total weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract translation: 电阻器件由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电材料占导电负载树脂基材料总重量的约20％至约50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。