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公开(公告)号：US20210235586A1
公开(公告)日：2021-07-29
申请号：US16948657
申请日：2019-03-27
发明人： Teresa M. Goeddel , Ankit Mahajan , Mikhail L. Pekurovsky , Thomas J. Metzler , Saagar A. Shah , Kara A. Meyers , Jonathan W. Kemling , Jeremy K. Larsen
摘要： Processes of making an electrical jumper (120) for electrical devices are provided. A micro-replication stamp (300) is used to press a layer of curable material (124) on a circuit substrate (102) to make patterned features. A conductive liquid (230) is disposed into the patterned features to make electrically conductive traces (126) that pass over a circuitry (110) and connect electrical contacts (122A, 122B). In some cases, the stamp (300) has a standoff (310).
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公开(公告)号：US11894164B2
公开(公告)日：2024-02-06
申请号：US16948540
申请日：2020-09-23
发明人： Ankit Mahajan , James Zhu , Saagar A. Shah , Mikhail L. Pekurovsky , Vivek Krishnan , Kevin T. Reddy , Christopher B. Walker, Jr. , Michael A. Kropp , Kara A. Meyers , Teresa M. Goeddel , Thomas J. Metzler , Jonathan W. Kemling , Roger W. Barton
IPC分类号： H05K1/02 , H01B7/06 , H01B7/02 , H01B13/00 , H01B13/008
CPC分类号： H01B7/06 , H01B7/0225 , H01B13/008 , H01B13/0013 , H05K1/0283 , Y10T29/49162
摘要： A stretchable conductor includes a substrate with a first major surface, wherein the substrate is an elastomeric material. An elongate wire is on the first major surface of the substrate; the wire includes a first end and a second end, and further includes at least one arcuate region between the first end and the second end. At least one portion of the arcuate region of the wire in the region has a first surface area portion embedded in the surface of the substrate and a second surface area portion unembedded on the substrate and exposed in an amount sufficient to render at least an area of the substrate in the region electrically conductive. The unembedded second surface portion of the arcuate region may lie above or below a plane of the substrate. Composite articles including a stretchable conductor in durable electrical contact with a conductive fabric are also disclosed.
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公开(公告)号：US20220189790A1
公开(公告)日：2022-06-16
申请号：US17594346
申请日：2020-04-14
发明人： Ankit Mahajan , Saagar A. Shah , Mikhail L. Pekurovsky , Kayla C. Niccum , Kara A. Meyers , Matthew R.D. Smith , Gino L. Pitera , Graham M. Clarke , Jeremy K. Larsen , Teresa M. Goeddel
摘要： A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.
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公开(公告)号：US20200105440A1
公开(公告)日：2020-04-02
申请号：US16621021
申请日：2018-06-07
发明人： Ankit Mahajan, Jr. , James Zhu , Saagar A. Shah , Mikhail L. Pekurovsky , Vivek Krishnan , Kevin T. Reddy , Christopher B. Walker, Jr. , Michael A. Kropp , Kara A. Meyers , Teresa M. Goeddel , Thomas J. Metzler , Jonathan W. Kemling , Roger W. Barton
IPC分类号： H01B7/06 , H01B7/02 , H01B13/00 , H01B13/008
摘要： A stretchable conductor includes a substrate with a first major surface and an elongate wire, wherein the substrate is an elastomeric material, the elongate wire is on the first major surface of the substrate, the wire includes a first end and a second end, and further includes at least one arcuate region between the first end and the second end. At least one portion of the arcuate region of the wire in the region has a first surface area portion embedded in the surface of the substrate and a second surface area portion unembedded on the substrate and exposed in an amount sufficient to render at least an area of the substrate in the region electrically conductive. The unembedded second surface portion of the arcuate region may lie above or below a plane of the substrate. Additionally, different methods of preparing said stretchable conductor are disclosed. Composite articles including said stretchable conductor in durable electrical contact with a conductive fabric are also disclosed.
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公开(公告)号：US20210280337A1
公开(公告)日：2021-09-09
申请号：US16948540
申请日：2020-09-23
发明人： Ankit Mahajan , James Zhu , Saagar A. Shah , Mikhail L. Pekurovsky , Vivek Krishnan , Kevin T. Reddy , Christopher B. Walker, JR. , Michael A. Kropp , Kara A. Meyers , Teresa M. Goeddel , Thomas J. Metzler , Jonathan W. Kemling , Roger W. Barton
IPC分类号： H01B7/06 , H01B7/02 , H01B13/00 , H01B13/008
摘要： A stretchable conductor includes a substrate with a first major surface, wherein the substrate is an elastomeric material. An elongate wire is on the first major surface of the substrate; the wire includes a first end and a second end, and further includes at least one arcuate region between the first end and the second end. At least one portion of the arcuate region of the wire in the region has a first surface area portion embedded in the surface of the substrate and a second surface area portion unembedded on the substrate and exposed in an amount sufficient to render at least an area of the substrate in the region electrically conductive. The unembedded second surface portion of the arcuate region may lie above or below a plane of the substrate. Composite articles including a stretchable conductor in durable electrical contact with a conductive fabric are also disclosed.
