公开(公告)号：US20110024275A1

公开(公告)日：2011-02-03

申请号：US12807446

申请日：2010-09-07

申请人： Thomas Aisenbrey

发明人： Thomas Aisenbrey

IPC分类号： H01H1/02

CPC分类号： H05K3/101 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01Q1/1271 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

摘要： Key actuators and other switching devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based key actuators and other switching devices can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the key actuators and other switching devices can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.

摘要翻译： 主要致动器和其他开关装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。 可以使用诸如注射成型压缩成型或挤出的方法来形成导电负载的树脂基键致动器和其他开关装置。 用于形成关键致动器和其它开关装置的导电负载树脂基材料也可以是易于切割成所需形状的薄柔性机织织物的形式。

公开(公告)号：US07829006B2

公开(公告)日：2010-11-09

申请号：US11143426

申请日：2005-06-02

申请人： Thomas Aisenbrey

发明人： Thomas Aisenbrey

IPC分类号： B29C45/00 ,  B29C70/58

CPC分类号： F16H57/032 ,  B29C45/0001 ,  B29C45/0013 ,  B29C47/00 ,  B29C47/0016 ,  B29C47/0021 ,  B29C67/24 ,  B29K2995/0005 ,  B29K2995/0013 ,  B29L2031/3055 ,  B29L2031/3456 ,  F16H57/031 ,  G06K19/07749 ,  H01Q1/1271 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T74/2186 ,  Y10T74/2188

摘要： Automotive housings are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

摘要翻译： 汽车外壳由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末是金属或导电非金属或非金属镀金属。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。

公开(公告)号：US07549521B2

公开(公告)日：2009-06-23

申请号：US11284005

申请日：2005-11-21

申请人： Thomas Aisenbrey

发明人： Thomas Aisenbrey

IPC分类号： B60M1/00

CPC分类号： H01H1/029 ,  B29C45/0013 ,  H01B1/22 ,  H01B1/24 ,  H01H1/027 ,  H01H1/065 ,  H01H1/38

摘要： Electrical connectivity devices for railway systems are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

摘要翻译： 用于铁路系统的电气连接装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末是金属或导电非金属或非金属镀金属。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。

公开(公告)号：US20080036241A1

公开(公告)日：2008-02-14

申请号：US11227849

申请日：2005-09-15

申请人： Thomas Aisenbrey

发明人： Thomas Aisenbrey

IPC分类号： B60J7/00

CPC分类号： B62D29/00 ,  H01B1/22

摘要： Vehicle body, chassis, and braking components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

摘要翻译： 车体，底盘和制动部件由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末是金属或导电非金属或非金属镀金属。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。

公开(公告)号：US20070204459A1

公开(公告)日：2007-09-06

申请号：US11800131

申请日：2007-05-04

申请人： Thomas Aisenbrey

发明人： Thomas Aisenbrey

IPC分类号： H01R43/02

CPC分类号： H01R13/03 ,  C09K5/14 ,  H01R43/24 ,  Y10T29/4902 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49153 ,  Y10T29/49171 ,  Y10T29/49174

摘要： Electrical interfaces formed into a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

公开(公告)号：US20070023272A1

公开(公告)日：2007-02-01

申请号：US11541187

申请日：2006-09-29

申请人： Thomas Aisenbrey

发明人： Thomas Aisenbrey

IPC分类号： H01H1/02

CPC分类号： H01H13/702 ,  H01H13/785 ,  H01H19/58 ,  H01H23/12 ,  H01H2011/0081 ,  H01H2201/032 ,  H01H2203/0085 ,  H01H2203/01 ,  H01H2209/078 ,  H01H2215/006 ,  H01H2215/008 ,  H01H2221/01 ,  H01H2221/012 ,  H01H2221/018 ,  H01H2239/006 ,  Y10T428/249958 ,  Y10T428/31681

摘要： Key actuators and other switching devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based key actuators and other switching devices can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the key actuators and other switching devices can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.

摘要翻译： 主要致动器和其他开关装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。 可以使用诸如注射成型压缩成型或挤出的方法来形成导电负载的树脂基键致动器和其他开关装置。 用于形成关键致动器和其它开关装置的导电负载树脂基材料也可以是易于切割成所需形状的薄柔性机织织物的形式。

公开(公告)号：US20060289189A1

公开(公告)日：2006-12-28

申请号：US11447774

申请日：2006-06-05

申请人： Thomas Aisenbrey

发明人： Thomas Aisenbrey

IPC分类号： H01B11/06

CPC分类号： H05B3/56 ,  H05B3/12

摘要： A resin-coated, micron conductive fiber wiring material, a method of fabricating, and applications are achieved. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

摘要翻译： 实现了树脂涂覆的微米导电纤维布线材料，制造方法和应用。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。

公开(公告)号：US20060174753A1

公开(公告)日：2006-08-10

申请号：US11378061

申请日：2006-03-17

申请人： Thomas Aisenbrey

发明人： Thomas Aisenbrey

IPC分类号： G10H1/00

CPC分类号： G10H3/143 ,  G10H1/32

摘要： Musical instruments are formed of a conductively doped resin-based material. The conductively doped resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductively doped resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

摘要翻译： 乐器由导电掺杂的树脂基材料形成。 导电掺杂的树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电掺杂树脂基材料重量的约20％至50％。 微米导电粉末是金属或导电非金属或非金属镀金属。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。

公开(公告)号：US20060138646A1

公开(公告)日：2006-06-29

申请号：US11346051

申请日：2006-02-02

申请人： Thomas Aisenbrey

发明人： Thomas Aisenbrey

IPC分类号： H01L23/34

CPC分类号： H01F7/1607 ,  H01B1/22 ,  H01F7/128 ,  H01F17/06 ,  H01H1/029 ,  H01H50/16 ,  H01H2050/166 ,  H01L2924/0002 ,  H01L2924/00

摘要： Electromechanical devices are formed of a conductively doped resin-based material. The conductively doped resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductively doped resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

摘要翻译： 机电装置由导电掺杂的树脂基材料形成。 导电掺杂的树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电掺杂树脂基材料重量的约20％至50％。 微米导电粉末是金属或导电非金属或非金属镀金属。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。

公开(公告)号：US20060128895A1

公开(公告)日：2006-06-15

申请号：US11335363

申请日：2006-01-19

申请人： Thomas Aisenbrey

发明人： Thomas Aisenbrey

IPC分类号： C08G73/02

CPC分类号： H05K9/009 ,  H01B1/24 ,  H01Q17/002 ,  Y10T428/31551

摘要： A method to generate a thermoset wet mix material is achieved. The method comprises providing a thermosetting resin-based material. A bundle of micron conductive fiber strands is chopped. The chopped micron conductive fiber is added to the thermosetting resin-based material. The chopped fiber strands and thermosetting resin-based material are substantially homogeneously mixed to form a thermoset wet mix material. A method to form articles from such a thermoset wet mix material is also achieved.

摘要翻译： 实现了产生热固性湿混合材料的方法。 该方法包括提供基于热固性树脂的材料。 一束微米导电纤维股线被切碎。 将切碎的微米导电纤维加入到热固性树脂基材料中。 短切的纤维束和基于热固性树脂的材料基本均匀地混合以形成热固性湿混合材料。 还可以实现从这种热固性湿混合材料形成制品的方法。