Invention Application
- Patent Title: Low viscosity precursor compositions and methods for the deposition of conductive electronic features
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Application No.: US11642664Application Date: 2006-12-21
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Publication No.: US20080108218A1Publication Date: 2008-05-08
- Inventor: Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
- Applicant: Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
- Applicant Address: US MA Boston
- Assignee: Cabot Corporation
- Current Assignee: Cabot Corporation
- Current Assignee Address: US MA Boston
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
Public/Granted literature
- US07691664B2 Low viscosity precursor compositions and methods for the deposition of conductive electronic features Public/Granted day:2010-04-06
Information query
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