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公开(公告)号：US10971468B2
公开(公告)日：2021-04-06
申请号：US16461015
申请日：2017-11-16
发明人： Ankit Mahajan , Mikhail L. Pekurovsky , Matthew S. Stay , Daniel J. Theis , Ann M. Gilman , Shawn C. Dodds , Thomas J. Metzler , Matthew R. D. Smith , Roger W. Barton , Joseph E. Hernandez , Saagar A. Shah , Kara A. Meyers , James Zhu , Teresa M. Goeddel , Lyudmila A. Pekurovsky , Jonathan W. Kemling , Jeremy K. Larsen , Jessica Chiu , Kayla C. Niccum
IPC分类号： H01L23/00 , H01L23/498 , B81C3/00 , H01L23/544
摘要： Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.
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公开(公告)号：US10854355B2
公开(公告)日：2020-12-01
申请号：US16621021
申请日：2018-06-07
发明人： Ankit Mahajan, Jr. , James Zhu , Saagar A. Shah , Mikhail L. Pekurovsky , Vivek Krishnan , Kevin T. Reddy , Christopher B. Walker, Jr. , Michael A. Kropp , Kara A. Meyers , Teresa M. Goeddel , Thomas J. Metzler , Jonathan W. Kemling , Roger W. Barton
IPC分类号： H01K3/10 , H01B7/06 , H01B7/02 , H01B13/00 , H01B13/008
摘要： A stretchable conductor includes a substrate with a first major surface and an elongate wire, wherein the substrate is an elastomeric material, the elongate wire is on the first major surface of the substrate, the wire includes a first end and a second end, and further includes at least one arcuate region between the first end and the second end. At least one portion of the arcuate region of the wire in the region has a first surface area portion embedded in the surface of the substrate and a second surface area portion unembedded on the substrate and exposed in an amount sufficient to render at least an area of the substrate in the region electrically conductive. The unembedded second surface portion of the arcuate region may lie above or below a plane of the substrate. Additionally, different methods of preparing said stretchable conductor are disclosed. Composite articles including said stretchable conductor in durable electrical contact with a conductive fabric are also disclosed.
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公开(公告)号：US20240282592A1
公开(公告)日：2024-08-22
申请号：US18652529
申请日：2024-05-01
发明人： Ankit Mahajan , Saagar A. Shah , Mikhail L. Pekurovsky , Kayla C. Niccum , Kara A. Meyers , Matthew R.D. Smith , Gino L. Pitera , Graham M. Clarke , Jeremy K. Larsen , Teresa M. Goeddel
CPC分类号： H01L21/56 , H01L23/293 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L2224/03312 , H01L2224/0332 , H01L2224/03505 , H01L2224/03515 , H01L2224/04105 , H01L2224/05567
摘要： A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.
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公开(公告)号：US20210035875A1
公开(公告)日：2021-02-04
申请号：US16976126
申请日：2019-02-27
发明人： Ankit Mahajan , Mikhail L. Pekurovsky , Saagar A. Shah , Thomas J. Metzler , Kara A. Meyers , James Zhu , Teresa M. Goeddel , Lyudmila A. Pekurovsky , Jonathan W. Kemling , Jeremy K. Larsen
IPC分类号： H01L23/16 , H01L23/31 , H01L23/544 , H01L23/498 , H01L21/56 , H01L21/54
摘要： Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed at a registration area of a substrate. Fluid channels extend into the registration area and have a portion underneath the bottom surface of the solid circuit die. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward contact pads on the bottom surface of the circuit die to obtain the automatic registration.
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公开(公告)号：US20190273061A1
公开(公告)日：2019-09-05
申请号：US16461015
申请日：2017-11-16
发明人： Ankit Mahajan , Mikhail L. Pekurovsky , Matthew S. Stay , Daniel J. Theis , Ann M. Gillman , Shawn C. Dodds , Thomas J. Metzler , Matthew R.D. Smith , Roger W. Barton , Joseph E. Hernandez , Saagar A. Shah , Kara A. Meyers , James Zhu , Teresa M. Goeddel , Lyudmila A. Pekurovsky , Jonathan W. Kemling , Jeremy K. Larsen , Jessica Chiu , Kayla C. Niccum
IPC分类号： H01L23/00
摘要： Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.
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